Patents by Inventor Chun-An Shen

Chun-An Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11188129
    Abstract: An expansion hinge including a torque module, two first brackets, two sliding brackets, two second brackets and two elastic modules is provided. The torque module is configured to provide torques. The two first brackets are rotatably connected to two opposite ends of the torque module. The two sliding brackets are rotatably connected to the two opposite ends of the torque module. The two second brackets are slidably disposed in the two sliding brackets respectively. Each of the two elastic modules is disposed between the respective sliding bracket and the respective second bracket. The two sliding brackets are adapted to synchronously slide with respect to the two second brackets, and each of the elastic modules is configured to push the respective sliding bracket and the respective second bracket to form a pulled-out state or a pushed-in state.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: November 30, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Che-Hsien Lin, Chun-An Shen
  • Publication number: 20210359099
    Abstract: Devices, such as transistors, that use bismuth to create ohmic contacts are provided, as are methods of manufacturing the same. The transistors, such as field-effect transistors, can include one or more two-dimensional materials, and electrical contact areas can be created on the two-dimensional material(s) using bismuth. The bismuth can help to provide energy-barrier free, ohmic contacts, and the resulting devices can have performance levels that rival or exceed state-of-the-art devices that utilize three-dimensional materials, like silicon. The two-dimensional materials can include transition metal dichalcogenides, such as molybdenum disulfide.
    Type: Application
    Filed: May 13, 2021
    Publication date: November 18, 2021
    Inventors: Pin-Chun Shen, Jing Kong
  • Patent number: 11035160
    Abstract: A synchronous hinge module includes a first axle, a second axle, a third axle, a fourth axle, at least one central frame, at least two connecting bases, a plurality of first baffle plates, at least two side frames, and a plurality of second baffle plates. The at least one central frame is disposed around the first axle and the second axle. The at least two connecting bases are engaged with two opposite ends of the at least one central frame respectively. The plurality of first baffle plates is respectively disposed around the first axle, the third axle and the second axle, the fourth axle. Each of the first baffle plates extends outside each of the at least two connecting bases and the at least one central frame.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: June 15, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Che-Hsien Lin, Tsai-Ta Teng, Che-Hsien Chu, Hung-Jui Lin, Chun-An Shen, Ko-Yen Lu, Po-Hsiang Hu
  • Patent number: 10954346
    Abstract: An ink is provided, which includes a resin, UV curable monomer, and photo initiator. The resin is formed by reacting a plurality of end capping agents with a dendrimer compound in an environment including esterification catalyst, inhibitor, and first solvent. The dendrimer compound is formed by reacting a multi-hydroxy compound and a plurality of hydroxy-containing epoxy compounds in an environment including alkaline catalyst and second solvent. The multi-hydroxy compound and the hydroxy-containing epoxy compounds have a molar ratio of 1:6 to 1:20, and the multi-hydroxy compound and the end capping agents have a molar ratio of 1:6 to 1:20. The end capping agents include acrylic acid, methacrylic acid, glycidyl methacrylate, or 2-amino acrylic acid. The resin and the UV curable monomer have a weight ratio of 100:30 to 100:5000, and the resin and the photo initiator have a weight ratio of 100:30 to 100:500.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: March 23, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsi-Kang Shih, Shinn-Jen Chang, Chung Huan Hsu, Yu Chun Shen
  • Patent number: 10892728
    Abstract: Devices, system and methods a circuit, including a resistor, a normal capacitor and a ferroelectric capacitor connected in series. An input terminal to provide an input voltage across the circuit. An output terminal to deliver an output voltage taken across the normal capacitor. The circuit comprises a ferroelectric layer sandwiched between a first buffer layer and a second buffer layer. The first buffer layer contacts a portion of a first metal layer and first metal layer extends beyond the first buffer layer. A dielectric layer sandwiched between a second metal layer and a third metal layer. Such that the second metal layer extends beyond the dielectric layer and in contact with the second buffer layer. Wherein the ferroelectric capacitor is formed by the first metal layer. The ferroelectric layer sandwiched between the first buffer layer and the second buffer layer, and the second metal layer.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: January 12, 2021
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Koon Hoo Teo, Pin Chun Shen, Chungwei Lin
  • Patent number: 10884461
    Abstract: A hinge module includes a housing and at least one carrying assembly. The housing includes two accommodation spaces. The at least one carrying assembly is disposed at the housing and includes a torque element, two rotation shafts and two brackets. The torque element is disposed in one of the accommodation spaces. The two rotation shafts pass through the torque element. The two brackets are respectively connected to the two rotation shafts and located outside the housing. Each bracket is adapted to rotate along with the corresponding rotation shaft and rotate relative to the torque element.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: January 5, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Che-Hsien Lin, Che-Hsien Chu, Chun-An Shen
  • Patent number: 10876337
