Abstract: A signal enhancement structure configured to enhance a signal of a specimen is provided. The signal enhancement structure includes a plurality of nanowires stacked in a first direction, a second direction, and a third direction. The nanowires are extended along at least two directions. A particle of the specimen is on the nanowires or in a gap among the nanowires. A manufacturing method of a signal enhancement structure and a measuring method with signal enhancement are also provided.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure, the method includes forming a buffer layer over a substrate. An active layer is formed on the buffer layer. A top electrode is formed on the active layer. An etch process is performed on the buffer layer and the substrate to define a plurality of pillar structures. The plurality of pillar structures include a first pillar structure laterally offset from a second pillar structure. At least portions of the first and second pillar structures are spaced laterally between sidewalls of the top electrode.

Abstract: An optical module is provided, including a movable portion, a fixed portion, and a circuit assembly. The movable portion is configured to connect an optical member, and is movable relative to the fixed portion. Moreover, the movable portion is movably connected to the fixed portion via the circuit assembly.

Abstract: An in-cell optical sensing display panel includes a pixel array, a plurality of first optical sensors and a plurality of second optical sensors. The pixel array is disposed in an active area of the in-cell optical sensing display panel, and the active area includes a first region and a second region which surrounds the first region. The sensor array is disposed in the first region of the active area and is configured to sense a fingerprint of a finger touching a surface of the in-cell optical sensing display panel. The second optical sensors are disposed in the second region of the active area and are configured to sense ambient light, and the second optical sensors are not to be used for fingerprint sensing.

Abstract: Methods and systems for compensating systematic errors across a fleet of metrology systems based on a trained error evaluation model to improve matching of measurement results across the fleet are described herein. In one aspect, the error evaluation model is a machine learning based model trained based on a set of composite measurement matching signals. Composite measurement matching signals are generated based on measurement signals generated by each target measurement system and corresponding model-based measurement signals associated with each target measurement system and reference measurement system. The training data set also includes an indication of whether each target system is operating within specification, an indication of the values of system model parameter of each target system, or both.

Abstract: Semiconductor package includes substrate, first barrier layer, second barrier layer, routing via, first routing pattern, second routing pattern, semiconductor die. Substrate has through hole with tapered profile, wider at frontside surface than at backside surface of substrate. First barrier layer extends on backside surface. Second barrier layer extends along sidewalls of through hole and on frontside surface. Routing via fills through hole and is separated from sidewalls of through hole by at least second barrier layer. First routing pattern extends over first barrier layer on backside surface and over routing via. First routing pattern is electrically connected to end of routing via and has protrusion protruding towards end of routing via in correspondence of through hole. Second routing pattern extends over second barrier layer on frontside surface. Second routing pattern directly contacts another end of routing via. Semiconductor die is electrically connected to routing via by first routing pattern.

Abstract: An optical system is provided. The optical system includes an immovable part, a second movable part, a second drive mechanism, and a second circuit mechanism. The second movable part is used for connecting to a second optical element. The second movable part is movable relative to the immovable part. The second drive mechanism is used for driving the second movable part to move relative to the immovable part. The second circuit mechanism is electrically connected to the second drive mechanism.

Abstract: Methods, systems and devices are disclosed for controlling self-induced acoustic interference. In one embodiment, a first piezoelectric transducer to which a first excitation signal is applied, generates back side acoustic waves that are transmitted from a back side of the first piezoelectric transducer into a backing material layer. A second piezoelectric transducer coupled to a back side of the backing material layer generates a first calibration response to the back side acoustic waves. An interference signal profile is generated based, at least in part, on the first calibration response and may be used to filter interference signal components and/or to generate a control signal to be applied to the second piezoelectric transducer during measurement cycles.

Abstract: A semiconductor package includes a substrate, a composite seed-barrier layer, a routing via, and a semiconductor die. The substrate has a through hole formed therethrough. The composite seed-barrier layer extends on sidewalls of the through hole and includes a first barrier layer, a seed layer, and a second barrier layer sequentially stacked on the sidewalls of the through hole. The routing via fills the through hole and is separated from the substrate by the composite seed-barrier layer. The semiconductor die is electrically connected to the routing via. Along the sidewalls of the through holes, at a level height corresponding to half of a total thickness of the substrate, the seed layer is present as inclusions of seed material surrounded by barrier material of the first barrier layer and the second barrier layer.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: An example method for using wireless packets to indicate boot status of a network device is disclosed. The method includes initiating a boot sequence of a network device. The method also includes during at least a portion of the boot sequence, transmitting a first wireless packet comprising data indicating a boot status of the network device, wherein the boot status indicates the network device is booting. The method also includes transmitting a second wireless packet comprising data indicating the boot status of the network device, wherein the boot status indicates the network device has finished booting.

