Abstract: An exemplary testing environment can operate in a testing mode of operation to test whether a memory device or other electronic devices communicatively coupled to the memory device operate as expected or unexpectedly as a result of one or more manufacturing faults. The testing mode of operation includes a shift mode of operation, a capture mode of operation, and/or a scan mode of operation. In the shift mode of operation and the scan mode of operation, the exemplary testing environment delivers a serial input sequence of data to the memory device. In the capture mode of operation, the exemplary testing environment delivers a parallel input sequence of data to the memory device.

Abstract: A method, of detecting an address decoding error of a semiconductor device, includes: decoding an original address, with an address decoder of the semiconductor device, to form a corresponding decoded address; recoding the decoded address, with an encoder of the semiconductor device, to form a recoded address; making a comparison, with a comparator of the semiconductor device, of the recoded address and the original address; and detecting an address decoding error based on the comparison.

Abstract: A data storage device can detect for a failure in decoding of an x-bit row address and/or a y-bit column of an (x+y)-bit address. The data storage device decodes the x-bit row address and/or the y-bit column address to provide wordlines (WLs) and/or bitlines (BLs) to access one or more cells from among a memory array of the data storage device. The data storage device compares one or more subsets of the WLs and/or of the BLs to each other to detect for the failure. The data storage device determines the failure is present in the decoding of the x-bit row address and/or the y-bit column of the (x+y)-bit address when one or more WL and/or BL from among the one or more subsets of the WLs and/or the BLs differ.

Abstract: A method includes delaying an input voltage signal to generate an output voltage, enabling a capacitor unit to apply across a word line driver a boosted voltage greater than the output voltage, and enabling the word line driver to provide a driving voltage that corresponds to the boosted voltage. A word line driving unit that performs the method and a memory device that includes the word line driving unit are also disclosed.

Abstract: A three-port, three-dimensional bit cell generally comprises a read portion of a cell disposed on a first tier. The read portion comprises a plurality of read port elements. The three-port bit cell further comprises a write portion of the cell disposed on a second tier that is vertically stacked with respect to the first tier. The first and second tiers are coupled using at least one via. The write portion comprises a plurality of write port elements.

Abstract: A data storage device can detect for a failure in decoding of an x-bit row address and/or a y-bit column of an (x+y)-bit address. The data storage device decodes the x-bit row address and/or the y-bit column address to provide wordlines (WLs) and/or bitlines (BLs) to access one or more cells from among a memory array of the data storage device. The data storage device compares one or more subsets of the WLs and/or of the BLs to each other to detect for the failure. The data storage device determines the failure is present in the decoding of the x-bit row address and/or the y-bit column of the (x+y)-bit address when one or more WL and/or BL from among the one or more subsets of the WLs and/or the BLs differ.

Abstract: A circuit includes a bit line, a power node having a first power voltage level, a reference node having a reference voltage level, a pass gate coupled between the bit line and the power node, and a driver coupled between the bit line and the reference node. The pass gate couples the bit line to the power node responsive to a first signal, and the driver couples the bit line to the reference node responsive to a second signal. The first signal is based on the first power voltage level, and the second signal is based on a second power voltage level between the reference voltage level and the first power voltage level.

Abstract: A memory device includes a first group of memory cells, a second group of memory cells, a third group of memory cells, and a fourth group of memory cells. A control circuit performs a first read/write operation during a first time interval by writing a first data value to the first group while concurrently reading a second data value from the second group. The control circuit performs a second read/write operation during a second time interval, which is after the first time interval, by writing a third data value to the third group while concurrently reading a fourth data value from the fourth group. The first and third data values are collectively made up of N-bits and collectively correspond to an N-bit input data word provided onto input pins of the memory device prior to the first time interval.

Abstract: A method includes delaying an input voltage signal to generate an output voltage, enabling a capacitor unit to apply across a word line driver a boosted voltage greater than the output voltage, and enabling the word line driver to provide a driving voltage that corresponds to the boosted voltage. A word line driving unit that performs the method and a memory device that includes the word line driving unit are also disclosed.

Abstract: A memory macro includes a first input terminal, a first memory cell array, a second memory cell array, a first input output (IO) circuit, a second IO circuit, a first set of driver circuits, a second set of driver circuits and a logic circuit. The first set of driver circuits are coupled to the first memory cell array and the first IO circuit. The second set of driver circuits are coupled to the second memory cell array and the second IO circuit. The logic circuit has a first terminal coupled to the first input terminal and configured to receive a first signal. The logic circuit is coupled to the first set of driver circuits and the second set of driver circuits. The logic circuit is configured to generate at least a second signal responsive to the first signal causing a change in the operational mode of the memory macro.

