Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.

Abstract: An integrated circuit includes a photodetector. The photodetector includes one or more dielectric structures positioned in a trench in a semiconductor substrate. The photodetector includes a photosensitive material positioned in the trench and covering the one or more dielectric structures. A dielectric layer covers the photosensitive material. The photosensitive material has an index of refraction that is greater than the indices of refraction of the dielectric structures and the dielectric layer.

Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.

Abstract: A nerve stimulation system includes an electrode, an electrode controlling device coupled to the electrode and configured to control the electrode to electrically stimulate a peripheral nerve according to a nerve stimulation signal, and a signal generating device coupled to the electrode controlling device and configured to generate the nerve stimulation signal. The nerve stimulation signal is a signal with a square envelope. The square envelope periodically includes an on-time period with a pulse amplitude and an off-time period without the pulse amplitude, and a ratio of the on-time period and the off-time period is not less than 1, and a length of the off-time period is not longer than 5 seconds.

Abstract: An immersion cooling system includes a cooling tank, an immersion unit, a first disturbing element, and a first maintaining element. The cooling tank has a receiving portion. The immersion unit is in the receiving portion, and the immersion unit includes a boiler plate. The first disturbing element has a first convex surface. The first maintaining element maintains the first disturbing element to allow a convex direction of the first convex surface towards the boiler plate, and a first predetermined distance is between the first convex surface and the boiler plate.

Abstract: An immersion cooling system including a cooling tank, an immersion unit, and a baffle assembly is provided. The cooling tank has a receiving portion. The immersion unit is in the receiving portion and includes a boiler plate. The baffle assembly divides the receiving portion into an inner upper portion, an inner lower portion, and a peripheral portion. The boiler plate is in the inner lower portion, and a width of the inner upper portion is less than or equal to a width of the boiler plate.

Abstract: An immersion cooling system including a cooling tank, an immersion unit, a plurality of piezoelectric units, and a piezoelectric driver is provided. The cooling tank has a receiving portion. The immersion unit is in the receiving portion and the immersion unit includes a boiler plate. One or more channels are between the piezoelectric units, and the at least one channel is in communication with the boiler plate. The piezoelectric driver is for driving each of the piezoelectric units to generate a deformation.

Abstract: Provided is a clock switching device including a first latch circuit, a second latch circuit, and a switching circuit. The first latch circuit latches a first selection signal based on triggering of a first clock signal. The second latch circuit latches a second selection signal based on triggering of a second clock signal. A reset terminal of the second latch circuit is coupled to the first latch circuit. The second latch circuit is selectively reset based on an output of the first latch circuit. The switching circuit is coupled to an output terminal of the first latch circuit and an output terminal of the second latch circuit. The switching circuit selects one of the clock signals as an output clock signal of the clock switching device based on the selection signals.

Abstract: A light-emitting unit, having a substrate; a first light-emitting body formed on the substrate, and having a first longer side and a first shorter side; a second light-emitting body formed on the substrate, and having a second longer side and a second shorter side which is parallel to the first longer side; a third light-emitting body formed on the substrate, having a third longer side and a third shorter side which is parallel to the first longer side, and electrically connected to the first light-emitting body and the second light-emitting body; a first electrode covering the first light-emitting body and the second light-emitting body, and electrically connecting to the first light-emitting body; a second electrode separated from the first electrode, and covering the second light-emitting body without covering the first light-emitting body; and a transparent element enclosing the first light-emitting body, the second light-emitting body, and the third light-emitting body.

Abstract: A transceiver includes: a radio-frequency (RF) front-end circuit; a dedicated RF front-end circuit; and a switchable matching circuit, integrated in a chip. The RF front-end circuit deals with communications of a first wireless standard, and the dedicated RF front-end circuit deals with communications of a second wireless standard. The switchable matching circuit provides impedance matching between the signal port and the RF front-end circuit when the RF front-end circuit is in operation, and provides impedance matching between the signal port and the dedicated RF front-end circuit when the dedicated RF front-end circuit is in operation, and includes: a first capacitive circuit coupled to the signal port; a first switch circuit coupled between the first capacitive circuit and the dedicated RF front-end circuit; a second capacitive circuit coupled to the dedicated RF front-end circuit; and a second switch circuit coupled to a second terminal of the second capacitive circuit.

