Abstract: Purification material for removing a contaminant from an impure hydride gas comprising an adsorbent comprising a reduced metal oxide on a porous support and a desiccant. The porous support may be selected from the group consisting of activated carbon, alumina, silica, zeolite, silica alumina, titania, zirconia, and combinations thereof. The reduced metal oxide may comprise one or more metals selected from the group consisting of Group I alkali metals (lithium, sodium, potassium, rubidium, and cesium), Group II alkaline earth metals (magnesium, calcium, strontium, and barium), and transition metals (manganese, nickel, zinc, iron, molybdenum, tungsten, titanium, vanadium, cobalt, and rhodium). The desiccant may be selected from the group consisting of hygroscopic metal salts, zeolites, single metal oxides, mixed metal oxides, and combinations thereof.

Abstract: The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.

Abstract: This invention relates to an improvement in a process for removing water from a hydride gas, and particularly ammonia, by contacting the hydride gas with a drying agent under conditions for effecting removal of the water. The improvement for significantly reducing the water content to trace levels in said hydride gas resides in the use of at least Group 1 metal oxide and at least one Group 2 metal oxide as a drying agent.

Abstract: Purification material for removing a contaminant from an impure hydride gas comprising an adsorbent comprising a reduced metal oxide on a porous support and a desiccant. The porous support may be selected from the group consisting of activated carbon, alumina, silica, zeolite, silica alumina, titania, zirconia, and combinations thereof. The reduced metal oxide may comprise one or more metals selected from the group consisting of Group I alkali metals (lithium, sodium, potassium, rubidium, and cesium), Group II alkaline earth metals (magnesium, calcium, strontium, and barium), and transition metals (manganese, nickel, zinc, iron, molybdenum, tungsten, titanium, vanadium, cobalt, and rhodium). The desiccant may be selected from the group consisting of hygroscopic metal salts, zeolites, single metal oxides, mixed metal oxides, and combinations thereof.

Abstract: This invention relates to an improvement in a process for removing water from a hydride gas, and particularly ammonia, by contacting the hydride gas with a drying agent under conditions for effecting removal of the water. The improvement for significantly reducing the water content to trace levels in said hydride gas resides in the use of at least Group 1 metal oxide and at least one Group 2 metal oxide as a drying agent.

Abstract: The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.

Abstract: An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.

Abstract: The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.

Abstract: The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.

Abstract: A method of dry fluxing metal surfaces of one or more components to be soldered, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly.

Abstract: A tin-based solder material and method comprising same are disclosed herein. In one embodiment, the solder material comprises 0.00001 to 10 weight percent of at least one of the following elements: selenium, tellurium, arsenic, polonium, or thallium. After heating to one or more temperatures in a non-oxidizing atmosphere sufficient to melt the solder, the at least one element substantially segregates to the surface of the molten solder composition. The at least one element improves the solder joint formed between at least two substrates by reducing the surface tension of the molten solder.

Abstract: An adsorbent, method, and apparatus involving same for the removal of moisture from a fluoride-containing fluid such as gaseous nitrogen trifluoride are disclosed herein. In certain preferred embodiments, the adsorbent of the present invention comprises an organic support having a porosity of 30% or greater and a pore size of 2 &mgr;m or less; and at least one metal fluoride disposed within at least a portion of the organic substrate.

Abstract: The present invention provides an adsorbent for removing water and/or other oxygen-containing impurities from a fluid comprising ammonia to the ppb level and methods for making and using same. The adsorbent preferably comprises a substrate having a plurality of pores and a surface area that ranges from about 100 to about 2,500 m2/g and a compound disposed within a least a portion of the substrate. In certain preferred embodiments, the compound comprises at least one cation from the group consisting of ammonium (I), lithium (I), sodium (I), potassium (I), cesium (I); magnesium (II), calcium (II), strontium (II), barium (II), manganese (II), nickel (II), iron (II), zinc (II); aluminum (III), indium (III), iron (III), and zirconium (IV) or combinations thereof that is ionically associated with an anion from the group consisting of halide, sulfide, sulfite, or sulfate.

Abstract: The present invention is a method of dry fluxing metal surfaces of one or more components to be soldered, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly.

Abstract: An adsorbent and method for making it and its use in removing water from gaseous hydrogen halide. Magnesium halide supported on an activated carbon prepared under vacuum will remove water at 1 to 500 ppm.

Abstract: An adsorbent and method for removing water from gaseous HCl. MgCl.sub.2 supported on an activated carbon or silica gel substrate activated by heating to a temperature between 150.degree. C. (302.degree. F.) and 300.degree. C. (572.degree. F.) under vacuum will remove water at partial pressures of below 0.5 torr. Activation of the MgCl.sub.2 supported adsorbent can also be effected by heating the adsorbent between 270.degree. C. (518.degree. F.) and 400.degree. C. (752.degree. F.) under nitrogen.