Patents by Inventor Chun-Hung Liu
Chun-Hung Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240142664Abstract: Two types of blue light blocking contact lenses are provided and are formed by curing different compositions. The first composition includes a blue light blocking component formed by mixing or reacting a first hydrophilic monomer and a yellow dye, a first colored dye component formed by mixing or reacting a second hydrophilic monomer and a first colored dye, at least one third hydrophilic monomer, a crosslinker, and an initiator. The first colored dye includes a green dye, a cyan dye, a blue dye, an orange dye, a red dye, a black dye, or combinations thereof. The second composition includes a blue light blocking component, at least one hydrophilic monomer, a crosslinker, and an initiator. The blue light blocking component is formed by mixing or reacting glycerol monomethacrylate and a yellow dye. Further, methods for preparing the above contact lenses are provided.Type: ApplicationFiled: February 12, 2023Publication date: May 2, 2024Inventors: Han-Yi CHANG, Chun-Han CHEN, Tsung-Kao HSU, Wei-che WANG, Yu-Hung LIN, Wan-Ying GAO, Li-Hao LIU
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Publication number: 20240145691Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.Type: ApplicationFiled: March 14, 2023Publication date: May 2, 2024Inventors: CHUAN-PU LIU, YIN-WEI CHENG, SHIH-AN WANG, BO-LIANG PENG, CHUN-HUNG CHEN, JUN-HAN HUANG, YI-CHANG LI
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Patent number: 11966107Abstract: An anti-peep display device includes a display module and an anti-peep module disposed on the display module. The anti-peep module includes the following features. The first light incident surface faces the display surface, the second and third light incident surfaces are located on opposite sides of the first light incident surface, the first condensing portion is disposed corresponding to the second light incident surface and the first light source, the second condensing portion is disposed corresponding to the third light incident surface and the second light source, the first and second condensing portions convert beams of the first and second light sources into anti-peep beams with a beam angle less than 10 degrees, and the optical microstructures reflect the anti-peep beams and exit the anti-peep beams from the light guide plate. The present invention also provides an anti-peep method applicable to the anti-peep display device.Type: GrantFiled: June 14, 2023Date of Patent: April 23, 2024Assignee: CHAMP VISION DISPLAY INC.Inventors: Chung-Hao Wu, Hsin-Hung Lee, Chin-Ku Liu, Chun-Chien Liao, Wei-Jhe Chien
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Publication number: 20240126341Abstract: Smart rings and methods of manufacturing smart rings are provided. A waterproof design and method of manufacturing of a smart ring, in accordance with one implementation, includes a band having at least an outer surface and an inner surface. The inner surface of the band includes features configured to support electronic components. The waterproofing design and method of manufacturing includes a laser etching a portion of the inner surface and subsequent to the laser etching of the portion, applying an epoxy over the electronic components and over the laser etched portion of the inner surface. Prior to the laser etching, forming an edge rib on the portion of the inner surface, wherein the laser etching is subsequently on the edge rib. Furthermore, the laser etched portion includes an increased contact area for bonding with the epoxy for the waterproof design.Type: ApplicationFiled: February 3, 2023Publication date: April 18, 2024Inventors: Ming-Tsung Su, Hao-Hsiu Huang, Chun Hung Liu
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Patent number: 11950016Abstract: The present invention provides a control method of a receiver. The control method includes the steps of: when the receiver enters a sleep/standby mode, continually detecting an auxiliary signal from an auxiliary channel to generate a detection result; and if the detection result indicates that the auxiliary signal has a preamble or a specific pattern, generating a wake-up control signal to wake up the receiver before successfully receiving the auxiliary signal having a wake-up command.Type: GrantFiled: April 15, 2020Date of Patent: April 2, 2024Assignee: MEDIATEK INC.Inventors: Chun-Chia Chen, Chih-Hung Pan, Chia-Chi Liu, Shun-Fang Liu, Meng-Kun Li, Chao-An Chen
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Publication number: 20240096834Abstract: A method is provided. The method includes determining a first bump map indicative of a first set of positions of bumps. The method includes determining, based upon the first bump map, a first plurality of bump densities associated with a plurality of regions of the first bump map. The method includes smoothing the first plurality of bump densities to determine a second plurality of bump densities associated with the plurality of regions of the first bump map. The method includes determining, based upon the second plurality of bump densities, a second bump map indicative of the first set of positions of the bumps and a set of sizes of the bumps.Type: ApplicationFiled: March 27, 2023Publication date: March 21, 2024Inventors: Shih Hsuan HSU, Chan-Chung CHENG, Chun-Chen LIU, Cheng-Hung CHEN, Peng-Ren CHEN, Wen-Hao CHENG, Jong-l MOU
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Publication number: 20240096781Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.Type: ApplicationFiled: March 20, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