Abstract: A power detection circuit is provided for detecting current total input power of a resonant circuit. The power detection circuit includes a detection circuit and an estimation circuit. The detection circuit receives a current signal and obtains resonant-slot baseband power according to the current signal to generate the baseband power value. The current signal represents a resonant-slot current generated by the resonant circuit. The estimation circuit receives the baseband power value and estimates the current total input power according to the baseband power value to generate an estimated power value.

Abstract: An electronic apparatus including at least one heat generating component and an immersion cooling system is provided. The immersion cooling system includes a box body and a condensation module. The box body is adapted to accommodate a coolant, and the heat generating component is disposed in the box body to be immersed in the coolant in a liquid state. The condensation module includes a pipeline and a condensate, and the pipeline passes through the box body and is adapted for the condensate to flow. At least one parameter of the condensate may be changed to lower a boiling point of the coolant to a predetermined value by lowering the temperature in the box body with the condensate. In addition, an operating method of the electronic apparatus is also provided.

Abstract: A heating device includes a resonant circuit, a detection unit and a control unit. The resonant circuit includes an inverter circuit and a resonant tank. The inverter circuit provides a resonant tank current and a resonant tank voltage. The resonant tank includes a heating coil, a resonant tank capacitor, a resonant tank equivalent inductor and a resonant tank equivalent impedance. The detection unit detects the resonant tank current and the resonant tank voltage to acquire associated parameters. The detection unit calculates an inductance of the resonant tank equivalent inductor according to a capacitance of the resonant tank capacitor, a resonant period and a first expression. The detection unit calculates an impedance value of the resonant tank equivalent impedance according to the inductance of the resonant tank equivalent inductor, a time difference, the resonant period, a reference current value, a negative peak current value and a second expression.

Abstract: A power detection circuit is provided for detecting current total input power of a resonant circuit. The power detection circuit includes a detection circuit and an estimation circuit. The detection circuit receives a current signal and obtains resonant-slot baseband power according to the current signal to generate the baseband power value. The current signal represents a resonant-slot current generated by the resonant circuit. The estimation circuit receives the baseband power value and estimates the current total input power according to the baseband power value to generate an estimated power value.

Abstract: Provided is a synthetic leather. The synthetic leather comprises a base cloth, a polymer layer formed on the base cloth and a surface unit covering the polymer layer; the surface unit is a functional layer or a combination of the functional layer and a print layer. The polymer layer is made of a PVB-based composition and excludes a crosslinking agent with at least one isocyanate group. The functional layer is made of a material containing a primary agent; the primary agent is PU, epoxy resin, PMA or PVB; when the primary agent is the PVB, the material further comprises a crosslinking agent with at least one isocyanate group. The synthetic leather has good properties of weather resistance, abrasion resistance and flexing resistance, and the synthetic leather can have a variety of printing patterns on its surface.

Abstract: A transceiver and a method for controlling a configuration of the transceiver are provided. The transceiver includes a power amplifier, a receiver and a transformer, wherein the transformer includes a first inductor coupled to the power amplifier, and a second inductor coupled to the receiver. The power amplifier is configured to output transmitted signals when the transceiver operates in a transmitting mode. The receiver is configured to receive a received signal when the transceiver operates in a receiving mode. More particularly, voltage levels of a first end and a second end of the first inductor are pulled to a same voltage level when the transceiver operates in the receiving mode.

Abstract: A mixer with a filtering function and a method for linearization of the mixer are provided. The mixer includes at least one amplifier, a transconductance device and a feedback network. The at least one amplifier is configured to output a filtered voltage signal according to an input voltage signal. The transconductance device is coupled to the at least one amplifier, and is configured to generate a filtered current signal according to the filtered voltage signal. The feedback network is coupled between any output terminal among at least one output terminal of the transconductance device and an input terminal of the at least one amplifier. More particularly, the mixer is configured to output a modulated signal according to the filtered current signal.

Abstract: A gas cushion bag includes two layers, and the two layers are overlapped with each other and partially connected with each other to form a plurality of connecting portions and at least one gas storage unit. Each of the at least one gas storage unit is sealed circumferentially and includes at least one first segment and a plurality of second segments communicated with the at least one first segment. The at least one first segment and the plurality of second segments are alternatively arranged in a first direction. Wherein as viewed along the first direction, a cross-sectional profile of each of the at least one first segment is smaller than a cross-sectional profile of one of the plurality of second segments when the at least one gas storage unit is inflated.