Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.

Abstract: An optical photographing system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element has an image-side surface being convex in a paraxial region thereof. The third lens element has positive refractive power. The fourth lens element has an object-side surface being concave in a paraxial region thereof. The fifth lens element with positive refractive power has two surfaces being both aspheric. The sixth lens element has an image-side surface being concave in a paraxial region thereof, wherein the surfaces of the sixth lens element are both aspheric, and the image-side surface of the sixth lens element includes at least one convex shape in an off-axial region thereof.

Abstract: An electronic device is provided. The electronic device includes a first dielectric layer, an electronic element, an encapsulant, and a second dielectric layer. The first dielectric layer has a first coefficient of thermal expansion (CTE). The electronic element is disposed over the first dielectric layer. The encapsulant encapsulates the electronic element and has a second CTE. The second dielectric layer is disposed over the encapsulant and having a third CTE. The second CTE ranges between the first CTE and the third CTE.

Abstract: An antenna correcting system is provided. The antenna correction system compares amplitudes of antenna signals that are emitted or received respectively by a plurality of antenna units with each other to select one of the amplitudes as target amplitude. The antenna correction system corrects the amplitude of each of the antenna signals according to the target amplitude. As a result, the amplitudes of the antenna signals are the same as each other or approximate to each other. After the amplitudes of the antenna signals are corrected, the antenna correction system compares phases of the antenna signals with each other to select one of the phases as a target phase. The antenna correction system corrects the phase of each of the antenna signals according to the target phase. As a result, the phases of the antenna signals are the same as each other or approximate to each other.

Abstract: A composite encapsulation material is provided, which includes (A) a polymer glue material and (B) a viscosity modifier. The viscosity modifier (B) has a functional group capable of forming non-covalent interaction with the polymer glue material (A). At room temperature, the ratio (log(?0)/log(?28 )) of the logarithm of the viscosity ((log(?0)) of the composite encapsulation material at the shear rate of 1×10?3 s?1 to the logarithm of the viscosity (log(??)) of the composite encapsulation material at the shear rate of 1×102 s?1 is 1.1-2.5.

Abstract: A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure is formed in the first substrate. The method includes bonding the first substrate to a carrier. The method includes thinning down the first substrate. The method also includes forming a dielectric material in the recess and over a top surface of the thinned first substrate. The method further includes performing a planarization process to remove the dielectric material and expose the conductive structure over the top surface. In addition, the method includes removing the carrier from the first substrate.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. In certain configurations, the UE enters a first radio resource control (RRC) connection with a first base station of a first network. The UE receives, from the first base station, an indication that enables the UE to send a first request for deactivating or releasing resources used for communications with the first base station. In response to a determination to enter a second RRC connection with a second base station of a second network, the UE sends, to the first base station, the first request for deactivating or releasing the resources. The UE enters the second RRC connection with the second base station while maintaining the first RRC connection with the first base station.

Abstract: A concentrated solar power storage system and method convert water into water vapor by the solar thermal energy, and the water vapor further operates a hydroelectric power generation system with a water storage (or an energy storage capsule) through a repeated conversion process.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A casing structure of electronic device including a metal base plate, a transparent cathodic electrodeposition paints layer, and a transparent paints coating layer is provided. The metal base plate has brushed texture and high gloss surface. The transparent cathodic electrodeposition paints layer is disposed on the base metal base plate. The transparent paints coating layer is disposed on the transparent cathodic electrodeposition paints layer. A manufacturing method of casing structure of electronic device is also provided.

Abstract: A control device is provided. A key structure of the control device includes a keycap, an optical film layer and a membrane switch. A protrusion structure is formed on the optical film layer or the membrane switch. When the keycap is pressed down by the user, the arrangement of the protrusion structure can facilitate the user to trigger the underlying membrane switch more precisely.

