Abstract: Transceiver modules with dual printed circuit boards. In one example embodiment, a transceiver module includes first and second printed circuit boards (PCBs), a transmitter, a receiver, and a flexible circuit. The first PCB is positioned in a first plane and the second PCB is positioned in a second plane. The transmitter and the receiver are both positioned in a third plane that is offset from the first and second planes. The flexible circuit includes conductive traces that allow electrical data signals to pass between the transmitter and the receiver and the first and second PCBs.

Abstract: A transceiver module that utilizes a side contact spring portion to ground a shielded cable that is plugged into the transceiver module. In one example embodiment, a transceiver module includes a housing, a jack, and a side contact spring portion. The housing is operative to be electrically connected to chassis ground when the transceiver module is received within a host port. The jack is defined in the housing and operative to receive a shielded plug. The side contact spring portion is substantially implemented within the jack and is configured to be in electrical contact with both the housing and a conductive element of the shielded plug received by the jack such that a chassis ground is established between the housing and the shielded plug and such that a moveable bail pivot lever is able to move without disrupting the electrical contact between the side contact spring portion and the housing and/or the conductive element of the shielded plug.

Abstract: One embodiment includes a latching mechanism having a latch, a cam and a slider. The cam is configured to rotate about an axis of rotation. The cam is also configured to displace an end of the latch when the cam is rotated about the axis of rotation. The slider is operably connected to the cam and is configured to cause the cam to rotate about the axis of rotation. Some embodiments also include a retaining cover and a boot. The retaining cover secures a second end of the latch to a module in which the latching mechanism is implemented. The boot is operatively connected to the slider and can be manipulated by a user to activate the slider.

Abstract: A shield device for preventing the emission of electromagnetic interference (“EMI”) from an optoelectronic device, such as an optical transceiver, is disclosed. In particular, an EMI shield is disclosed for placement within an optical transceiver module in order to intercept and absorb EMI produced by electronic components included within the transceiver. This absorption by the EMI shield prevents EMI from escaping the optical transceiver module and interfering with other electronic components that are typically placed in close proximity to the transceiver. The EMI shield in one embodiment includes a sheet of EMI absorbing material that is sized for placement within the transceiver. The EMI shield can be interposed between an outer shell of the transceiver and electronic components located on a printed circuit board that is disposed within the transceiver. The proximity of the EMI shield to the EMI-producing electronic components maximizes EMI absorption by the shield.

Abstract: In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.

Abstract: Various embodiments for providing removable, pluggable and disposable opto-electronic modules for illumination and imaging for endoscopy or borescopy are provided for use with portable display devices. Generally, various rigid, flexible or expandable single use medical or industrial devices with an access channel, can include one or more solid state or other compact electro-optic illuminating elements located thereon. Additionally, such opto-electronic modules may include illuminating optics, imaging optics, and/or image capture devices, and airtight means for suction and delivery within the device. The illuminating elements may have different wavelengths and can be time-synchronized with an image sensor to illuminate an object for 2D and 3D imaging, or for certain diagnostic purposes.

Abstract: In one example embodiment, a connector structure includes a housing that defines a chamber, a plurality of magnetic cores positioned within the chamber, and a means for positioning the plurality of magnetic cores so that a first magnetic core of the plurality of magnetic cores is not in physical contact with a second magnetic core of the plurality of magnetic cores.

Abstract: In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.

Abstract: Various embodiments for providing removable, pluggable and disposable opto-electronic modules for illumination and imaging for endoscopy or borescopy are provided for use with portable display devices. Generally, various medical or industrial devices can include one or more solid state or other compact electro-optic illuminating elements located thereon. Additionally, such opto-electronic modules may include illuminating optics, imaging optics, and/or image capture devices. The illuminating elements may have different wavelengths and can be time-synchronized with an image sensor to illuminate an object for imaging or detecting purpose or other conditioning purpose. The removable opto-electronic modules may be plugged onto the exterior surface of another medical device, deployably coupled to the distal end of the device, or otherwise disposed on the device.

Abstract: A transceiver module that utilizes a side contact spring portion to ground a shielded cable that is plugged into the transceiver module. In one example embodiment, a transceiver module includes a housing, a jack, and a side contact spring portion. The housing is operative to be electrically connected to chassis ground when the transceiver module is received within a host port. The jack is defined in the housing and operative to receive a shielded plug. The side contact spring portion is substantially implemented within the jack and is configured to be in electrical contact with both the housing and a conductive element of the shielded plug received by the jack such that a chassis ground is established between the housing and the shielded plug and such that a moveable bail pivot lever is able to move without disrupting the electrical contact between the side contact spring portion and the housing and/or the conductive element of the shielded plug.