    Abstract: A sliding hinge including a torque module, two brackets, a support plate, a driving gear set, and a sliding bracket is provided. The torque module has a first shaft and a second shaft adapted to rotate in opposite directions and produce a torque. The brackets are respectively disposed on the first shaft and the second shaft. The support plate is disposed on one of the brackets. The driving gear set is disposed on the support plate and coupled to the first shaft. The sliding bracket is coupled to the driving gear set and slidably disposed on a top surface of the support plate. The brackets are adapted to rotate relative to the torque module by the first shaft and the second shaft, such that the brackets are overlapped or unfolded with each other while the driving gear set drives the sliding bracket to slide along the support plate.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: December 29, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Che-Hsien Lin, Ko-Yen Lu, Che-Hsien Chu, Chun-An Shen
  • Patent number: 10837209
    Abstract: A hinge module includes a first bracket, a second bracket, a pivot assembly, a pressing component and an adjusting structure. The first bracket has at least one first sliding slot. The first bracket and the second bracket are pivoted to each other by the pivot assembly, wherein the pivot assembly has a first sliding portion that is slidably disposed in the first sliding slot. The pressing component is connected to the first bracket and the first sliding portion. The adjusting structure is connected to the pressing component that presses the first sliding portion by the adjusting structure. When the first bracket and the second bracket rotate relative to each other, the first sliding portion slides along the first sliding slot, and the hinge module generates a torsional force by continuously pressing the first sliding portion by the pressing component. In addition, an electronic device including the hinge module is provided.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: November 17, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Che-Hsien Lin, Chun-An Shen, Che-Hsien Chu
  • Patent number: 10833102
    Abstract: Devices and methods of a transistor device that include a flexible memory cell. The flexible memory cell having a gate stack with sidewalls provided over a substrate. The gate stack including a metal gate layer provided over the substrate. A buffer layer provided over the metal gate layer. A ferroelectric layer provided over the buffer layer. A dielectric layer provided over the ferroelectric layer. Further, a two-dimensional (2D) material layer provided over a portion of a top surface of the dielectric layer. Source and drain regions provided on separate portions of the top surface of the dielectric layer so as to create a cavity that the 2D material layer are located.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: November 10, 2020
    Assignee: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Koon Hoo Teo, Pin-Chun Shen, Chungwei Lin
  • Patent number: 10824204
    Abstract: A hinge module including a first rotating shaft, a second rotating shaft, a sliding member, a first torque member, and a second torque member is provided. The sliding member coupled to the first rotating shaft and the second rotating shaft simultaneously. The first rotating shaft and the second rotating shaft are rotated synchronously via the sliding member. The first torque member and the second torque member are connected to the first rotating shaft and the second rotating shaft, and the first torque member and the second torque member are located at opposite sides of a sliding range of the sliding member. A foldable electronic device is also provided.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: November 3, 2020
    Assignee: COMPAL ELECTRONIC, INC.
    Inventors: Che-Hsien Lin, Che-Hsien Chu, Chun-An Shen
  • Publication number: 20200303417
    Abstract: Devices and methods of a transistor device that include a flexible memory cell. The flexible memory cell having a gate stack with sidewalls provided over a substrate. The gate stack including a metal gate layer provided over the substrate. A buffer layer provided over the metal gate layer. A ferroelectric layer provided over the buffer layer. A dielectric layer provided over the ferroelectric layer. Further, a two-dimensional (2D) material layer provided over a portion of a top surface of the dielectric layer. Source and drain regions provided on separate portions of the top surface of the dielectric layer so as to create a cavity that the 2D material layer are located.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 24, 2020
    Applicant: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Koon Hoo Teo, Pin-Chun Shen, Chungwei Lin
  • Patent number: 10777877
    Abstract: A wireless access point includes a physical form factor including a plurality of sides each adjacent to a bottom portion, wherein the physical form factor houses a plurality of components including i) at least one Printed Circuit Board (PCB) having one or more Wi-Fi radios and a Bluetooth radio and ii) a power supply; and an electrical plug connected to the power supply and extending from the bottom portion for insertion into an electrical outlet for power and for physical support of the wireless access point adjacent to the electrical plug.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: September 15, 2020
    Assignee: Plume Design, Inc.
    Inventors: Ming-Tsung Su, Brian Nam, Irene Yang, Guan-Heng Chen, Jeffrey ChiFai Liew, Nora Yan, Yoseph Malkin, Richard Chang, Liem Hieu Dinh Vo, Shu-Chun Shen, Duc Minh Nguyen, William McFarland
  • Publication number: 20200256099
    Abstract: A hinge module includes a first bracket, a second bracket, a pivot assembly, a pressing component and an adjusting structure. The first bracket has at least one first sliding slot. The first bracket and the second bracket are pivoted to each other by the pivot assembly, wherein the pivot assembly has a first sliding portion that is slidably disposed in the first sliding slot. The pressing component is connected to the first bracket and the first sliding portion. The adjusting structure is connected to the pressing component that presses the first sliding portion by the adjusting structure. When the first bracket and the second bracket rotate relative to each other, the first sliding portion slides along the first sliding slot, and the hinge module generates a torsional force by continuously pressing the first sliding portion by the pressing component. In addition, an electronic device including the hinge module is provided.
