Abstract: The invention relates to a protective frame for a mobile communication device having a power charging port. The protective frame has a retractable frame body, including a main frame body; a sliding element for reciprocatingly sliding along a direction with respect to the main frame body between a retracted protection position where the mobile communication device is fixedly framed by the retractable frame body and a stretched auxiliary power supply position; and a fastening element for fixing the sliding element with respect to the main frame body at the retracted protection position and the stretched auxiliary power supply position. The protective frame also includes an auxiliary battery adapted for being detachably installed in the retractable frame body and electrically connected to the power charging port of the mobile communication device, when the sliding element are fixed with respect to the main frame body at the stretched auxiliary power supply position.

Abstract: The invention relates to a protective frame for a mobile communication device having a power charging port. The protective frame has a retractable frame body, including a main frame body; a sliding element for reciprocatingly sliding along a direction with respect to the main frame body between a retracted protection position where the mobile communication device is fixedly framed by the retractable frame body and a stretched auxiliary power supply position; and a fastening element for fixing the sliding element with respect to the main frame body at the retracted protection position and the stretched auxiliary power supply position. The protective frame also includes an auxiliary battery adapted for being detachably installed in the retractable frame body and electrically connected to the power charging port of the mobile communication device, when the sliding element are fixed with respect to the main frame body at the stretched auxiliary power supply position.

Abstract: A manufacturing method of a package carrier is provided. A supporting plate is provided, wherein a metal layer is already disposed on the supporting plate. A patterned dry film layer is formed on the metal layer. A portion of the metal layer is exposed by the patterned dry film layer. The patterned dry film layer is used as an electroplating mask to electroplate a surface treatment layer on the portion of the metal layer exposed by the patterned dry film layer. The patterned dry film layer is removed so as to expose the portion of the metal layer. The surface treatment layer is used as an etching mask to etch the portion of the metal layer not covered by the surface treatment layer so as to form a patterned metal layer.

Abstract: A fabricating method of a semiconductor package structure is provided. A dielectric layer having a first surface and a second surface is provided. A patterned metal layer has been formed on the first surface of the dielectric layer. An opening going through the first and the second surfaces is formed. A carrier having a third surface and a fourth surface is formed at the second surface. A portion of the third surface is exposed by the opening of the dielectric layer. A semiconductor die having a joining surface and a side-surface is joined in the opening. At least a through hole going through the third and the fourth surfaces is formed. A metal layer having at least a heat conductive post extending from the fourth surface of the carrier to the through hole and disposed in the through hole and a containing cavity is formed on the fourth surface.

Abstract: The invention relates to a protective frame for a mobile communication device having a power charging port. The protective frame has a retractable frame body, including a main frame body; a sliding element for reciprocatingly sliding along a direction with respect to the main frame body between a retracted protection position where the mobile communication device is fixedly framed by the retractable frame body and a stretched auxiliary power supply position; and a fastening element for fixing the sliding element with respect to the main frame body at the retracted protection position and the stretched auxiliary power supply position. The protective frame also includes an auxiliary battery adapted for being detachably installed in the retractable frame body and electrically connected to the power charging port of the mobile communication device, when the sliding element are fixed with respect to the main frame body at the stretched auxiliary power supply position.

Abstract: A semiconductor package structure includes a dielectric layer, a patterned metal layer, a carrier, a metal layer and a semiconductor die. The dielectric layer has a first surface, a second surface and an opening. The patterned metal layer is disposed on the first surface. The carrier is disposed at the second surface and has a third surface, a fourth surface and at least a through hole. A portion of the third surface and the through hole are exposed by the opening. The metal layer is disposed on the fourth surface and has a containing cavity and at least a heat conductive post extending from the fourth surface and disposed in the through hole. An end of the heat conductive post protrudes away from the third surface, and the containing cavity is located on the end of the heat conductive post. The semiconductor die is located in the containing cavity.

Abstract: A fabricating method of a semiconductor package structure is provided. A dielectric layer having a first surface and a second surface is provided. A patterned metal layer has been formed on the first surface of the dielectric layer. An opening going through the first and the second surfaces is formed. A carrier having a third surface and a fourth surface is formed at the second surface. A portion of the third surface is exposed by the opening of the dielectric layer. A semiconductor die having a joining surface and a side-surface is joined in the opening. At least a through hole going through the third and the fourth surfaces is formed. A metal layer having at least a heat conductive post extending from the fourth surface of the carrier to the through hole and disposed in the through hole and a containing cavity is formed on the fourth surface.

Abstract: A thermal conductivity substrate including a metal substrate, a metal layer, an insulating layer, a plurality of conductive structures, a first conductive layer and a second conductive layer is provided. The metal layer is disposed on the metal substrate and entirely covers the metal substrate. The insulating layer is disposed on the metal layer. The conductive structures are embedded in the insulating layer and connected to a portion of the metal layer. The first conductive layer is disposed on the insulating layer. The second conductive layer is disposed on the first conductive layer and the conductive structures. The second conductive layer is electrically connected to a portion of the metal layer through the conductive structures. The second conductive layer and the conductive structures are integrally formed.

Abstract: A thermal conductivity substrate including a metal substrate, a metal layer, an insulating layer, a plurality of conductive structures, a first conductive layer and a second conductive layer is provided. The metal layer is disposed on the metal substrate and entirely covers the metal substrate. The insulating layer is disposed on the metal layer. The conductive structures are embedded in the insulating layer and connected to a portion of the metal layer. The first conductive layer is disposed on the insulating layer. The second conductive layer is disposed on the first conductive layer and the conductive structures. The second conductive layer is electrically connected to a portion of the metal layer through the conductive structures. The second conductive layer and the conductive structures are integrally formed.

Abstract: A semiconductor package structure includes a dielectric layer, a patterned metal layer, a carrier, a metal layer and a semiconductor die. The dielectric layer has a first surface, a second surface and an opening. The patterned metal layer is disposed on the first surface. The carrier is disposed at the second surface and has a third surface, a fourth surface and at least a through hole. A portion of the third surface and the through hole are exposed by the opening. The metal layer is disposed on the fourth surface and has a containing cavity and at least a heat conductive post extending from the fourth surface and disposed in the through hole. An end of the heat conductive post protrudes away from the third surface, and the containing cavity is located on the end of the heat conductive post. The semiconductor die is located in the containing cavity.