Abstract: A transceiver module that utilizes a pivot lever to ground a shielded cable that is plugged into the transceiver module. In one example embodiment, a transceiver module includes a housing, a jack, and a movable pivot lever. The housing is operative to be electrically connected to chassis ground when the transceiver module is received within a host port. The jack is defined in the housing and operative to receive a shielded plug. The pivot lever is configured to allow removal of the transceiver module from within the host port. Further, the pivot lever is configured to be in electrical contact with both the housing and a conductive element of the shielded plug received by the jack such that a chassis ground is established between the housing and the shielded plug.

Abstract: In one example, an optical subassembly positioning plate is provided that includes a substantially flat body that defines at least one edge. A port is defined in the body. The port is configured to receive and secure an optical subassembly in an x-direction and a y-direction when said optical subassembly positioning plate is positioned within an optoelectronic transceiver module. A plurality of fingers is defined along at least one edge of the body. Each of the plurality of fingers is configured to contact a shell of the optoelectronic transceiver module so as to bias a flange of the optical subassembly against a portion of the shell of the optoelectronic transceiver module such that the optical subassembly is substantially retained in a z-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module.

Abstract: Various embodiments for providing removable and pluggable opto-electronic modules for illumination and imaging for endoscopy or borescopy are provided for use with portable display devices. Generally, various medical or industrial devices can include one or more solid state or other compact electro-optic illuminating elements located thereon. Additionally, such opto-electronic modules may include illuminating optics, imaging optics, and/or image capture devices. The illuminating elements may have different wavelengths and can be time-synchronized with an image sensor to illuminate an object for imaging or detecting purpose or other conditioning purpose. The removable opto-electronic modules may be plugged in on the exterior surface of a device, inside the device, deployably coupled to the distal end of the device, or otherwise disposed on the device.

Abstract: Transceiver modules with dual printed circuit boards. In one example embodiment, a transceiver module includes first and second printed circuit boards (PCBs), a transmitter, a receiver, and a flexible circuit. The first PCB is positioned in a first plane and the second PCB is positioned in a second plane. The transmitter and the receiver are both positioned in a third plane that is offset from the first and second planes. The flexible circuit includes conductive traces that allow electrical data signals to pass between the transmitter and the receiver and the first and second PCBs.

Abstract: In one example embodiment, a collar clip includes a body that is sized and configured to partially encircle a shell of an optoelectronic transceiver module. Each extended element in a pair of the extended elements is separated from the other extended element in the pair by a cavity. Each cavity is configured to receive a portion of a corresponding structure of the shell.

Abstract: A system for retaining an optical subassembly in a shell of a communications module is disclosed. The system reduces stress imposed on a hermetic package of the optical subassembly during lead interconnection procedures while ensuring thermal contact of the package with a thermal pad mounted in the shell. In one embodiment, the system includes a spring clip comprising a head portion that defines a seating surface, as well as first and second arms. The seating surface is shaped to engage an outer surface of a nosepiece of the optical subassembly. The first and second arms extend from the head portion so as to define a “U”-shaped configuration with the head portion. The head portion is shaped so as to provide a resilient force against a flange of the nosepiece when the flange and spring clip are received in a groove defined in the shell during assembly.

Abstract: In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.

Abstract: An integrated latching mechanism for use with a user pluggable electronic module, such as an opto-electronic transceiver module, is disclosed. The latching mechanism allows the user to selectively latch the module within a corresponding host port by manipulation of a pivot lever. Movement of the pivot lever causes a locking pin to extend and latch the module within the port. Conversely, movement of the pivot lever can disengage the locking pin and thereby allow the user to extract the module from within the port. The pivot lever can further include a biasing member that biases the pivot lever in a locked position.

Abstract: A mounting system for securing a printed circuit board in a communication module, such as an optical transceiver module, is disclosed. In one embodiment, the transceiver module includes an outer shell and an enclosure that cooperate to contain the printed circuit board therein. The mounting system comprises first and second pins, wherein each pin includes a first end passing through respective holes coaxially defined in both the shell and the printed circuit board. The pins also each have a second end that includes a head. The head is positioned in a recess defined in an exterior portion of the shell such that the head does not interfere with insertion or removal of the transceiver module from a slot of a host device. Further, the second pin is electrically connected with both the outer shell and enclosure to prevent emissions of electromagnetic interference from the distal end of the transceiver.

Abstract: A transceiver module that utilizes an apparatus for providing chassis ground to a printed circuit board located within a connector structure of the transceiver module. In one example embodiment, a ground clip for use in a transceiver module includes a cross-arm, a pair of arms connected to the cross-arm, a pair of fingers each connected to one of the pair of arms, and at least one protrusion connected to the cross-arm. Each finger is configured to be inserted into a hole in a connector structure and configured to be electrically connected to ground contacts of a printed circuit board. The at least one protrusion is configured to bias against, and make reliable electrical contact with, a portion of a transceiver module that is electrically connected to a housing of the transceiver module.