Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A laser device is provided. The laser device includes a stack of epitaxial layers, a first conductive layer, an intermediate layer, and a first electrode. The stack of epitaxial layers has a central region and an edge region. The stack of epitaxial layers includes a first reflective structure, an active region disposed on the first reflective structure, a second reflective structure disposed on the active region. The first conductive layer disposes on the stack of epitaxial layers and covers the central region and at least a part of the edge region. The intermediate layer has a first opening that corresponding to the central region of the stack of epitaxial layers, wherein the intermediate layer comprises insulating material or metal. The first electrode disposes on the first conductive layer.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.

Abstract: Disclosed herein are related to a memory system including unit storage circuits. In one aspect, each of the unit storage circuits abuts an adjacent one of the unit storage circuits. In one aspect, each of the unit storage circuits includes a first group of memory cells, a second group of memory cells, a first sub-word line driver to apply a first control signal to the first group of memory cells through a first sub-word line extending along a direction, and a second sub-word line driver to apply a second control signal to the second group of memory cells through a second sub-word line extending along the direction. In one aspect, the memory system includes a common word line driver abutting one of the unit storage circuits and configured to apply a common control signal to the unit storage circuits through a word line extending along the direction.

Abstract: Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.

Abstract: An air duct formed from an electromagnetic wave absorber in the form of a sheet is disclosed. The sheet can be bent into a duct or scored, and folded at the score lines to bring the ends of the sheet into proximity. The ends can then be joined by adhesive, welding, or mechanical fasters. The air ducts disclosed herein provide dual functions of providing ventilation for electronic components in an electronic module, while at the same time, reducing electromagnetic interference (EMI). One or more air ducts, of the same or different dimensions, shapes, volumes can be combined with electronic modules, such as a server, to provide both ventilation and EMI suppression to various components within the electronic module.

Abstract: An air duct formed from an electromagnetic wave absorber in the form of a sheet is disclosed. The sheet can be bent into a duct or scored, and folded at the score lines to bring the ends of the sheet into proximity. The ends can then be joined by adhesive, welding, or mechanical fasters. The air ducts disclosed herein provide dual functions of providing ventilation for electronic components in an electronic module, while at the same time, reducing electromagnetic interference (EMI). One or more air ducts, of the same or different dimensions, shapes, volumes can be combined with electronic modules, such as a server, to provide both ventilation and EMI suppression to various components within the electronic module.

Abstract: Magnetic nanoparticle compositions are provided which provide an inherent temperature regulator for use in magnetic heating, particularly for use in magnetic hyperthermia medical treatments. The composition includes magnetic nanoparticles having a Curie temperature of between 40 and 46° C., preferably about 42° C., and may further include a polymeric material and optionally a drug or radiosensitizing agent. Methods of hyperthermia treatment of a patient in need thereof are provided which include the steps of administering to the patient a composition comprising magnetic nanoparticles having a Curie temperature of between 40 and 46° C.; and exposing the magnetic nanoparticles in the patient to an alternating magnetic field effective to generate hysteresis heat in the nanoparticles.

Abstract: Methods are provided for aligning carbon nanotubes and for making a composite material comprising aligned carbon nanotubes. The method for aligning carbon nanotubes comprises adsorbing magnetic nanoparticles to carbon nanotubes dispersed in a fluid medium to form a magnetic particle-carbon nanotube composite in the fluid medium; and exposing the composite to a magnetic field effective to align the nanotubes in the fluid medium. The method for making a composite material comprising aligned carbon nanotubes comprises (1) adsorbing magnetic nanoparticles to carbon nanotubes to form a magnetic particle-carbon nanotube composite; (2) dispersing the magnetic particle-carbon nanotube composite in a fluid matrix material to form a mixture; (3) exposing the mixture to a magnetic field effective to align the nanotubes in the mixture; and (4) solidifying the fluid matrix material to form a nanotube/matrix material composite comprising the aligned nanotubes which remain aligned in the absence of said magnetic field.

Abstract: Magnetic nanoparticle compositions are provided which provide an inherent temperature regulator for use in magnetic heating, particularly for use in magnetic hyperthermia medical treatments. The composition includes magnetic nanoparticles having a Curie temperature of between 40 and 46° C., preferably about 42° C., and may further include a polymeric material and optionally a drug or radiosensitizing agent. Methods of hyperthermia treatment of a patient in need thereof are provided which include administering to the patient a composition comprising magnetic nanoparticles having a Curie temperature of between 40 and 46° C.; and exposing the magnetic nanoparticles in the patient to an alternating magnetic field effective to generate hysteresis heat in the nanoparticles.

Abstract: A cable pliers structure includes a left plier body and a right plier body pivotally connected to each other. The right plier body has an adjusting region. The left plier body is connected with a drive seat movably disposed on one side of the adjusting region. A pressing block is disposed at the top of the drive seat. A clamping component is disposed in the adjusting region and has a clamp base that is movable relative to the pressing block. When the relative distance between the clamp base and the pressing block is changed, that is, the clamp base moves away from or approaches the pressing block, the distance is equivalent to the specification and dimension of a cable connector to be used. Therefore, the cable pliers structure is suitable for cable connectors of various specifications and dimensions through adjusting the distance, without replacing the pressing block.

Abstract: A terminal crimping pliers is provided, which is designed with a simple structure, and is used to improve the disadvantages of the conventional terminal crimping pliers, such as being difficult to be grasped and difficult for forces applied thereon. The terminal crimping pliers can be extended with a small angle, through a vertical stopping slot combined with two stopping slots with oblique angles, and the terminal crimping pliers can be held closed with a small force.

Abstract: A terminal crimping pliers is provided, which is designed with a simple structure, and is used to improve the disadvantages of the conventional terminal crimping pliers, such as being difficult to be grasped and difficult for forces applied thereon. The terminal crimping pliers can be extended with a small angle, through a vertical stopping slot combined with two stopping slots with oblique angles, and the terminal crimping pliers can be held closed with a small force.

Abstract: Polymeric nanoencapsulation methods, which combine sonication and nonsolvent temperature induced crystallization, are provided. The steps include (a) providing active agent nanoparticles having an average diameter between about 5 and about 100 nm; (b) treating said active agent nanoparticles (e.g.

Abstract: Microencapsulation methods and products are provided. The method includes forming, at a first temperature, a emulsion which comprises aqueous microdroplets, including the agent (e.g., a magnetic material or drug) and a cross-linkable matrix material (e.g., a protein such as albumin), dispersed in a hydrophobic continuous phase comprising an oil and an oil-soluble surfactant, the first temperature being below the temperature effective to initiate cross-linking of the matrix material, and then heating the emulsion to a temperature and for a time effective to cause the matrix material to self-crosslink, to form microparticles comprising the agent encapsulated by the crosslinked matrix material.

Abstract: Magnetic nanoparticle compositions are provided which provide an inherent temperature regulator for use in magnetic heating, particularly for use in magnetic hyperthermia medical treatments. The composition includes magnetic nanoparticles having a Curie temperature of between 40 and 46° C., preferably about 42° C., and may further include a polymeric material and optionally a drug or radiosensitizing agent. Methods of hyperthermia treatment of a patient in need thereof are provided which include the steps of administering to the patient a composition comprising magnetic nanoparticles having a Curie temperature of between 40 and 46° C.; and exposing the magnetic nanoparticles in the patient to an alternating magnetic field effective to generate hysteresis heat in the nanoparticles.