Abstract: A method for configuring a processor includes identifying a component cooling device thermally coupled to a processor, and configuring one or more operating parameters of the processor based on the identification of the component cooling device.

Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.

Abstract: An apparatus for component cooling includes a thermoelectric cooling (TEC) device configured to be thermally coupled to a first processor, and a controller. The controller is configured to receive at least one first parameter indicative of a first activity level of the first processor; determine a TEC power level from among a plurality of TEC power levels based on the at least one first parameter; and control providing of power to the TEC device at the determined TEC power level.

Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component and a second heat transfer element configured to be thermally coupled to the heat-generating component. A manifold is configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.

Abstract: An apparatus for sub-cooling components includes a component cooling device, a processor thermally coupled to the component cooling device, an electronic component, a fan configured to direct an airflow across the processor and the electronic component, and a thermoelectric cooling device thermally coupled to the component cooling device. The thermoelectric cooling device is configured to cool the airflow from a first temperature to a second temperature.

Abstract: An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component, and a second heat transfer element. The apparatus further includes a plurality of thermally conductive paths between the first heat transfer element and the second heat transfer element. Each of the plurality of thermally conductive paths are configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element.

Abstract: A docking station for secondary external cooling for mobile computing devices, including: one or more ports for docking a mobile computing device; a docking platform for supporting the mobile computing device; a cooling element; and a thermal interface housed in the docking platform for transferring heat between the mobile computing device and the cooling element.

Abstract: A docking station for secondary external cooling for mobile computing devices, including: one or more ports for docking a mobile computing device; a docking platform for supporting the mobile computing device; a cooling element; and a thermal interface housed in the docking platform for transferring heat between the mobile computing device and the cooling element.

Abstract: A thermal module assembly, comprising: a computing expansion card; a thermal interface material (TIM) positioned on a surface of the computing expansion card; a thermal plate; and a carrier configured to hold the computing expansion card with the TIM positioned on the surface of the computing expansion card, the carrier include a first end positioned opposite to a second end, wherein the thermal plate is removably coupled to the carrier at the first end and the second end to provide an uniform pressure between the thermal plate, the TIM material, and the computing expansion card.

Abstract: A thermal module assembly, comprising: a computing expansion card; a thermal interface material (TIM) positioned on a surface of the computing expansion card; a thermal plate; and a carrier configured to hold the computing expansion card with the TIM positioned on the surface of the computing expansion card, the carrier include a first end positioned opposite to a second end, wherein the thermal plate is removably coupled to the carrier at the first end and the second end to provide an uniform pressure between the thermal plate, the TIM material, and the computing expansion card.

Abstract: Methods, systems, and computer programs encoded on computer storage medium, for detecting, across a resistive sense circuit proximate to a venting system of an IHS, a first voltage at a first time, wherein the first voltage includes a state-steady voltage and a nominal voltage; comparing the first voltage to a voltage threshold, and determining that the first voltage is less than or equal to the voltage threshold and in response, maintaining a power state of the IHS; detecting, across the resistive sense circuit, a second voltage at a second time after the first time, wherein the second voltage includes the steady-state voltage and a low-voltage; comparing the second voltage to the voltage threshold, and determining that the second voltage is greater than the threshold voltage, and in response preparing a computer-implemented response to mitigate damage to the IHS from liquid contacting one or more computing components of the IHS.

Abstract: Methods, systems, and computer programs encoded on computer storage medium, for detecting, across a resistive sense circuit proximate to a venting system of an IHS, a first voltage at a first time, wherein the first voltage includes a state-steady voltage and a nominal voltage; comparing the first voltage to a voltage threshold, and determining that the first voltage is less than or equal to the voltage threshold and in response, maintaining a power state of the IHS; detecting, across the resistive sense circuit, a second voltage at a second time after the first time, wherein the second voltage includes the steady-state voltage and a low-voltage; comparing the second voltage to the voltage threshold, and determining that the second voltage is greater than the threshold voltage, and in response preparing a computer-implemented response to mitigate damage to the IHS from liquid contacting one or more computing components of the IHS.

Abstract: A liquid cooled information handling system (LC_IHS) includes a first liquid cooled node coupled to a first chassis. The LC_IHS further includes a supply conduit in fluid communication with the first chassis to cool a first liquid cooled node. The supply conduit includes a plurality of fluid paths configured such that when a first fluid path of the plurality of fluid paths is interrupted, cooling of the first liquid cooled node continues.

Abstract: An information handling system may include an information handling resource, a heat-rejecting media thermally coupled to the information handling resource, the heat rejecting media comprising and a heatpipe structure comprising a plurality of heatpipes. The plurality of heatpipes may include a generally-cylindrical first pipe mechanically coupled at a location proximate the information handling resource and having a first cross-sectional area, a generally-cylindrical second pipe mechanically coupled to the first pipe having a second cross-sectional area less than the first cross-sectional area, and a generally-cylindrical third pipe mechanically coupled to the second pipe having a third cross-sectional area less than the second cross-sectional area, such that the second pipe is coupled between the first pipe and the third pipe and the first pipe, second pipe, and third pipe form a closed plenum, and a finstack structure comprising a plurality of fins mechanically and thermally coupled to the third pipe.

Abstract: An information handling system includes a triangular chassis and a plurality of antennas that provide optimized coverage in all directions around the triangular chassis. An antenna may be operated from each vertex of the triangular shaped base chassis. Alternatively, an antenna may be operated from each of three main side surfaces of the triangular shaped base chassis. One or more of the antennas can be selected for communication based on the ability to communicate with external network components. Disclosed systems provide omnidirectional coverage around the triangular chassis while minimizing the effects of shadowing caused by abase chassis.

Abstract: A method of assembling a direct-contact, liquid-cooled (DL) Rack Information Handling System (RIHS) includes inserting a leak containment barrier in a node enclosure provisioned with heat-generating functional components. The method also includes attaching a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. A trough of the leak containment barrier underlays a portion of the system of conduits of an LC node and forms a drain path to a drain port of the node enclosure. The method further includes mounting the LC node insertably received in one node-receiving slot having a rear section configured for blind mating of the node inlet and outlet ports to a node-receiving liquid inlet port and a node-receiving liquid outlet port positioned to be inwardly facing to the couplings of the LC node.

Abstract: A liquid cooled information handling system (LC_IHS) incudes a first liquid cooled node coupled to a first chassis. The LC_IHS further includes a supply conduit in fluid communication with the first chassis to cool a first liquid cooled node. The supply conduit includes a plurality of fluid paths configured such that when a first fluid path of the plurality of fluid paths is interrupted, cooling of the first liquid cooled node continues.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.

Abstract: An information handling system includes a triangular chassis, a plurality of graphics cards, and a plurality of air movers. An air stream of a first air mover may be axially aligned with the graphics cards and the first air mover may to direct the air stream into a first zone of the information handling systems including the graphics cards, the air stream being parallel to a longitudinal axis of the graphics cards. The first air mover may be a fan and the air flow may be laminar. A second zone of the information handling systems may include a CPU. The first zone may include a power supply unit. The air movers may be controlled independently, enabling independent control of a temperature in the first zone and a temperature in the second zone.

Abstract: A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.