Abstract: Systems and methods to control pulse welding are disclosed. An example welding-type system includes: power conversion circuitry configured to convert input power to welding-type power; and control circuitry configured to control the power conversion circuitry to output the welding-type power in a plurality of pulse cycles, each pulse cycle comprising a background phase, a ramp up phase, a peak phase, and a ramp down phase. Controlling the power conversion circuitry involves: during the ramp up phase of the pulse cycles, controlling the power conversion circuitry in a current-controlled mode and switching to controlling the power conversion circuitry in a voltage-controlled mode when a peak transition voltage is reached; and during the ramp down phase of the pulse cycles, controlling the power conversion circuitry in a current-controlled mode and switching to controlling the power conversion circuitry in a voltage-controlled mode when a background transition voltage is reached.

Abstract: Systems and methods to control pulse welding are disclosed. An example welding-type system includes: power conversion circuitry configured to convert input power to welding-type power; and control circuitry configured to control the power conversion circuitry to output the welding-type power in a plurality of pulse cycles, each pulse cycle including background, ramp up, peak, and ramp down phases. Controlling the power conversion circuitry involves: during the background phase, controlling the power conversion circuitry in a voltage-controlled mode using a background voltage as a target voltage; during the ramp up phase, controlling the power conversion circuitry by changing the target voltage to a peak voltage; during the peak phase, controlling the power conversion circuitry using the peak voltage as the target voltage; and during the ramp down phase, controlling the power conversion circuitry by changing the target voltage to the background voltage.

Abstract: Systems and methods for clearing a short during a GMAW-P welding process are disclosed. A welding-type power supply may include a power conversion circuitry configured to convert input power to welding-type power, and a controller configured to control the power conversion circuitry based on a plurality of operating parameters. In examples, if the controller senses an occurrence of a short circuit during the welding cycle (e.g., during the background state), the voltage-controlled process can adjust an output current to increase in order to achieve one or more short state target voltage values. Once the short has cleared (as evidenced by a spike in voltage) and/or a desired short state target voltage value is achieved, the controller can again adjust the output current to decrease until the voltage has returned to a background voltage level.

Abstract: Systems and methods to control pulse welding are disclosed. An example welding-type system includes: power conversion circuitry configured to convert input power to welding-type power; and control circuitry configured to control the power conversion circuitry to output the welding-type power in a plurality of pulse cycles, each pulse cycle comprising a background phase, a ramp up phase, a peak phase, and a ramp down phase. Controlling the power conversion circuitry involves: during the ramp up phase of the pulse cycles, controlling the power conversion circuitry in a current-controlled mode and switching to controlling the power conversion circuitry in a voltage-controlled mode when a peak transition voltage is reached; and during the ramp down phase of the pulse cycles, controlling the power conversion circuitry in a current-controlled mode and switching to controlling the power conversion circuitry in a voltage-controlled mode when a background transition voltage is reached.

Abstract: Systems and methods for initiating and/or terminating a GMAW-P welding process are disclosed. A welding-type power supply may include a power conversion circuitry configured to convert input power to welding-type power, and a controller configured to control the power conversion circuitry based on a plurality of operating parameters. In examples, the systems and methods disclosed herein implement pulsed cycles with one or more increased output parameters (such as current, pulse width, etc.) in order to jump start a pulsed welding cycle at a cold start (i.e. at initiation of a welding process), and thereby prevent a ball forming and remaining on the end of an electrode wire as the welding process continues. In a similar manner, a pulsed cycle with one or more increased parameters can be used to terminate the welding process, also preventing the ball forming and remaining on the electrode wire.

Abstract: Systems and methods to control pulse welding are disclosed. An example welding-type system includes: power conversion circuitry configured to convert input power to welding-type power; and control circuitry configured to control the power conversion circuitry to output the welding-type power in a plurality of pulse cycles, each pulse cycle including background, ramp up, peak, and ramp down phases. Controlling the power conversion circuitry involves: during the background phase, controlling the power conversion circuitry in a voltage-controlled mode using a background voltage as a target voltage; during the ramp up phase, controlling the power conversion circuitry by changing the target voltage to a peak voltage; during the peak phase, controlling the power conversion circuitry using the peak voltage as the target voltage; and during the ramp down phase, controlling the power conversion circuitry by changing the target voltage to the background voltage.

Abstract: A method for forming a conductive feature. The method includes providing a substrate and a conductive composition. The conductive composition includes metal particles, a fluxing agent and a liquid monomer. The method further includes heating the composition to a temperature from about 200 to about 300° C. to fuse metal particles, crosslink the liquid monomer, and form a conductive feature.

