Patents by Inventor Chih-Yung Lin

Chih-Yung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT EMITTING DIODE LIGHT BAR
    Publication number: 20120020089
    Abstract: An LED light bar includes an elongated circuit board, a first lighting module formed in the middle of the circuit board and two second light modules formed at two opposite ends of the circuit board. Each of first lighting module and the two second lighting module includes a plurality of LEDs arranged linearly on a surface of the circuit board. A density of the LEDs in the first lighting module is smaller than that in the second lighting modules.
    Type: Application
    Filed: March 29, 2011
    Publication date: January 26, 2012
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO
  • FLUORESCENT STRUCTURE AND METHOD FOR FORMING THE FLUORESCENT STRUCTURE AND LED PACKAGE USING THE SAME
    Publication number: 20110297981
    Abstract: A fluorescent structure for a light-emitting package includes a first fluorescent layer and a second fluorescent layer covering the first fluorescent layer. The first fluorescent layer includes first fluorescent strips, and defines first transparent regions between the first fluorescent strips. The second fluorescent layer includes second fluorescent strips, and defines second transparent regions between the second fluorescent strips. A method for forming the fluorescent structure and a light-emitting diode package using the fluorescent structure are also provided.
    Type: Application
    Filed: January 9, 2011
    Publication date: December 8, 2011
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHI-WEI LIAO, WEN-LIANG TSENG, CHIH-YUNG LIN, MIN-TSUN HSIEH, CHING-LIEN YEH
  • LIGHT EMITTING DIODE PACKAGE
    Publication number: 20110291135
    Abstract: A light emitting diode package includes a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity, a light emitting diode chip fixed on a bottom of the cavity, and a glass lens secured to the silicon substrate and covering the light emitting diode chip.
    Type: Application
    Filed: March 2, 2011
    Publication date: December 1, 2011
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN
  • Method of Three-Dimensional Image Data Processing
    Publication number: 20110292047
    Abstract: The present invention relates to the field of data processing, and particularly to a software system and associated method for 3D image processing. The invention is to transform 3D images into space codes, and further align code-associated 3D images with known data within a target database.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Hsiu-Ming Chang, Ann-Shyn Chiang, Chao-Chun Chuang, Chang-Huain Hsieh, Chih-Yung Lin
  • LIGHT-EMITTING ELEMENT PACKAGE AND FABRICATION METHOD THEREOF
    Publication number: 20110291138
    Abstract: A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.
    Type: Application
    Filed: May 23, 2011
    Publication date: December 1, 2011
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO
  • LIGHT EMITTING DIODE PACKAGE
    Publication number: 20110278601
    Abstract: An LED package includes a silicon base, an LED and a glass encapsulant. The silicon base has a first surface and a second surface opposite to the first surface. The LED chip is located on the first surface of the silicon base. The glass encapsulant covers the LED chip. The glass encapsulant and the silicon base define a receiving space therebetween to receive the LED chip. The glass encapsulant is fixedly engaged with the first surface of the silicon base, so the glass encapsulant and the silicon base enclose the LED chip.
    Type: Application
    Filed: December 28, 2010
    Publication date: November 17, 2011
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN
  • LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20110266570
    Abstract: In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.
    Type: Application
    Filed: December 17, 2010
    Publication date: November 3, 2011
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN, CHING-LIEN YEH, CHI-WEI LIAO, JIAN-SHIHN TSANG
  • LED PACKAGE
    Publication number: 20110266574
    Abstract: An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the substrate. The encapsulating layer includes a light dispersing element. A light scattering intensity of the light dispersing element is proportional to the light intensity of light generated by the LED die and illuminated at the encapsulating layer. A luminance at a center of the LED package is substantially identical to that at a circumference of the LED package.
    Type: Application
    Filed: January 17, 2011
    Publication date: November 3, 2011
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHI-WEI LIAO, WEN-LIANG TSENG, CHIH-YUNG LIN, MIN-TSUN HSIEH, CHING-LIEN YEH
  • TRAFFIC LIGHT
    Publication number: 20110261562
    Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.
