Abstract: Provided is a semiconductor device and a method for its fabrication. The device includes a semiconductor substrate, a first silicide in a first region of the substrate, and a second silicide in a second region of the substrate. The first silicide may differ from the second silicide. The first silicide and the second silicide may be an alloy silicide.

Abstract: A microelectronic device includes a substrate, and a patterned feature located over the substrate and a plurality of doped regions, wherein the patterned feature includes at least one electrode. The microelectronic device includes at least one sill region for the enhancement of electron and/or hole mobility.

Abstract: According to the present invention, the integrated circuit includes isolation field regions on a semiconductor substrate. Gate dielectrics are formed on a surface of a substrate. Gate electrodes are formed on the gate dielectrics. A photo resist is formed covering the active regions. Dummy patterns are selectively etched. A dummy substrate is selectively etched. The photo resist is then removed. A pair of spacers is formed along opposite sidewalls of the gate electrode and the gate dielectric. The source and drain are formed on the surface of said substrate and on opposite sides of the gate. Silicide is formed on the gate electrode, source, and drain. A layer of inter-level dielectric is then formed. A contact opening and metal wiring are then formed.

Abstract: A high-K gate dielectric stack for a MOSFET gate structure to reduce Voltage threshold (Vth) shifts and method for forming the same, the method including providing a high-K gate dielectric layer over a semiconductor substrate; forming a buffer dielectric layer on the high-K gate dielectric including a dopant selected from the group consisting of a metal, a semiconductor, and nitrogen; forming a gate electrode layer on the buffer dielectric layer; and, lithographically patterning the gate electrode layer and etching to form a gate structure.

Abstract: A semiconductor device having a plurality of silicidation steps is provided. In the preferred embodiment in which the semiconductor device is a MOSFET, the source/drain regions are silicided. A dielectric layer is formed and the etch stop layer is removed from the gate electrode of the MOSFET. A second silicidation process is performed to silicide the gate electrode. The process may be performed individually for each transistor, allowing the electrical characteristics of each transistor to be determined individually.

Abstract: A semiconductor device having a plurality of silicidation steps is provided. In the preferred embodiment in which the semiconductor device is a MOSFET, the source/drain regions are silicided. A dielectric layer is formed and the etch stop layer is removed from the gate electrode of the MOSFET. A second silicidation process is performed to silicide the gate electrode. The process may be performed individually for each transistor, allowing the electrical characteristics of each transistor to be determined individually.

Abstract: Provided is a semiconductor device and a method for its fabrication. The device includes a semiconductor substrate, a first silicide in a first region of the substrate, and a second silicide in a second region of the substrate. The first silicide may differ from the second silicide. The first silicide and the second silicide may be an alloy silicide.