Patents by Inventor Christopher W. Steffen
Christopher W. Steffen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190136579Abstract: A lock system and method for alerting a user or other entity that a lock has been or is being tampered with is disclosed. The lock includes at least one enhanced security pin that is electrically isolated from the rest of the lock. When the lock picker attempts to pick the lock a portion of the enhanced security pin contacts either the plug or the outer casing of the lock to complete a circuit with an alert component. The completion of the circuit causes the alert component to generate an alert signal that can be observed by the user or other entity.Type: ApplicationFiled: January 1, 2019Publication date: May 9, 2019Inventors: Chad M. Albertson, Eric J. Campbell, Nicholas J. Ollerich, Christopher W. Steffen
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Patent number: 10267792Abstract: A device for detecting toxic shock syndrome toxins includes a pad and a membrane coupled to the pad. The pad includes first antibodies that include a first particular antibody and a second particular antibody. Each of the first antibodies are associated with toxic shock syndrome toxin one (TSST-1). The first particular antibody is configured to react with a TSST-1 antigen to form an antibody complex. The membrane includes a first zone that includes an immobilized second antibody configured to react with the antibody complex to cause a first indication. The membrane further includes a second zone that includes a third antibody configured to react with the second particular antibody to cause a second indication.Type: GrantFiled: September 9, 2016Date of Patent: April 23, 2019Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Publication number: 20190089495Abstract: Low latency corrupt data tagging on a cross-chip link including receiving, from the cross-chip link, a control flit comprising a virtual channel identifier for an incoming data flit; storing the virtual channel identifier in a data pipeline and a bad data indicator (BDI) pipeline; receiving, from the cross-chip link, the incoming data flit into the data pipeline; moving, based on the virtual channel identifier in the data pipeline, the data flit from the data pipeline into an entry in a virtual channel queue corresponding to the virtual channel identifier; receiving, from the cross-chip link, a BDI for the data flit into the BDI pipeline; and moving, based on the virtual channel identifier in the BDI pipeline, the BDI for the data flit from the BDI pipeline into an entry in a BDI array corresponding to the entry in the virtual channel queue storing the data flit.Type: ApplicationFiled: September 19, 2017Publication date: March 21, 2019Inventors: CHAD M. ALBERTSON, ERIC J. CAMPBELL, NICHOLAS J. OLLERICH, CHRISTOPHER W. STEFFEN, CURTIS C. WOLLBRINK
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Publication number: 20190089496Abstract: Low latency corrupt data tagging on a cross-chip link including receiving, from the cross-chip link, a control flit comprising a virtual channel identifier for an incoming data flit; storing the virtual channel identifier in a data pipeline and a bad data indicator (BDI) pipeline; receiving, from the cross-chip link, the incoming data flit into the data pipeline; moving, based on the virtual channel identifier in the data pipeline, the data flit from the data pipeline into an entry in a virtual channel queue corresponding to the virtual channel identifier; receiving, from the cross-chip link, a BDI for the data flit into the BDI pipeline; and moving, based on the virtual channel identifier in the BDI pipeline, the BDI for the data flit from the BDI pipeline into an entry in a BDI array corresponding to the entry in the virtual channel queue storing the data flit.Type: ApplicationFiled: November 27, 2017Publication date: March 21, 2019Inventors: CHAD M. ALBERTSON, ERIC J. CAMPBELL, NICHOLAS J. OLLERICH, CHRISTOPHER W. STEFFEN, CURTIS C. WOLLBRINK
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Patent number: 10229872Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure is removed, and the continuous seed metal layer remains. An interconnect metal layer is formed on the continuous seed layer, and an electrically insulating material layer is formed on the interconnect metal layer. An electrically conductive support material is formed to encapsulate a majority of the interconnect metal layer, wherein the ends of the interconnect metal layer are exposed through opposing surfaces of the electrically conductive support material to provide an interconnect extending through the electrically conductive support material.Type: GrantFiled: June 20, 2018Date of Patent: March 12, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Publication number: 20190009831Abstract: A vehicle with deployable pliable fairing skirts and a controller for controlling deployment of the skirts are provided. The pliable fairing skirts are deployable over openings of wheel wells for the vehicle to provide additional streamlining for the vehicle. The pliable fairing skirts are stowable when the brakes of the vehicle may benefit from additional cooling airflow. The skirts are also stowable when environmental conditions may result in damage to the skirts or when steerable wheels of the vehicle would protrude from the opening.Type: ApplicationFiled: July 7, 2017Publication date: January 10, 2019Inventors: Chad M. ALBERTSON, Eric J. CAMPBELL, Nicholas J. OLLERICH, Christopher W. STEFFEN
