Abstract: Methods are provided for proactively controlling a component of a system. The system may comprise a vehicle and the component may comprise a suspension of the vehicle. According to various aspects, methods may include obtaining information regarding a travel surface along a travel path that the system will travel at a future time and, based on the information regarding the travel surface, controlling the component of the system to traverse the travel surface. Controlling the component based on the information regarding the travel surface may comprise comparing the information regarding the travel surface to information regarding at least one physical constraint of the system and/or comparing frequency content of the information regarding the travel surface to a threshold frequency. Proactive control methods may provide improved response to disturbances and improved tracking and isolation because a suspension may be controlled with reduced or substantially zero delay.

Abstract: In some embodiments, methods and systems may be used to control operation of various systems of the vehicle based on road features included in an upcoming portion of a road surface located along a path of travel of the vehicle. This control may either be based on a probability of encountering a road feature on the road surface 5 and/or frequency information related to the upcoming portion of the road surface.

Abstract: Systems and methods described herein include implementation of road surface-based localization techniques for advanced vehicle features and control methods including advanced driver assistance systems (ADAS), lane drift detection, passing guidance, bandwidth conservation and caching based on road data, vehicle speed correction, suspension and vehicle system performance tracking and control, road estimation calibration, and others.

Abstract: A cell trace circuit includes a memory cell, a voltage generator and a measuring circuit. The memory cell has a resistor and a memory layer coupled in series to have a top electrode, a middle electrode and a bottom electrode, wherein the resistor and the memory layer are coupled at the middle electrode. The voltage generator provides a test bias to the memory cell ranging from a negative voltage to a positive voltage in a reset path or ranging from the positive voltage to the negative voltage in a set path. The measuring circuit is to determine a current (I) and a voltage (V) crossing the memory layer by the test bias.

Abstract: Methods and systems are described for establishing high-accuracy absolute landmarks that can be used to locate a vehicle's location during a vehicle/HAAL interaction event in some embodiments. Comparing that information with GNSS satellite data allows GNSS satellite errors to be determined and either used by a first vehicle and/or conveyed to other vehicles in the region in some embodiments. Methods and systems are also described for obtaining effectively continuous values of intermittently measured road surface parameters that are determined over time by discrete measurements by systems in a plurality of vehicles in some embodiments.

Abstract: A motor transmission unit for an electronic parking brake device includes a case, a driving member, a board, a rod and a push unit. The case is slidably mounted to a cap of a clamp. The driving member is partially inserted into the case. The board is threadedly mounted to the driving member. The rod is located between inner periphery of the passage and the board. The push unit has a first end thereof contacting the first end face, and a second end of the push unit is inserted in the clamp. A portion of the second end of the push unit contacts a piston. When the driving member is driven, the board moves axially. The board is restricted by the rod and does not rotate. The board pushes the push unit axially which moves the piston to push a lining plate of the clamp to contact a brake disk.

Abstract: Methods and apparatus are disclosed for adjusting the front to rear ratio of roll damping and/or roll stiffness in a vehicle based on vehicle yaw rate and/or the rate of change of steering wheel angle. Also disclosed are methods and apparatus for dynamically adjusting one or more suspension system control parameters based on one or more of steering wheel angle, rate of change of steering wheel angle and yaw rate.

Abstract: System and method for improving braking efficiency by increasing the magnitude of a frictional force between a tire of a vehicle wheel and a road surface. Braking efficiency may be improved by controlling the normal force applied on the wheel, with an active suspension actuator, based on the wheel's slip ratio.

Abstract: A motor transmission unit for an electronic parking brake device includes a case, a driving member, a board, a rod and a push unit. The case is slidably mounted to a cap of a clamp. The driving member is partially inserted into the case. The board is threadedly mounted to the driving member. The rod is located between inner periphery of the passage and the board. The push unit has a first end thereof contacting the first end face, and a second end of the push unit is inserted in the clamp. A portion of the second end of the push unit contacts a piston. When the driving member is driven, the board moves axially. The board is restricted by the rod and does not rotate. The board pushes the push unit axially which moves the piston to push a lining plate of the clamp to contact a brake disk.

Abstract: A semiconductor package structure includes a substrate, a die and a conductive structure. The die is disposed on or within the substrate. The die has a first surface facing away from the substrate and includes a sensing region and a pad at the first surface of the die. The first surface of the die has a first edge and a second edge opposite to the first edge. The sensing region is disposed adjacent to the first edge. The pad is disposed away from the first edge. The conductive structure electrically connects the pad and the substrate. The sensing region has a first end distal to the first edge of the first surface of the die. A distance from the first end of the sensing region to a center of the pad is equal to or greater than a distance from the first end of the sensing region to the first edge of the first surface of the die.

Abstract: A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.

Abstract: A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.

Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.

Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.

Abstract: An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.

Abstract: An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.

Abstract: A read only memory (ROM) is provided in the present invention, which includes a plurality of bit lines extending in a first direction, a plurality of source lines extending in parallel to the plurality of bit lines, and a plurality of word lines extending in a second direction perpendicular to the first direction. Each two ROM cells share an active area and are electrically coupled to one of the plurality of source lines by a common source line contact.

Abstract: An apparatus for electromagnetic interference shielding is described herein. The apparatus includes an electromagnetic bandgap (EBG) structure. The EBG structure is attached to a surface of the apparatus such that noise propagation is mitigated. The apparatus may be a chassis of an electronic device, and the EBG structure may be attached to one surface of the chassis. Further, the apparatus may be a heat sink, and the EBG structure can be attached to one surface of the heat sink.

Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.

Abstract: An apparatus is provided which comprises: an oscillator circuit to generate a clock signal and transmit the clock signal over a signal line; a ground reference plane associated with the signal line; and one or more patterns formed in the ground reference plane, wherein the one or more patterns in the ground reference plane is to filter out noise from the clock signal transmitted over the signal line.