Abstract: A latch circuit includes a latch clock generator configured to generate a latched clock signal based on a clock signal and a first enable signal, and an input latch coupled to the latch clock generator to receive the latched clock signal. The input latch is configured to generate a latched output signal based on the latched clock signal and an input signal. In response to the first enable signal having a disabling logic level, the latch clock generator is configured to set a logic level of the latched clock signal to a corresponding disabling logic level, regardless of the clock signal. The latch clock generator includes a first inverter configured to generate an inverted signal of the first enable signal, and a NAND gate coupled to the first inverter to receive the inverted signal of the first enable signal. The NAND gate is configured to generate the latched clock signal based on the clock signal and the inverted signal of the first enable signal.

Abstract: An exemplary testing environment can operate in a testing mode of operation to test whether a memory device or other electronic devices communicatively coupled to the memory device operate as expected or unexpectedly as a result of one or more manufacturing faults. The testing mode of operation includes a shift mode of operation, a capture mode of operation, and/or a scan mode of operation. In the shift mode of operation and the scan mode of operation, the exemplary testing environment delivers a serial input sequence of data to the memory device. In the capture mode of operation, the exemplary testing environment delivers a parallel input sequence of data to the memory device.

Abstract: A memory device includes a memory array, a first latch and a first logic element. The memory array is configured to operate according to a first global write signal. The first latch is configured to generate a first latch write data based on a clock signal. The first logic element is configured to generate the first global write signal based on the clock signal and the first latch write data.

Abstract: A circuit includes first and second bit lines, a second power node having a voltage level below that of a first power node, a reference node having a reference voltage level, first and second pass gates and drivers, first and second logic gates coupled to the second power node, first and second conversion circuits coupled between the first power node and respective first and second logic and pass gates, and first and second NOR gates coupled between the second power node and respective first and second logic gates and drivers. The first and second pass gates selectively couple the first and second bit lines to the first power node responsive to the respective second and first logic gates and conversion circuits, and the first and second drivers selectively couple the first and second bit lines to the reference node responsive to the respective first and second logic and NOR gates.

Abstract: An integrated circuit includes multiple memory cells, a first pair of complementary data lines, a second pair of complementary data lines, multiple first word lines, and multiple second word lines. The memory cells include a first array of memory cells and a second array of memory cells. The first pair of complementary data lines are coupled to the first array of memory cells. The second pair of complementary data lines are coupled to the second array of memory cells. Lengths of the first pair of complementary data lines are shorter than lengths of the second pair of complementary data lines. The first word lines and the second word lines are arranged according to a predetermined ratio of a number of the first word lines to a number of the second word lines. The predetermined ratio is less than 1.

Abstract: An integrated circuit includes integrated circuit includes a memory bank, a first group of word lines, a second group of word lines, an access circuit, a converter circuit and a decoder circuit. The first group of word lines is coupled to the memory bank. The second group of word lines is coupled to the memory bank, and arranged in order with the first group of word lines. The access circuit is configured to read the memory bank. The converter circuit is configured to control the access circuit at least based on a first control signal. The decoder circuit is configured to generate the first control signal at least according to a first bit and a second bit of an address signal. The first bit and the second bit indicates one group of the first group of word lines and the second group of word lines.

Abstract: Disclosed herein are related to a memory system including unit storage circuits. In one aspect, each of the unit storage circuits abuts an adjacent one of the unit storage circuits. In one aspect, each of the unit storage circuits includes a first group of memory cells, a second group of memory cells, a first sub-word line driver to apply a first control signal to the first group of memory cells through a first sub-word line extending along a direction, and a second sub-word line driver to apply a second control signal to the second group of memory cells through a second sub-word line extending along the direction. In one aspect, the memory system includes a common word line driver abutting one of the unit storage circuits and configured to apply a common control signal to the unit storage circuits through a word line extending along the direction.

Abstract: An exemplary testing environment can operate in a testing mode of operation to test whether a memory device or other electronic devices communicatively coupled to the memory device operate as expected or unexpectedly as a result of one or more manufacturing faults. The testing mode of operation includes a shift mode of operation, a capture mode of operation, and/or a scan mode of operation. In the shift mode of operation and the scan mode of operation, the exemplary testing environment delivers a serial input sequence of data to the memory device. In the capture mode of operation, the exemplary testing environment delivers a parallel input sequence of data to the memory device.

Abstract: A memory device includes a local input/output circuit and a main input/output circuit. The local input/output circuit is configured to generate a first local write signal based on a first global write signal and a second global write signal, and configured to transmit the first local write signal to a plurality of first bit lines. The main input/output circuit include a first latch and logic elements. The first latch is configured to generate a first bit write mask signal based on a clock signal. The logic elements are configured to generate the first global write signal and the second global write signal based on the clock signal and the first bit write mask signal.

Abstract: A memory circuit includes a NAND logic gate configured to receive a first bit line signal and a second bit line signal, and to generate a first signal. The memory circuit further includes a first N-type transistor coupled to the NAND logic gate, and configured to receive a first pre-charge signal. The memory circuit further includes a second N-type transistor coupled to the first N-type transistor and a reference voltage supply, and configured to receive a first clock signal. The memory circuit further includes a first latch coupled to the NAND logic gate, and configured to latch the first signal in response to at least the first clock signal or the first pre-charge signal.