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Patent number: 10167655Abstract: A lock system and method for alerting a user or other entity that a lock has been or is being tampered with is disclosed. The lock includes at least one enhanced security pin that is electrically isolated from the rest of the lock. When the lock picker attempts to pick the lock a portion of the enhanced security pin contacts either the plug or the outer casing of the lock to complete a circuit with an alert component. The completion of the circuit causes the alert component to generate an alert signal that can be observed by the user or other entity.Type: GrantFiled: January 25, 2017Date of Patent: January 1, 2019Assignee: International Business Machines CorporationInventors: Chad M. Albertson, Eric J. Campbell, Nicholas J. Ollerich, Christopher W. Steffen
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Patent number: 10170406Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method. The sacrificial trace structure having a geometry for the interconnect. The method continuous with forming a continuous seed metal layer on the sacrificial trace structure; and removing the sacrificial trace structure, wherein the continuous seed metal layer remains. An interconnect metal layer may be formed on the continuous seed layer. A dielectric material may then be formed on the interconnect metal layer to encapsulate a majority of the interconnect metal layer, wherein ends of the interconnect metal layer are exposed through one surface of the dielectric material to provide an interconnect extending into a dielectric material.Type: GrantFiled: November 21, 2017Date of Patent: January 1, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Patent number: 10167854Abstract: A shape memory article comprises a shape memory material that transitions to a first shape from a second shape when a temperature of the shape memory material exceeds a threshold temperature. A plurality of microcapsules is in thermal contact with the shape memory material. Each microcapsule in the plurality of microcapsules has a first compartment, a second compartment, and an isolating structure separating the first and second compartments. The isolating structure is rupturable in response to a stimulus. The first compartments each contain a first component, and the second compartments each contain a second component that reacts with the first component to produce heat.Type: GrantFiled: July 28, 2016Date of Patent: January 1, 2019Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Publication number: 20180372975Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.Type: ApplicationFiled: August 1, 2018Publication date: December 27, 2018Inventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Publication number: 20180341078Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.Type: ApplicationFiled: August 1, 2018Publication date: November 29, 2018Inventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Publication number: 20180315694Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure is removed, and the continuous seed metal layer remains. An interconnect metal layer is formed on the continuous seed layer, and an electrically insulating material layer is formed on the interconnect metal layer. An electrically conductive support material is formed to encapsulate a majority of the interconnect metal layer, wherein the ends of the interconnect metal layer are exposed through opposing surfaces of the electrically conductive support material to provide an interconnect extending through the electrically conductive support material.Type: ApplicationFiled: June 20, 2018Publication date: November 1, 2018Inventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Patent number: 10116260Abstract: A system includes a voltage controlled oscillator (VCO) having an adjustable amplitude. The amplitude of the VCO may be adjusted by adjusting voltage level present at a center tap node of an inductor. The VCO may have an adjustable amplitude that may be programmed on a chip-by-chip basis based on a chip parameter, power consumption, or oscillator performance.Type: GrantFiled: December 16, 2015Date of Patent: October 30, 2018Assignee: International Business Machines CorporationInventors: Andrew D. Davies, David M. Friend, Christopher W. Steffen, James D. Strom