Abstract: A memory device includes a first group of memory cells, a second group of memory cells, a third group of memory cells, and a fourth group of memory cells. A control circuit performs a first read/write operation during a first time interval by writing a first data value to the first group while concurrently reading a second data value from the second group. The control circuit performs a second read/write operation during a second time interval, which is after the first time interval, by writing a third data value to the third group while concurrently reading a fourth data value from the fourth group. The first and third data values are collectively made up of N-bits and collectively correspond to an N-bit input data word provided onto input pins of the memory device prior to the first time interval.

Abstract: Some embodiments of the present disclosure relate to a memory device wherein a single memory cell array is partitioned between two or more tiers which are vertically integrated on a single substrate. The memory device also includes support circuitry including a control circuit configured to read and write data to the memory cells on each tier, and a shared input/output (I/O) architecture which is connected the memory cells within each tier and configured to receive input data word prior to a write operation, and further configured to provide output data word after a read operation. Other devices and methods are also disclosed.

Abstract: An IC includes a memory core logic unit, an output unit, and an input unit. The memory logic unit is coupled to a plurality of bit cells configured to control read and write of data to and from the plurality of bit cells. The input unit is formed on the integrated circuit. The output unit is formed on the integrated circuit. The input unit includes a second plurality of multiplexers for signal selection, at least one lock up latch for storing data and configured to increase a hold time for the data, and at least one shadow latch configured to store a copy of the data stored in the at least one lock up latch. The output unit includes a first plurality of multiplexers for signal selection and at least one high phase pass latch for storing data.

Abstract: An integrated circuit (IC) memory device includes a first conductive layer. The IC memory device also includes a second conductive layer over the first conductive layer. The IC memory device further includes a first-type pin box electrically coupled with the first conductive layer. The IC memory device additionally includes a second-type pin box, different from the first-type pin box, electrically coupled with the second conductive layer.

Abstract: In some embodiments, a time division multiplexing (TDM) circuit is configured to receive an external clock signal and generate an internal clock signal that has at least one pulse during a clock cycle of the external clock signal. An address selector is configured to select a current address before a first time within one of the at least one pulse, and select a next address starting from the first time to generate a selected address. An address storage element is configured to receive the selected address from the address selector and provide a passed through or stored address. The provided address is the current address substantially throughout the one of the at least one pulse. A single-port (SP) memory is configured to access at least one SP memory cell at the address provided by the address storage element in response to the internal clock signal.

Abstract: A memory circuit includes a first row of memory cells, a first word line and a second word line over and electrically coupled to the first row of memory cells, a second row of memory cells aligned with the first row of memory cells along a predetermined direction, and a third word line and a fourth word line over and electrically coupled to the second row of memory cells. The first word line is aligned with the third word line, and the second word line is aligned with the fourth word line. One of the first word line or the second word line is electrically coupled with one of the third word line or the fourth word line. The other one of the first word line or the second word line is electrically decoupled from the other one of the third word line or fourth word line.

Abstract: A static random access memory (SRAM) including at least a memory cell array, a first data line connected to the memory cell array, and a read assist unit connected to the first data line. The read assist unit is configured to suppress a voltage level of the first data line during a read operation of the memory cell array.

Abstract: A three-port, three-dimensional bit cell generally comprises a read portion of a cell disposed on a first tier. The read portion comprises a plurality of read port elements. The three-port bit cell further comprises a write portion of the cell disposed on a second tier that is vertically stacked with respect to the first tier. The first and second tiers are coupled using at least one via. The write portion comprises a plurality of write port elements.

Abstract: In some embodiments, a time division multiplexing (TDM) circuit is configured to receive an external clock signal and generate an internal clock signal that has at least one pulse during a clock cycle of the external clock signal. An address selector is configured to select a current address before a first time within one of the at least one pulse, and select a next address starting from the first time to generate a selected address. An address storage element is configured to receive the selected address from the address selector and provide a passed through or stored address. The provided address is the current address substantially throughout the one of the at least one pulse. A single-port (SP) memory is configured to access at least one SP memory cell at the address provided by the address storage element in response to the internal clock signal.

Abstract: An integrated circuit includes a plurality of metal layers of bit cells of a memory cell array disposed in a first metal layer and extending in a first direction, a plurality of word lines of the memory cell array disposed in a second metal layer and extending in a second direction that is different from the first direction, and at least two conductive traces disposed in a third metal layer substantially adjacent to each other and extending at least partially across the memory cell array, a first one of the at least two conductive traces coupled to a driving source node of a write assist circuit, and a second conductive trace of the at least two conductive traces coupled to an enable input of the write-assist circuit, where the at least two conductive traces form at least one embedded capacitor having a capacitive coupling to the bit line.