Abstract: A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.

Abstract: An information handling system includes a tablet computer, which in turn includes a touch sensor, a sensor detector, and a processor. The sensor detector is configured to communicate with the touch sensor, and to detect a first fingerprint on the touch sensor. The processor is configured to communicate with the sensor detector, to determine that the first fingerprint is within a first zone of the touch sensor, to match the first fingerprint to a stored fingerprint for the first zone of the touch sensor, to determine a first input function associated with the first fingerprint based on the first fingerprint matching the stored fingerprint for the first zone, and to execute the first input function.

Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a processor, a user interface communicatively coupled to the processor, and a thermal management application. The thermal management application may include a program of instructions embodied in non-transitory computer-readable media, and may be configured to, when executed by the processor receive measurements associated with a plurality of parameters of a thermal system of the information handling system, calculate a calculated thermal resistance based on the measurements, and report information regarding the calculated thermal resistance via the user interface.

Abstract: A computer-implemented method regulates exhaust air temperature from direct interface liquid-cooled (DL) nodes in a rack information handling system (RIHS). The method includes receiving a first input corresponding to a desired ambient temperature of an exterior space and a second input is corresponding to an amount of heat being dissipated from functional components operating within an interior space of at least one LC node. An ambient temperature reading of the exterior space is received. A flow rate is calculated for liquid flowing through an air-to-liquid heat exchange (ATLHE) subsystem that results in an amount of heat exchange in the ATLHE subsystem, which generates exhaust air at a temperature that causes a change in the ambient temperature towards the desired ambient temperature. The flow rate is dynamically adjusted of the liquid flowing through the ATLHE subsystem to the calculated flow rate.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.

Abstract: A Rack Information Handling System (RIHS) has a liquid-to-liquid heat exchanger (LTLHE) that is received in a rear section of a rack and includes node-receiving supply port/s and return port/s. LTLHE includes a first liquid manifold extending between the node-receiving supply port/s and the node-receiving return port/s. LTLHE includes a second liquid manifold capable of being in sealed fluid connection to a supply conduit and a return conduit of a liquid cooling supply for fluid transfer of a second cooling liquid. LTLHE includes a transfer plate formed of thermally conductive material separating the first and second liquid manifolds for transferring heat from the first cooling liquid to the second cooling liquid. RIHS includes a node-receiving chassis configured to receive inserted liquid cooled nodes that sealingly engage for fluid transfer of the first liquid to LTLHE embedded in the rack for heat absorption and transfer by the second liquid.

Abstract: An Information Handling System (IHS) includes at least one node provisioned with heat-generating components and an air passage that enables air to pass through the node and exit the node as exhaust air. An air-to-liquid heat exchanger (ATLHE) block is placed in a path of the exhaust air. The ATLHE block has an air directing structure, one or more air movers to move the exhaust air through the air directing structure, and an ATLHE. The ATLHE includes a liquid transfer conduit having at least one liquid supply port extending into a heat transfer section, which terminates into at least one liquid return port, the liquid transfer conduit enabling cooling liquid transfer through the ATLHE. A liquid cooling subsystem includes supply and return conduits. The supply conduit is sealably mated to the at least one supply port and the return conduit is sealably mated to the at least one return port.

Abstract: A direct-contact liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes having a chassis received in a respective chassis-receiving bay of the rack and containing heat-generating functional components. The LC node configured with a system of conduits to receive direct contact of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. The chassis has a leak containment barrier configured with a trough that underlays a portion of the system of conduits of the LC node and that forms a drain path to a drain port of the chassis. In one or more embodiments, the storage drive carrier has vibration absorbing material that mitigates vibrations of a storage drive placed in the storage drive carrier.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes that include a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. The node inlet port and the node outlet port are positioned in an outward facing direction at a rear of the node enclosure and aligned to releasably seal to the respective inlet liquid port and outlet liquid port in the node-receiving slot for fluid transfer through the system of conduits. An air-spring reducer conduit is in fluid communication with the system of conduits and shaped to trap an amount of compressible fluid that compresses during sealing engagement between the node inlet coupling and node outlet coupling and the inlet liquid port and outlet liquid port, respectively.