    Type: Application
    Filed: July 16, 2019
    Publication date: August 13, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Che-Hsien Lin, Chun-An Shen, Che-Hsien Chu
  • Publication number: 20200207923
    Abstract: An ink is provided, which includes a resin, UV curable monomer, and photo initiator. The resin is formed by reacting a plurality of end capping agents with a dendrimer compound in an environment including esterification catalyst, inhibitor, and first solvent. The dendrimer compound is formed by reacting a multi-hydroxy compound and a plurality of hydroxy-containing epoxy compounds in an environment including alkaline catalyst and second solvent. The multi-hydroxy compound and the hydroxy-containing epoxy compounds have a molar ratio of 1:6 to 1:20, and the multi-hydroxy compound and the end capping agents have a molar ratio of 1:6 to 1:20. The end capping agents include acrylic acid, methacrylic acid, glycidyl methacrylate, or 2-amino acrylic acid. The resin and the UV curable monomer have a weight ratio of 100:30 to 100:5000, and the resin and the photo initiator have a weight ratio of 100:30 to 100:500.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 2, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsi-Kang SHIH, Shinn-Jen CHANG, Chung Huan HSU, Yu Chun SHEN
  • Publication number: 20200204139
    Abstract: Devices, system and methods a circuit, including a resistor, a normal capacitor and a ferroelectric capacitor connected in series. An input terminal to provide an input voltage across the circuit. An output terminal to deliver an output voltage taken across the normal capacitor. The circuit comprises a ferroelectric layer sandwiched between a first buffer layer and a second buffer layer. The first buffer layer contacts a portion of a first metal layer and first metal layer extends beyond the first buffer layer. A dielectric layer sandwiched between a second metal layer and a third metal layer. Such that the second metal layer extends beyond the dielectric layer and in contact with the second buffer layer. Wherein the ferroelectric capacitor is formed by the first metal layer. The ferroelectric layer sandwiched between the first buffer layer and the second buffer layer, and the second metal layer.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 25, 2020
    Applicant: Mitsubishi Electric Research Laboratories, Inc.
    Inventors: Koon Hoo Teo, Pin Chun Shen, Chungwei Lin
  • Publication number: 20200192437
    Abstract: An expansion hinge including a torque module, two first brackets, two sliding brackets, two second brackets and two elastic modules is provided. The torque module is configured to provide torques. The two first brackets are rotatably connected to two opposite ends of the torque module. The two sliding brackets are rotatably connected to the two opposite ends of the torque module. The two second brackets are slidably disposed in the two sliding brackets respectively. Each of the two elastic modules is disposed between the respective sliding bracket and the respective second bracket. The two sliding brackets are adapted to synchronously slide with respect to the two second brackets, and each of the elastic modules is configured to push the respective sliding bracket and the respective second bracket to form a pulled-out state or a pushed-in state.
    Type: Application
    Filed: November 27, 2019
    Publication date: June 18, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Che-Hsien Lin, Chun-An Shen
  • Publication number: 20200162042
    Abstract: A linearity improving system and a linearity improving method are provided. The linearity improving system includes a coupler, a downconverter and a transformer. The coupler is configured to couple a part of an input RF signal. The downconverter coupled to the coupler converts the input RF signal to a fundamental frequency and outputs a modulation signal. The transformer coupled to the downconverter adjusts a phase and a power of the modulation signal. After the input RF signal and the modulation signal being adjusted are inputted to an amplifier, the amplifier outputs an output RF signal.
    Type: Application
    Filed: December 24, 2018
    Publication date: May 21, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Cheng LIU, Chih-Chun SHEN
  • Patent number: 10637415
    Abstract: A linearity improving system and a linearity improving method are provided. The linearity improving system includes a coupler, a downconverter and a transformer. The coupler is configured to couple a part of an input RF signal. The downconverter coupled to the coupler converts the input RF signal to a fundamental frequency and outputs a modulation signal. The transformer coupled to the downconverter adjusts a phase and a power of the modulation signal. After the input RF signal and the modulation signal being adjusted are inputted to an amplifier, the amplifier outputs an output RF signal.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: April 28, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Cheng Liu, Chih-Chun Shen
  • Patent number: D886819
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: June 9, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Shu-Hung Lin, Wang-Hung Yeh, Hsin-Chieh Fang, Ching-Shiang Chang, Che-Hsien Lin, Che-Hsien Chu, Chun-An Shen
  • Patent number: D890748
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: July 21, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Shu-Hung Lin, Wang-Hung Yeh, Hsin-Chieh Fang, Ching-Shiang Chang, Che-Hsien Lin, Che-Hsien Chu, Chun-An Shen