Abstract: A flexible flat cable (FFC) includes a first insulation layer, at least one pair of conductors, a plurality of low-k dielectric layers, two second insulation layers, and at least one shielding layer. The pair of conductors is located within the first insulation layer. Each pair of conductors includes a plurality of first conductors, and the first conductors are axially extending and arranged in parallel. The low-k dielectric layers are embedded in the first insulation layer. Each of the pair of conductors or each of the first conductors is covered and surrounded with one low-k dielectric layer. The two second insulation layers are located on two surfaces of the first insulation layer. The shielding layer is located on the two second insulation layers opposite to the first insulation layer.

Abstract: Herein disclosed is a voltage isolation circuit coupled to power supplies. The voltage isolation circuit comprises a series switch group controlled by a first control signal, a parallel switch group controlled by a second control signal, and a first high impedance element. The series switch group comprises a transistor arranged in a first current loop and having two channels connected to one of the power supplies respectively. The first high impedance element, coupled to the transistor in parallel, has a measurement terminal and two ends, connected to one of the power supplies respectively. When the series switch group is conducted, the power supplies are coupled in series in the first current loop. When the parallel switch group is conducted, the power supplies are coupled in parallel in a second current loop. Impedance values measured from the measurement terminal to each end of the first high impedance element are identical.

Abstract: A flexible flat cable (FFC) includes a first insulation layer, at least one pair of conductors, a plurality of low-k dielectric layers, two second insulation layers, and at least one shielding layer. The pair of conductors is located within the first insulation layer. Each pair of conductors includes a plurality of first conductors, and the first conductors are axially extending and arranged in parallel. The low-k dielectric layers are embedded in the first insulation layer. Each of the pair of conductors or each of the first conductors is covered and surrounded with one low-k dielectric layer. The two second insulation layers are located on two surfaces of the first insulation layer. The shielding layer is located on the two second insulation layers opposite to the first insulation layer.

Abstract: In some examples, an electronic device, comprises: a plurality of light emitting diodes (LEDs) arranged into first and second zones; and a driver coupled to the LEDs in the first and second zones, the driver to, in an image scan direction, provide a level of power to the LEDs in the first zone and to the LEDs in the second zone.

Abstract: The present disclosure describes a method for controlling radiation conditions and an example system for performing the method. The method includes sending a first setting to configure a radiation device to provide radiation to a substrate undergoing a process operation in a process chamber of the radiation device. The method further includes receiving radiation energy data measured at a plurality of locations of the process chamber and receiving measurement data measured on the substrate during the process operation. The method further includes in response to a variance of the radiation energy data being above a first predetermined threshold and in response to a difference between reference data and the measurement data being above a second predetermined threshold, sending a second setting to configure the radiation device to provide radiation to the substrate.

Abstract: A sound isolation window includes a frame and a plurality of sound blocking bars. The frame has an upper frame portion and a lower frame portion. The frame further has a first sidewall and a second sidewall connected to the upper and lower frame portion. The upper frame portion, the lower frame portion, the first sidewall and the second sidewall form a first opening and an opposite second opening. Each sound blocking bar includes a plane perpendicular to the upper frame portion and the lower frame. The sound blocking bars are arranged along the first direction from the first opening to the second opening and spaced apart from each other. Projections along the first direction of the sound blocking bars over the first opening cover the first opening. The width of each sound blocking bar is less than one-half of the width of the first opening.

Abstract: An electronic device comprises circuitry to generate and authenticate a first write protect (WP) signal; a controller to write data to a memory, the controller to generate a second WP signal; and a logic gate coupled to the circuitry and the controller. The logic gate is to receive the first and second WP signals; generate a third WP signal based on the first and second WP signals; and assert the third WP signal to the memory to control a write enable state of the memory.

Abstract: The present application discloses an interconnection connector including an insulative housing and a number of conductive terminals. The insulative housing includes a base portion and a mating portion adapted to mate with a mating connector. Each conductive terminal includes a contact portion positioned in the mating portion and an abutment portion located on the base portion. The contact portions are adapted for being electrically connected to the mating connector, and the abutment portions are adapted for contacting a conductive pad of a flexible flat cable. Besides, a connector assembly including the interconnection connector is also disclosed. The present application simplifies the mating structure by providing the abutment portions on the base portion to contact the conductive pads of the flexible flat cable, thereby easily to achieve electrical connection between the conductive terminals and the flexible flat cable.