    Type: Application
    Filed: October 8, 2010
    Publication date: October 27, 2011
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHI-WEI LIAO, WEN-LIANG TSENG, MIN-TSUN HSIEH, CHIH-YUNG LIN, CHING-LIEN YEH
  • SIDE EMITTING SEMICONDUCTOR PACKAGE
    Publication number: 20110206079
    Abstract: A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.
    Type: Application
    Filed: October 8, 2010
    Publication date: August 25, 2011
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN
  • TOP VIEW LIGHT EMITTING DEVICE PACKAGE AND FABRICATION METHOD THEREOF
    Publication number: 20110181182
    Abstract: A top view light emitting device package and fabrication method thereof include a bilateral circuit is provided for emitting two far light fields with no requirement for multiple devices. Moreover, the top view light emitting device package of the disclosure also provides depressions and reflectors formed on the surfaces of the silicon substrate to enhance the reflective efficiency and fix a specific light field.
    Type: Application
    Filed: October 29, 2010
    Publication date: July 28, 2011
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: MIN-TSUN HSIEH, WEN-LIANG TSENG, LUNG-HSIN CHEN, CHIH-YUNG LIN
  • WATERPROOF SMD LED MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110031513
    Abstract: A surface-mount device (SMD) light emitting diode (LED) module includes a leadframe, an LED chip, a waterproof protective film and a sealing material. The leadframe includes a plurality of leads and the LED chip is fixed on one of the leads. The waterproof protective film covers the LED chip and a portion of the leadframe, and exposes a portion of the leadframe for connecting to a circuit board. The sealing material is also formed on the leadframe to cover the LED chip. In addition, a method of manufacturing the SMD LED module is provided.
    Type: Application
    Filed: July 13, 2010
    Publication date: February 10, 2011
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: MIN-TSUN HSIEH, LUNG-HSIN CHEN, SHEN-BO LIN, CHING-LIEN YEH, CHIH-YUNG LIN
  • PRINTED CIRCUIT BOARD AND BACK LIGHT MODULE USING THE SAME
    Publication number: 20100232179
    Abstract: A back light module includes a printed circuit board and a plurality of surface mounting elements mounted on the printed circuit board. Each surface mounting element is an LED lighting element. The printed circuit board has a plurality of pads. Each of the pads includes a first bar and two second bars extending respectively from two ends of the first bar. The surface mounting element includes a plurality of pins. The pins are placed on two sides of the surface mounting element. The pins are soldered on the pads.
    Type: Application
    Filed: February 26, 2010
    Publication date: September 16, 2010
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: JIAN-SHIHN TSANG, LUNG-HSIN CHEN, CHIH-YUNG LIN
  • LED light bar
    Patent number: D640212
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: June 21, 2011
    Assignee: Advanced Optoelectric Technology, Inc.
    Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Chi-Wei Liao, Lung-Hsin Chen, Wen-Liang Tseng
  • LED light bar
    Patent number: D642545
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: August 2, 2011
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Chi-Wei Liao, Lung-Hsin Chen, Wen-Liang Tseng
  • LED light bar
    Patent number: D642994
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: August 9, 2011
    Assignee: Advanced Optoelectronic Technolgy, Inc.
    Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Chi-Wei Liao, Lung-Hsin Chen, Wen-Liang Tseng
  • LED light bar
    Patent number: D642995
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: August 9, 2011
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Chi-Wei Liao, Lung-Hsin Chen, Wen-Liang Tseng
  • LED module
    Patent number: D642998
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: August 9, 2011
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Lung-Hsin Chen, Wen-Liang Tseng
  • LED light bar
    Patent number: D644189
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: August 30, 2011
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Chi-Wei Liao, Lung-Hsin Chen, Wen-Liang Tseng
  • LED module
    Patent number: D654444
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: February 21, 2012
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chih-Yung Lin, Min-Tsun Hsieh, Ching-Lien Yeh, Lung-Hsin Chen, Wen-Liang Tseng