Patents by Inventor Chung Chih Feng

Chung Chih Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7972396
    Abstract: The present invention relates to a method of producing a polishing pad, comprising steps of: (a) providing a base material comprising a plurality of fibers; said base material having a surface for polishing a substrate, wherein the fibers comprise a core and a cladding surrounding the core, and the cladding comprises a hydrophobic polymer; (b) impregnating the surface of the base material with an elastomer solution; (c) coagulating the elastomer impregnated in the surface of the base material to mold the elastomer and to form a plurality of first continuous pores between the elastomer, and between the elastomer and the fibers; (d) planarizing the surface of the base material; (e) impregnating the surface of the base material and elastomer obtained in the step (d) with a condition polymer solution; and (e) curing the condition polymer impregnated in the surface of the base material and elastomer and partially filling the condition polymer into the first continuous pores to form a plurality of second continuous
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: July 5, 2011
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung
  • Publication number: 20110159235
    Abstract: A composite fiber having elastomer and method for making the same, and a substrate having the composite fiber and method for making the same are provided. The composite fiber includes a first composition and a second composition. The first composition is thermoplastic non-elastomer, and the second composition is thermoplastic elastomer (TPE). The second composition is in an amount of 5 to 70 weight % of the composite fiber. The first composition and the second composition are alternately distributed in a circumference of a cross-section of the composite fiber, and the length of the second composition is less than 50% of the total length of the circumference. The TPE can be dispersed uniformly and increase the adhesion between fibers, and the segmented fiber cross-section thereof further prevents the TPE from becoming too adhesive and affecting the processing during the fabrication of fibers and non-woven fabric substrates.
    Type: Application
    Filed: November 17, 2010
    Publication date: June 30, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: LUNG-CHUAN WANG, CHUNG-CHIH FENG, CHIH-YI LIN, SZU-WEI HUANG, KAO-LUNG YANG, JUI-PENG TUNG
  • Patent number: 7935282
    Abstract: A method for producing microfine fibers having low resistance to deformation and high elasticity in accordance with the present invention comprises acts of: (a) providing polymer A and polymer B; (b) melting polymer A and polymer B to make a filament; (c) drawing the filament to make a staple fiber; (d) entangling the staple fiber to form a non-woven; (e) impregnating the non-woven with a impregnating agent; and may further have the acts of (f) impregnating the nonwoven with polyurethane; (g) coagulating the non-woven with dimethylformamide (DMF); (h) washing the non-woven with hot water; (i) impregnating the non-woven with a treatment agent; (j) abrading the non-woven to attain a split type mirofine fiber substrate; and (k) bonding a coating to the microfine fiber substrate. Therefore, the method can attain an artificial leather product having low resistance to deformation and high elasticity.
    Type: Grant
    Filed: August 15, 2008
    Date of Patent: May 3, 2011
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, Chih-Yi Lin, Gao-Long Yang, Szu-Wei Huang, Ming-Hsiung Liang, Jong-Shy Lin, Yuan-Chih Lan
  • Publication number: 20110070814
    Abstract: The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also.
    Type: Application
    Filed: September 21, 2010
    Publication date: March 24, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang
  • Publication number: 20110045751
    Abstract: The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate consists of first elastomer, the first elastomer comprising a plurality of first holes; wherein the first holes have a drop shape, and each of the first holes has an opening. The buffer substrate consists of second elastomer, the second elastomer comprising a plurality of second holes. The surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece.
    Type: Application
    Filed: October 19, 2010
    Publication date: February 24, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, YUNG-CHANG HUNG
  • Publication number: 20110045744
    Abstract: The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
    Type: Application
    Filed: August 24, 2010
    Publication date: February 24, 2011
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang, Wen-Chieh Wu
  • Publication number: 20110011007
    Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles. Whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid the scratch of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.
    Type: Application
    Filed: September 24, 2010
    Publication date: January 20, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih FENG, I-Peng YAO, Lyang-Gung WANG, Yung-Chang HUNG, Chao-Yuan TSAI
  • Publication number: 20110000141
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a first membrane with low permeability; a two-component paste formed on the upper surface of the first membrane with low permeability for adhering the base material to the first membrane with low permeability; and a polyurethane paste formed on the lower surface of the first membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
    Type: Application
    Filed: September 16, 2010
    Publication date: January 6, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Publication number: 20110003536
    Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The elastomer is embedded into the fabric, and the non-woven fabric comprises a plurality of first long fibers randomly entangled with each other.
    Type: Application
    Filed: September 16, 2010
    Publication date: January 6, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao, Yung-Chang Hung
  • Publication number: 20100330334
    Abstract: The present invention relates to an artificial leather and a method for manufacturing the same. According to the method of the invention, an elastic layer is disposed on a surface of a base material, a color pattern layer is disposed on an uneven surface of the elastic layer and a cover layer covers the color pattern layer, so as to form the artificial leather. The elastic layer includes a plurality of sparkling materials. By utilizing the sparkling materials, the color pattern layer and the uneven surface, the artificial leather has a sparkling effect at various angles by showing the gradation of the stacking particles (sparkling materials). In addition, the cover layer can protect the color pattern layer on the elastic layer, so that the color pattern layer has excellent sturdiness against peeling and light.