Abstract: A method for forming a conductive feature. The method includes providing a substrate and providing a conductive composition. The conductive composition includes metal particles, a non-acid protic solvent, and a high polarity solvent. The non-acid protic solvent and high polarity solvent are present in concentrations sufficient to ionize the non-acid protic solvent and remove oxides when heated. The method further includes heating the composition to a temperature less than about 250° C. to form a conductive feature having less than about ten times the resistivity of bulk copper.

Abstract: Described herein is a method and apparatus for removing metal oxides on a surface of a component via electron attachment. In one embodiment, there is provided a field emission apparatus, wherein the electrons attach to at least a portion of the reducing gas to form a negatively charged atomic ions which removes metal oxides comprising: a cathode comprising an electrically conductive and comprising at least one or more protrusions having an angled edge or high curvature surface, wherein the cathode is surrounded by a dielectric material which is then surrounded by an electrically conductive anode wherein the cathode and anode are each connected to an electrical voltage source, and the dielectric material between the cathode and anode is polarized, intensifying the electrical field strength and accumulating electrons at the apex of the cathode to promote field emission of electrons from the cathode.

Abstract: Described herein is a method and apparatus for removing metal oxides on a surface of a component via electron attachment. In one embodiment, there is provided a field emission apparatus, wherein the electrons attach to at least a portion of the reducing gas to form a negatively charged atomic ions which removes metal oxides comprising: a cathode comprising an electrically conductive and comprising at least one or more protrusions having a high surface curvature, wherein the cathode is surrounded by a dielectric material which is then surrounded by an electrically conductive anode wherein the cathode and anode are each connected to an electrical voltage source, and the dielectric material between the cathode and anode is polarized to provide an electric field at one or more protrusions and thereby electrons from the cathode.

Abstract: An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.

Abstract: The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.

Abstract: Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap.

Abstract: A method for forming a conductive feature. The method includes providing a substrate and providing a conductive composition. The conductive composition includes metal particles, a non-acid protic solvent, and a high polarity solvent. The non-acid protic solvent and high polarity solvent are present in concentrations sufficient to ionize the non-acid protic solvent and remove oxides when heated. The method further includes heating the composition to a temperature less than about 250° C. to form a conductive feature having less than about ten times the resistivity of bulk copper.

Abstract: A method for forming a conductive feature. The method includes providing a substrate and a conductive composition. The conductive composition includes metal particles, a fluxing agent and a liquid monomer. The method further includes heating the composition to a temperature from about 200 to about 300° C. to fuse metal particles, crosslink the liquid monomer, and form a conductive feature.

Abstract: Described herein is a method and apparatus for removing metal oxides on a surface of a component via electron attachment. In one embodiment, there is provided a field emission apparatus, wherein the electrons attach to at least a portion of the reducing gas to form a negatively charged atomic ions which removes metal oxides comprising: a cathode comprising an electrically conductive and comprising at least one or more protrusions having an angled edge or high curvature surface, wherein the cathode is surrounded by a dielectric material which is then surrounded by an electrically conductive anode wherein the cathode and anode are each connected to an electrical voltage source, and the dielectric material between the cathode and anode is polarized, intensifying the electrical field strength and accumulating electrons at the apex of the cathode to promote field emission of electrons from the cathode.

Abstract: Described herein are a method and an apparatus for removing metal oxides and/or forming solder joints on at least a portion of a substrate surface within a target area. In one particular embodiment, the method and apparatus form a solder joint within a substrate comprising a layer having a plurality of solder bumps by providing one or more energizing electrodes and exposing at least a portion of the layer and solder bumps to the energizing electrode.

Abstract: Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap.

Abstract: Described herein is a method and apparatus for removing metal oxides on a surface of a component via electron attachment. In one embodiment, there is provided a field emission apparatus, wherein the electrons attach to at least a portion of the reducing gas to form a negatively charged atomic ions which removes metal oxides comprising: a cathode comprising an electrically conductive and comprising at least one or more protrusions having a high surface curvature, wherein the cathode is surrounded by a dielectric material which is then surrounded by an electrically conductive anode wherein the cathode and anode are each connected to an electrical voltage source, and the dielectric material between the cathode and anode is polarized to provide an electric field at one or more protrusions and thereby electrons from the cathode.

Abstract: Described herein are a method and an apparatus for removing metal oxides from a substrate surface within a target area. In one particular embodiment, the method and apparatus has an energizing electrode which has an array of protruding conductive tips that are electrically connected by a conductive wire and separated into a first electrically connected group and a second electrically connected group wherein at least a portion of the conductive tips are activated by a DC voltage source that is negatively biased to generate electrons within the target area that attach to at least a portion of a reducing gas that is present in the target area to form a negatively charged reducing gas that contacts the treating surface to reduce the metal oxides on the treating surface of the substrate.