Abstract: Semiconductor structures and methods of forming the same are provided. A method according to the present disclosure includes forming a stack of epitaxial layers over a substrate, forming a first fin-like structure and a second fin-like structure from the stack, forming an isolation feature between the first fin-like structure and the second fin-like structure, forming a cladding layer over the first fin-like structure and the second fin-like structure, conformally depositing a first dielectric layer over the cladding layer, depositing a second dielectric layer over the first dielectric layer, planarizing the first dielectric layer and the second dielectric layer until the cladding layer are exposed, performing an etch process to etch the second dielectric layer to form a helmet recess, performing a trimming process to trim the first dielectric layer to widen the helmet recess, and depositing a helmet feature in the widened helmet recess.

Abstract: A display panel and a spliced display are provided. The display panel includes a substrate, a plurality of light-emitting elements, a driving circuit, and an optical sensor. The substrate includes a through hole, and the through hole includes a hole. The plurality of the light-emitting elements are disposed on the substrate. The through hole is located in a region between two of the plurality of the light-emitting elements. The driving circuit is disposed on the substrate and electrically connected to the plurality of the light-emitting elements. The optical sensor is disposed corresponding to the through hole and receives sensing light through the hole. The width W of the hole meets the equation of H?W<D. H is the depth of the hole, and D is the distance between the two of the plurality of the light-emitting elements.

Abstract: Provided are interfering RNAs (e.g., siRNAs) targeting SARS-CoV (e.g., the POL, Spike, Helicase, or Envelop gene thereof) and therapeutic uses thereof for inhibiting SARS-CoV infection and/or treating diseases associated with the infection (e.g., COVID-19).

Abstract: A method for treating sleeping or movement disorder is provided. The method includes the operations as follows. A brainwave of a patient with sleeping or movement disorder is recorded. An onset of a STW oscillation episode from the brainwave is identified, wherein the STW oscillation episode is a STW signal having an oscillation frequency in a range of from about 2 Hz to about 4 Hz. a first stimulation is delivered to the patient when the onset of the STW oscillation episode is identified from the brainwave. The first stimulation is adapted according to a measurable feature of the STW oscillation episode. A system for treating sleeping or movement disorder is also provided.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a carrier, a base, and a first driving assembly. The carrier holds an optical element with an optical axis. The carrier is movably connected to the base. The first driving assembly drives the carrier to move relative to the base. The first driving assembly includes a driving coil disposed on the carrier, and the direction of the winding axis of the driving coil is different from the direction of the optical axis. The carrier has an abutting surface, which faces and is in direct contact with the driving coil. The maximum size of the abutting surface is greater than the maximum size of the driving coil in the direction of the optical axis.

Abstract: Semiconductor devices and methods of forming the same are provided. In an embodiment, a semiconductor device includes a first fin extending along a first direction, a second fin extending parallel to the first fin, and a gate structure over and wrapping around the first fin and the second fin, the gate structure extending along a second direction perpendicular to the first direction. The first fin bents away from the second fin along the second direction and the second fin bents away from the first fin along the second direction.

Abstract: Chimeric antigen receptors targeted to IL-13Ra2 are described. The targeting domain is a IL13 variant having increased specificity for IL-13Ra2 relative to IL-13Ra1.

Abstract: A driving mechanism is provided, including a movable portion, a fixed portion and a driving assembly. The movable portion is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The driving assembly includes a biasing element generating a driving force, and a first electrical connection portion electrically connected to the biasing element. The biasing element is clamped at a first position of the first electrical connection portion by a first clamping force, and the biasing element is clamped at a second position of the first electrical connection portion by a second clamping force The first clamping force is different from the second clamping force.

Abstract: An acoustic isolator and methods to the same. The acoustic isolator may comprise a body, one or more annular chambers formed inside the body of the acoustic isolator and positioned along a longitudinal axis of the acoustic isolator, an annular groove formed on an outer surface of the body of the acoustic isolator, and a passage disposed between the one or more annular chambers and the annular groove. The method may comprise transmitting an acoustic wave from a transmitter disposed on an acoustic logging tool into a subterranean formation, receiving an acoustic signal from the subterranean formation with a receiver disposed on the acoustic logging tool, and attenuating a second acoustic wave that moves between the transmitter and the receiver and through an acoustic isolator.