Abstract: An information handling system includes a tablet computer, which in turn includes a touch sensor, a sensor detector, and a processor. The sensor detector is configured to communicate with the touch sensor, and to detect a first fingerprint on the touch sensor. The processor is configured to communicate with the sensor detector, to determine that the first fingerprint is within a first zone of the touch sensor, to match the first fingerprint to a stored fingerprint for the first zone of the touch sensor, to determine a first input function associated with the first fingerprint based on the first fingerprint matching the stored fingerprint for the first zone, and to execute the first input function.

Abstract: An information handling system (IHS) has a heatsink including cooling fins each having a plate structure and attached to the base in spaced parallel arrangement for receiving a first air flow that is in parallel alignment to the conductive surface. The heatsink includes a tunnel formed through the cooling fins perpendicularly to the first air flow. The IHS provides cooling air to one or more heatsinks without thermally shadowing other compute components as well as providing a second flow of cooling air to downstream component/s via the tunnel of each heatsink.

Abstract: A system for supplying cooling airflow across a plurality of wireless charging coils. More specifically in certain embodiments, the system includes a charging system which includes a partitioned airflow system for cooling a plurality of information handling systems. In certain embodiments the information handling systems comprise wireless powered information handling systems. In certain embodiments, the charging system includes a charging system housing as well as a plurality of charging transmit coils. The charging transmit coils interact with respective charging receive coils which are associated with respective information handling systems.

Abstract: In accordance with embodiments of the present disclosure, a method may include based on a power consumed by at least one information handling resource and thermal resistances associated with heat-rejecting media thermally coupled to the at least one information handling resource, calculating an exhaust temperature of the heat-rejecting media proximate to an exhaust of an enclosure housing the at least one information handling resource. The method may also include based on the exhaust temperature, controlling at least one of an operating frequency of the at least one information handling resource and a flow rate of fluid proximate to the heat-rejecting media.

Abstract: An apparatus provides conductive cooling of an information handling system. The apparatus includes a panel having a vent area formed in the panel. The vent area includes a perimeter, an interior section and a plurality of ribs that extend across the interior section. The vent area further includes several openings defined by lateral spacing between the ribs. The openings extend through the panel and are configured to receive cooling airflow into the openings and to discharge cooling air flow from the openings. A conductive heat sink layer is attached to the panel. The conductive heat sink layer covers a perimeter area surrounding the vent area, with strips of the conductive heat sink layer also covering the ribs, while leaving the openings between the ribs uncovered such that the strips of the conductive heat sink layer function to conduct additional heat away from the vent area along the ribs.

Abstract: A base chassis of an information handling system with a generally triangular profile is formed by connecting a plurality of three-dimensional sheet metal structural elements, wherein at least two of the elements have the same shape and a gusset. The gusset connects two of the structural elements. A plastic chassis assembly may be fitted over the base chassis. The plastic chassis assembly formed to received side door covers on the base chassis.

Abstract: An information handling system includes a pressure transducer and a fan controller. The pressure transducer produces a pressure reading in response to airflow through the information handling system.

Abstract: A base chassis of an information handling system with a generally triangular profile is formed by connecting a plurality of three-dimensional sheet metal structural elements, wherein at least two of the elements have the same shape and a gusset. The gusset connects two of the structural elements. A plastic chassis assembly may be fitted over the base chassis. One or more handles may also be fitted over the base chassis. They may be located at vertices of the base chassis. Side door covers may be secured by rims on the base chassis.

Abstract: A system for supplying cooling airflow across a plurality of wireless charging coils. More specifically in certain embodiments, the system includes a charging system which includes a partitioned airflow system for cooling a plurality of information handling systems. In certain embodiments the information handling systems comprise wireless powered information handling systems. In certain embodiments, the charging system includes a charging system housing as well as a plurality of charging transmit coils. The charging transmit coils interact with respective charging receive coils which are associated with respective information handling systems.

Abstract: An information handling system (IHS) has a heatsink including cooling fins each having a plate structure and attached to the base in spaced parallel arrangement for receiving a first air flow that is in parallel alignment to the conductive surface. The heatsink includes a tunnel formed through the cooling fins perpendicularly to the first air flow. The IHS provides cooling air to one or more heatsinks without thermally shadowing other compute components as well as providing a second flow of cooling air to downstream component/s via the tunnel of each heatsink.

Abstract: A system and method for improving the cooling of the skin of an information handling system. More specifically, in certain embodiments, the information handling system comprises an air moving device positioned to generate boundary layer disruption on the external skin of the system. In certain embodiments the air moving device is located within the information handling system.