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Patent number: 11933309Abstract: A method for controlling a fan in a fan start-up stage including a first time period and a second time period comprises the following steps of: during the first time period, continuously providing a first driving signal to drive the fan; and during the second time period, continuously providing a second driving signal to drive the fan; wherein, the signal value of the first driving signal gradually decreases until being equal to the signal value of the second driving signal. Wherein the signal value of the first driving signal non-linearly decreases, the signal value of the second driving signal is an unchanged value. Wherein, the first time period and the second time period are adjusted for a different fan but the sum of the first time period and the second time period is always the same. A fan is also disclosed.Type: GrantFiled: July 22, 2022Date of Patent: March 19, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Yi-Fan Lin, Chung-Hung Tang, Cheng-Chieh Liu, Chun-Lung Chiu
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Publication number: 20240074826Abstract: A surgical robot including at least one contact module, a control connection module, at least one first robotic arm, and at least one grip control device. A first transmission member of the control connection module drives the control module through a first transmission connecting member. A first shaft member of the first robotic arm is connected with the first transmission member while the grip control device is connected with the first robotic arm by a transmission interface. A force sensing member of the first robotic arm detects a first reaction force from the contact module so that the first robotic arm sends a feedback control signal to the grip control device to control a grip driving member to generate a force feedback for allowing a grip portion to move. Thereby, users can feel movement of the grip portion caused by the force feedback to avoid accidental iatrogenic injuries.Type: ApplicationFiled: September 14, 2022Publication date: March 7, 2024Inventors: PO-YUN LIU, CHUN-HUNG KUO, CHIH-CHENG CHIEN, YEN-CHIEH WANG
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Patent number: 11899367Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.Type: GrantFiled: December 12, 2022Date of Patent: February 13, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
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Publication number: 20230273524Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.Type: ApplicationFiled: December 12, 2022Publication date: August 31, 2023Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
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Patent number: 11578838Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.Type: GrantFiled: April 19, 2022Date of Patent: February 14, 2023Assignee: EPISTAR CORPORATIONInventors: Chiu-Lin Yao, Min-Hsun Hsieh, Been-Yu Liaw, Wei-Chiang Hu, Po-Hung Lai, Chun-Hung Liu, Shih-An Liao, Yu-His Sung, Ming-Chi Hsu
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Publication number: 20230017939Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section vieType: ApplicationFiled: September 19, 2022Publication date: January 19, 2023Inventors: Shih-An LIAO, Shau-Yi CHEN, Ming-Chi HSU, Chun-Hung LIU, Min-Hsun HSIEH
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Patent number: 11526081Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.Type: GrantFiled: July 2, 2021Date of Patent: December 13, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
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Patent number: 11519564Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.Type: GrantFiled: July 6, 2021Date of Patent: December 6, 2022Assignee: EPISTAR CORPORATIONInventors: Chiu-Lin Yao, Min-Hsun Hsieh, Been-Yu Liaw, Wei-Chiang Hu, Po-Hung Lai, Chun-Hung Liu, Shih-An Liao, Yu-His Sung, Ming-Chi Hsu
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Publication number: 20220382145Abstract: A method includes generating an electron beam from a radiation source; modifying an energy distribution of the electron beam through a first shaping aperture; and exposing a substrate to portions of the electron beam passing through the first shaping aperture. The first shaping aperture comprises blocking strips with a plurality of slots therebetween, a frame surrounding the blocking strips, and a diagonal support connected to the frame and one of the blocking strips.Type: ApplicationFiled: August 9, 2022Publication date: December 1, 2022Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wen LO, Shih-Ming CHANG, Chun-Hung LIU
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Patent number: 11467488Abstract: A method of operating a semiconductor apparatus includes forming a first electron beam passing through a first shaping aperture; modifying an energy distribution of the first electron beam by a second shaping aperture, such that the first electron beam has a main region and an edge region having a greater energy than the main region; and exposing a workpiece to the main region and the edge region of the first electron beam to create a pattern.Type: GrantFiled: June 14, 2019Date of Patent: October 11, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wen Lo, Shih-Ming Chang, Chun-Hung Liu
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Patent number: 11450639Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section vieType: GrantFiled: February 1, 2021Date of Patent: September 20, 2022Assignee: EPISTAR CORPORATIONInventors: Shih-An Liao, Shau-Yi Chen, Ming-Chi Hsu, Chun-Hung Liu, Min-Hsun Hsieh
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Publication number: 20220252228Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.Type: ApplicationFiled: April 19, 2022Publication date: August 11, 2022Inventors: Chiu-Lin YAO, Min-Hsun HSIEH, Been-Yu LIAW, Wei-Chiang HU, Po-Hung LAI, Chun-Hung LIU, Shih-An LIAO, Yu-His SUNG, Ming-Chi HSU
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Patent number: D993199Type: GrantFiled: December 21, 2020Date of Patent: July 25, 2023Assignees: EPISTAR CORPORATION, YENRICH TECHNOLOGY CORPORATIONInventors: Min-Hsun Hsieh, Jen-Chieh Yu, Chun-Wei Chen, Chun-Hung Liu