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Publication number: 20180310403Abstract: A method of forming an multi-chip carrier that includes providing a trace structure using an additive forming method. The method includes forming a metal layer on a trace structure to provide electrically conductive lines. A dielectric material may then be formed on the electrically conductive lines to encapsulate a majority of the electrically conductive lines. The ends of the electrically conductive lines that are exposed through the upper surface of the dielectric material provide a top processor mount location and the ends of the electrically conductive lines that are exposed through the sidewalls of the dielectric material provide a sidewall processor mount location.Type: ApplicationFiled: April 21, 2017Publication date: October 25, 2018Inventors: Chad M. Albertson, Eric J. Campbell, Nicholas J. Ollerich, Christopher W. Steffen
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Patent number: 10088642Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.Type: GrantFiled: November 9, 2016Date of Patent: October 2, 2018Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Patent number: 10080951Abstract: Embodiments herein describe techniques for operating an omnidirectional treadmill, the techniques include receiving VR (virtual reality) topographical information comprising a VR environment, and displaying the VR environment to a user wearing a headset. VR topographical information includes information about VR elements in front of the user in the VR environment relative to a facing direction of the user in the VR environment. The method includes sending topographical signals to active elements in an omnidirectional treadmill based upon the VR topographical information where the omnidirectional treadmill permits the user to move along at least two perpendicular directions of motion on a surface of the omnidirectional treadmill. The techniques include activating the active elements, based upon the VR topographical signals, to physically simulate the VR elements in the VR topographical information on the surface by at least one of expanding or contracting the active elements.Type: GrantFiled: August 19, 2016Date of Patent: September 25, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Patent number: 10056324Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure is removed, and the continuous seed metal layer remains. An interconnect metal layer is formed on the continuous seed layer, and an electrically insulating material layer is formed on the interconnect metal layer. An electrically conductive support material is formed to encapsulate a majority of the interconnect metal layer, wherein the ends of the interconnect metal layer are exposed through opposing surfaces of the electrically conductive support material to provide an interconnect extending through the electrically conductive support material.Type: GrantFiled: November 9, 2016Date of Patent: August 21, 2018Assignee: International Business Machines CorporationInventors: Daniel J. Buvid, Eric J. Campbell, Sarah K. Czaplewski, Christopher W. Steffen
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Publication number: 20180209172Abstract: A lock system and method for alerting a user or other entity that a lock has been or is being tampered with is disclosed. The lock includes at least one enhanced security pin that is electrically isolated from the rest of the lock. When the lock picker attempts to pick the lock a portion of the enhanced security pin contacts either the plug or the outer casing of the lock to complete a circuit with an alert component. The completion of the circuit causes the alert component to generate an alert signal that can be observed by the user or other entity.Type: ApplicationFiled: January 25, 2017Publication date: July 26, 2018Inventors: Chad M. Albertson, Eric J. Campbell, Nicholas J. Ollerich, Christopher W. Steffen
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Publication number: 20180209173Abstract: A lock system and method for alerting a user or other entity that a lock has been or is being tampered with is disclosed. The lock includes at least one enhanced security pin that is electrically isolated from the rest of the lock. When the lock picker attempts to pick the lock a portion of the enhanced security pin contacts either the plug or the outer casing of the lock to complete a circuit with an alert component. The completion of the circuit causes the alert component to generate an alert signal that can be observed by the user or other entity.Type: ApplicationFiled: August 24, 2017Publication date: July 26, 2018Inventors: Chad M. Albertson, Eric J. Campbell, Nicholas J. Ollerich, Christopher W. Steffen
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Patent number: 10030416Abstract: A lock system and method for alerting a user or other entity that a lock has been or is being tampered with is disclosed. The lock includes at least one enhanced security pin that is electrically isolated from the rest of the lock. When the lock picker attempts to pick the lock a portion of the enhanced security pin contacts either the plug or the outer casing of the lock to complete a circuit with an alert component. The completion of the circuit causes the alert component to generate an alert signal that can be observed by the user or other entity.Type: GrantFiled: August 24, 2017Date of Patent: July 24, 2018Assignee: International Business Machines CorporationInventors: Chad M. Albertson, Eric J. Campbell, Nicholas J. Ollerich, Christopher W. Steffen