Patents by Inventor Chung-Hsien Chen

Chung-Hsien Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120181972
    Abstract: An automatic pollution-free energy generation device is provided for a transport and is mounted to a wind-receiving portion of the transport. The energy generation device includes an air accumulation device, an electricity accumulator, an electrical discharge device, a sensor, and an air outlet. The air accumulation device forms a temporal air storage chamber, which receives air to flow therethrough. The electricity accumulator is arranged inside the air accumulation device is operable to perform electrical discharge to the air inside the chamber or is controlled by a control device to discharge electricity, whereby fluid molecules of air carry electricity that is converted into electrical power to be collected by the electricity accumulator and converted by a current conversion controller into direct current to be stored in a battery or to be directly used by the transport.
    Type: Application
    Filed: January 17, 2011
    Publication date: July 19, 2012
    Inventor: CHUNG-HSIEN CHEN
  • Patent number: 7659198
    Abstract: A semiconductor interconnect structure having reduced hillock formation and a method for forming the same are provided. The semiconductor interconnect structure includes a conductor formed in a dielectric layer. The conductor includes at least three sub-layers, wherein the ratio of the impurity concentrations in neighboring sub-layers is preferably greater than about two.
    Type: Grant
    Filed: August 6, 2008
    Date of Patent: February 9, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Hsien Chen, Chun-Chieh Lin, Minghsing Tsai, Shau-Lin Shue
  • Publication number: 20090035937
    Abstract: A semiconductor interconnect structure having reduced hillock formation and a method for forming the same are provided. The semiconductor interconnect structure includes a conductor formed in a dielectric layer. The conductor includes at least three sub-layers, wherein the ratio of the impurity concentrations in neighboring sub-layers is preferably greater than about two.
    Type: Application
    Filed: August 6, 2008
    Publication date: February 5, 2009
    Inventors: Chung-Hsien Chen, Chun-Chieh Lin, Minghsing Tsai, Shau-Lin Shue
  • Publication number: 20080230317
    Abstract: An oil circulation system for a compressor comprises a control valve body integrated therein with a pressure sensor, a differential pressure sensor and a temperature sensor. The control valve body is further integrated therein with a temperature control valve connected to an external cooler for lowering a temperature of a hydraulic oil, an oil filter for filtering the cooled hydraulic oil into a clean hydraulic oil, and a pressure relief valve for relieving a pressure of the clean hydraulic oil, which is then circulated back into the compressor for use. The integration of the aforementioned components effectively downsizes an entire set of machinery comprising the compressor and the oil circulation system and increases an efficiency of the compressor.
    Type: Application
    Filed: March 20, 2008
    Publication date: September 25, 2008
    Inventors: Shang-Shung Jen, Chung-Hsien Chen, Shih-Ping Liu
  • Patent number: 7423347
    Abstract: A semiconductor interconnect structure having reduced hillock formation and a method for forming the same are provided. The semiconductor interconnect structure includes a conductor formed in a dielectric layer. The conductor includes at least three sub-layers, wherein the ratio of the impurity concentrations in neighboring sub-layers is preferably greater than about two.
    Type: Grant
    Filed: January 19, 2006
    Date of Patent: September 9, 2008
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Hsien Chen, Chun-Chieh Lin, Minghsing Tsai, Shau-Lin Shue
  • Publication number: 20080057211
    Abstract: A method for plating includes positioning a substrate facing a plating solution. The method also includes immersing the substrate into the plating solution while plating a layer of material over a surface of the substrate, wherein an immersion speed of the substrate is about 100 millimeters per second (mm/s) or more while at least one portion of the substrate contacts the plating solution.
    Type: Application
    Filed: August 29, 2006
    Publication date: March 6, 2008
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Hsien Chen, Chun-Chieh Lin, Hung-Wen Su, Minghsing Tsai, Shau-Lin Shue
  • Publication number: 20070164439
    Abstract: A semiconductor interconnect structure having reduced hillock formation and a method for forming the same are provided. The semiconductor interconnect structure includes a conductor formed in a dielectric layer. The conductor includes at least three sub-layers, wherein the ratio of the impurity concentrations in neighboring sub-layers is preferably greater than about two.
    Type: Application
    Filed: January 19, 2006
    Publication date: July 19, 2007
    Inventors: Chung-Hsien Chen, Chun-Chieh Lin, Minghsing Tsai, Shau-Lin Shue
  • Publication number: 20070098201
    Abstract: This invention relates to an earplug type earphone that includes a front cover, a back cover, an earplug, a signal line, and a signal line support member, and the earplug is sheathed into a fixed pillar with a bias design and protruded from the back cover, so that earplug with an eccentric structure can adjust the wearing tightness, and the back cover can be turned clockwise or counterclockwise with respect to the front cover to fix the fixed pillar to the back cover with an eccentric design in the lower left side or lower right side with an eccentric design, and fit the user's left and right ears and enhance the utility of the earphone.
    Type: Application
    Filed: November 2, 2005
    Publication date: May 3, 2007
    Inventor: Chung-Hsien Chen