    Type: Application
    Filed: January 15, 2010
    Publication date: December 30, 2010
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, Pai-Hsiang Wu, Jung-Ching Chang, Yuan-Fang Tsai, Jui-Che Chang
  • Patent number: 7824249
    Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles, whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid scratching of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: November 2, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung, Chao-Yuan Tsai
  • Patent number: 7815491
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed on the lower surface of the membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
    Type: Grant
    Filed: May 29, 2007
    Date of Patent: October 19, 2010
    Assignee: San Feng Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Patent number: 7794796
    Abstract: In a method for making extensible artificial leather, a substrate is supported on in-extensible woven cloth and firmly located on a coating machine. A highly solid-containing water-based polyurethane resin is coated on the substrate to form a middle layer with tiny open cells. The middle layer is dried, and the woven cloth is removed from the substrate. A superficial layer of polyurethane is attached to the middle layer in a dry process so that the extensible artificial leather is made with excellent strength against peeling, abrasion and dissolution.
    Type: Grant
    Filed: January 2, 2007
    Date of Patent: September 14, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, Chun-Wei Wu, Kun-Lin Chiang, Yung-Ching Huang
  • Publication number: 20100227118
    Abstract: The present invention relates to a sheet having discontinuous adhesion points and a method for making the same. The sheet includes a buffer layer, an adsorption layer, and an adhesion layer. The adhesion layer is disposed between the buffer layer and the adsorption layer. The adhesion layer has a plurality of adhesion points to bind the buffer layer and the adsorption layer together. The adhesion points are discontinuous and have gaps in between. Consequently, when the sheet is pressed, air can be vented out through the gaps between the adhesion points, so that the adsorption force is increased.
    Type: Application
    Filed: August 5, 2009
    Publication date: September 9, 2010
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Wen-Chieh Wu
  • Patent number: 7789738
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.
    Type: Grant
    Filed: July 3, 2006
    Date of Patent: September 7, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Patent number: 7762873
    Abstract: A polishing pad includes a body having a polymer layer and a polishing layer. The polymer layer has opposite first and second faces. The polymer layer includes a plurality of first ultrafine fibers and a polymer bonding the first ultrafine fibers together. The polishing layer is formed on the first face of the polymer layer. The polishing layer includes a plurality of second ultrafine fibers and is free of the polymer. The first and second ultrafine fibers are identical to each other. The second ultrafine fibers have a first concentration of ultrafine fibers by volume higher than 80% a total volume of the polishing layer. The first ultrafine fibers of the polymer layer have a second concentration of ultrafine fibers by volume to a total volume of the polymer layer. The first concentration is higher than the second concentration.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: July 27, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, Chen-Hsiang Chao, I-Peng Yao
  • Publication number: 20100146863
    Abstract: The present invention relates to a polishing pad having an insulation layer and a method for making the same. The polishing pad includes a bottom layer, an insulation layer, and an abrasive layer. The bottom layer includes a fabric layer wrapped in a high polymer. The insulation layer is disposed on the bottom layer. The abrasive layer is disposed on the insulation layer. The abrasive layer is a high polymeric elastomer and has a plurality of columnar-like cells. The insulation layer can prevent the slurry from infiltrating into the bottom layer during the polishing processs to improve the polishing effect and quality.
    Type: Application
    Filed: August 5, 2009
    Publication date: June 17, 2010
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Chun-Ta Wang, Wei-Te Liu
  • Publication number: 20100119811
    Abstract: The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing.
    Type: Application
    Filed: April 21, 2009
    Publication date: May 13, 2010
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Chun-Ta Wang
  • Publication number: 20100099343
    Abstract: The present invention relates to a polishing pad having abrasive grains and a method for making the same. The polishing pad having abrasive grains includes a plurality of fibers, a plurality of abrasive grains and a high polymer. The fibers intersect each other to form a fiber matrix. The abrasive grains are attached to the fibers. The high polymer covers the fibers and the abrasive grains. The abrasive grains will not easily scratch a surface of a workpiece to be polished due to the flexibility of the fibers.
    Type: Application
    Filed: June 29, 2009
    Publication date: April 22, 2010
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Kun-Cheng Tsai, Chih-Yi Lin
  • Publication number: 20100041294
    Abstract: A core-sheath fiber has a core and a sheath. The core comprises 0.1 to 10 wt % of carbon black pigment particles. The sheath surrounds the core preventing the core from being exposed. Because the carbon black pigment particles are mainly distributed in the core and the core is surrounded by the sheath with little or no carbon black pigment particles, a surface of the core-sheath fiber has low friction and electrical conductivity. Therefore, a lifetime of a punch needle used in machinery to produce a nonwoven is maintained and the nonwoven can undergo high frequency treatment to form artificial leather. Additionally, the sheath has little or no carbon black pigment particles, so the sheath is improved compatibility with polyurethane (PU) used for high frequency treatment.
    Type: Application
    Filed: October 10, 2008
    Publication date: February 18, 2010
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih FENG, Chih-Yi LIN, Jui-Peng TUNG, Gao-Long YANG, Szu-Wei HUANG, Ti-Shun YEH, Kuo-Hsin CHIEN