Abstract: A system and method for automated control and improvement of the consistency of yarn texture in a yarn system. The system and method are configured to monitor, improve and/or control the operating conditions of the yarn system. A plurality of sensors sense the operating conditions and send the sensed conditions to a processor. The processor monitoring the system can cause adjustments to the operating conditions to be made if a condition is outside of a predetermined tolerance.

Abstract: A system and method for controlling and improving the consistency of yarn texture in a yarn system. The system and method are configured to monitor, improve and/or control the operating parameters of the yarn system. A plurality of sensors sense the operating conditions and send the sensed conditions to a processor. The processor and/or a user monitoring the system can make adjustments to the operating parameters in a parameter is outside of a predetermined tolerance.

Abstract: An apparatus and a method are disclosed for reducing the pin driver count required for testing computer memory devices, specifically Rambus DRAM, while a die is on a semiconductor wafer. By reducing the pin count, more DRAMs can be tested at the same time, thereby reducing test cost and time. One preferred embodiment utilizes a trailing edge of a precharge clock to select a new active bank address, so that the address line required to select a new active address does not have to be accessed at the same time as the row lines.

Abstract: An apparatus and a method are disclosed for reducing the pin driver count required for testing computer memory devices, specifically Rambus DRAM, while a die is on a semiconductor wafer. By reducing the pin count, more DRAMs can be tested at the same time, thereby reducing test cost and time. One preferred embodiment utilizes a trailing edge of a precharge clock to select a new active bank address, so that the address line required to select a new active address does not have to be accessed at the same time as the row lines.

Abstract: A delay locked loop circuit has a quantifier for obtaining a measured delay quantity based on a time delay between an external signal and an internal signal. Based on the measured delay quantity, a delay controller controls a correction delay quantity applied to a signal path of the external signal to synchronize the external and internal signals.

Abstract: An apparatus and a method are disclosed for reducing the pin driver count required for testing computer memory devices, specifically Rambus DRAM, while a die is on a semiconductor wafer. By reducing the pin count, more DRAMs can be tested at the same time, thereby reducing test cost and time. One preferred embodiment utilizes a trailing edge of a precharge clock to select a new active bank address, so that the address line required to select a new active address does not have to be accessed at the same time as the row lines.

Abstract: An apparatus and a method are disclosed for reducing the pin driver count required for testing computer memory devices, specifically Rambus DRAM, while a die is on a semiconductor wafer. By reducing the pin count, more DRAMs can be tested at the same time, thereby reducing test cost and time. One preferred embodiment utilizes a trailing edge of a precharge clock to select a new active bank address, so that the address line required to select a new active address does not have to be accessed at the same time as the row lines.

Abstract: A delay locked loop circuit has a quantifier for obtaining a measured delay quantity based on a time delay between an external signal and an internal signal. Based on the measured delay quantity, a delay controller controls a correction delay quantity applied to a signal path of the external signal to synchronize the external and internal signals.

Abstract: A delay locked loop circuit has a quantifier for obtaining a measured delay quantity based on a time delay between an external signal and an internal signal. Based on the measured delay quantity, a delay controller controls a correction delay quantity applied to a signal path of the external signal to synchronize the external and internal signals.

Abstract: An apparatus and a method are disclosed for reducing the pin driver count required for testing computer memory devices, specifically Rambus DRAM, while a die is on a semiconductor wafer. By reducing the pin count, more DRAMs can be tested at the same time, thereby reducing test cost and time. One preferred embodiment utilizes a trailing edge of a precharge clock to select a new active bank address, so that the address line required to select a new active address does not have to be accessed at the same time as the row lines.

Abstract: An apparatus and a method are disclosed for reducing the pin driver count required for testing computer memory devices, specifically Rambus DRAM, while a die is on a semiconductor wafer. By reducing the pin count, more DRAMs can be tested at the same time, thereby reducing test cost and time. One preferred embodiment utilizes a trailing edge of a precharge clock to select a new active bank address, so that the address line required to select a new active address does not have to be accessed at the same time as the row lines.

Abstract: An apparatus and a method are disclosed for reducing the pin driver count required for testing computer memory devices, specifically Rambus DRAM, while a die is on a semiconductor wafer. By reducing the pin count, more DRAMs can be tested at the same time, thereby reducing test cost and time. One preferred embodiment utilizes a trailing edge of a precharge clock to select a new active bank address, so that the address line required to select a new active address does not have to be accessed at the same time as the row lines.

Abstract: A delay locked loop circuit has a quantifier for obtaining a measured delay quantity based on a time delay between an external signal and an internal signal. Based on the measured delay quantity, a delay controller controls a correction delay quantity applied to a signal path of the external signal to synchronize the external and internal signals.

Abstract: An external FET (12) has protection provided thereto for excessive voltages between the gate and drain and between the gate and source. A drain-to-gate clamp is provided with a plurality of series connected zener diodes (34), (36) and (38) which are connected in series with a Schottky diode (42). The current therethrough is sensed with a resistor (56) which turns on a bypass transistor (58) to shunt current around the zener diodes when an excess voltage causes them to break down. This will turn on the FET (12). The gate-to-source clamp is configured with two zener diodes (74) and (76) which are reversed biased. A series current sense resistor (82) senses the current through the diodes and turns on a transistor (84) when the current exceeds a predetermined level. This will effectively shunt current around the zener diodes (74) and (76).