Abstract: An integrated circuit includes a plurality of memory cells, a first pair of complementary data lines, and a second pair of complementary data lines. The plurality of memory cells include a first array of memory cells and a second array of memory cells. The first pair of complementary data lines are coupled to the first array of memory cells. The second pair of complementary data lines are different from the first pair of complementary data lines and are coupled to the second array of memory cells. A number of memory cells in the first array of memory cells is different from a number of memory cells in the second array of memory cells.

Abstract: A circuit includes a plurality of registers, each register including SRAM cells, a read port configured to receive a read address, a write port configured to receive a write address, a selection circuit, a latch circuit, and a decoder coupled in series between the read and write ports and the plurality of registers, and a control circuit. Responsive to a clock signal and read and write enable signals, the control circuit causes the selection circuit, the latch circuit, and the decoder to select a first register of the plurality of registers in a read operation based on the read address, and select a second register of the plurality of registers in a write operation based on the write address.

Abstract: Disclosed herein are related to a memory system including unit storage circuits. In one aspect, each of the unit storage circuits abuts an adjacent one of the unit storage circuits. In one aspect, each of the unit storage circuits includes a first group of memory cells, a second group of memory cells, a first sub-word line driver to apply a first control signal to the first group of memory cells through a first sub-word line extending along a direction, and a second sub-word line driver to apply a second control signal to the second group of memory cells through a second sub-word line extending along the direction. In one aspect, the memory system includes a common word line driver abutting one of the unit storage circuits and configured to apply a common control signal to the unit storage circuits through a word line extending along the direction.

Abstract: A method includes specifying a target memory macro, and determining failure rates of function-blocks in the target memory macro based on an amount of transistors and area distributions in a collection of base cells. The method also includes determining a safety level of the target memory macro, based upon a failure-mode analysis of the target memory macro, from a memory compiler, based on the determined failure rate.

Abstract: A circuit includes a power management circuit configured to receive at least a first or a second control signal, and to supply at least a first, second or a third supply voltage. The first control signal has a first voltage swing. The second control signal has a second voltage swing. The power management circuit includes a first level shifter circuit configured to generate a first level shifted signal in response to the first control signal, and a first header circuit coupled to at least the first level shifter circuit, a first voltage supply and a second voltage supply. The first header circuit is configured to supply the first supply voltage of the first voltage supply to the first node in response to the first control signal, and to supply the second supply voltage of the second voltage supply to the second node in response to the first level shifted signal.

Abstract: A circuit includes a power management circuit and a memory circuit. The power management circuit is configured to receive a first control signal and a second control signal, and to supply a first supply voltage, a second supply voltage and a third supply voltage. The first control signal has a first voltage swing, and the second control signal has a second voltage swing different from the first voltage swing. The first control signal causes the power management circuit to enter a power management mode having a first state and a second state. The memory circuit is coupled to the power management circuit, and is in the first state or the second state in response to at least the first supply voltage supplied by the power management circuit.

Abstract: A circuit includes a plurality of registers, each register including SRAM cells, a read port configured to receive a read address, a write port configured to receive a write address, a selection circuit, a latch circuit, and a decoder coupled in series between the read and write ports and the plurality of registers, and a control circuit. Responsive to a clock signal and read and write enable signals, the control circuit causes the selection circuit, the latch circuit, and the decoder to select a first register of the plurality of registers in a read operation based on the read address, and select a second register of the plurality of registers in a write operation based on the write address.

Abstract: A memory circuit includes a NAND logic gate configured to receive a first bit line signal and a second bit line signal, and to generate a first signal. The memory circuit further includes a first N-type transistor coupled to the NAND logic gate, and configured to receive a first pre-charge signal. The memory circuit further includes a second N-type transistor coupled to the first N-type transistor and a reference voltage supply, and configured to receive a first clock signal. The memory circuit further includes a first latch coupled to the NAND logic gate, and configured to latch the first signal in response to at least the first clock signal or the first pre-charge signal.

Abstract: A memory device includes a local input/output circuit and a main input/output circuit. The local input/output circuit is configured to generate a first local write signal based on a first global write signal and a second global write signal, and configured to transmit the first local write signal to a plurality of first bit lines. The main input/output circuit include a first latch and logic elements. The first latch is configured to generate a first bit write mask signal based on a clock signal. The logic elements are configured to generate the first global write signal and the second global write signal based on the clock signal and the first bit write mask signal.

Abstract: A memory circuit includes a NAND logic gate, a first N-type transistor, a second N-type transistor, a first inverter and a first latch. The NAND logic gate is configured to receive a first bit line signal and a second bit line signal, and to generate a first signal. The first N-type transistor is coupled to the NAND logic gate, and configured to receive a first pre-charge signal. The second N-type transistor is coupled to the first N-type transistor and a reference voltage supply, and configured to receive a first clock signal. The first inverter is coupled to the NAND logic gate, and configured to output a data signal inverted from the first signal. The first latch is coupled to the NAND logic gate, and configured to latch the first signal in response to at least the first clock signal or the first pre-charge signal.