Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.

Abstract: A method for manufacturing a low-viscosity hardener is provided. The method includes the followings steps: providing a hardener crude product; and subjecting the hardener crude product and an alkaline catalyst to an isomerization reaction, so as to obtain the low-viscosity hardener. The hardener crude product contains 3-methyltetrahydrophthalic anhydride and 4-methyltetrahydrophthalic anhydride, and a weight ratio of the 3-methyltetrahydrophthalic anhydride to the 4-methyltetrahydrophthalic anhydride ranges from 7:3 to 3:7. A viscosity of the low-viscosity hardener ranges from 30 cps to 50 cps.

Abstract: A method for manufacturing methyltetrahydrophthalic anhydride is provided, which includes steps as follows. Maleic anhydride is added into a reactor. Piperylene is added into the reactor, so that the piperylene and the maleic anhydride undergo a first addition reaction. When a conversion rate of the maleic anhydride is more than 25%, the first addition reaction is completed. Isoprene is added into the reactor, so that the isoprene and the maleic anhydride undergo a second addition reaction to obtain a methyltetrahydrophthalic anhydride product. The methyltetrahydrophthalic anhydride product contains 3-methyltetrahydrophthalic anhydride and 4-methyltetrahydrophthalic anhydride.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A semiconductor arrangement includes a first dielectric feature passing through a semiconductive layer and a first dielectric layer over a substrate. The semiconductor arrangement includes a conductive feature passing through the semiconductive layer and the first dielectric layer and electrically coupled to the substrate. The conductive feature is adjacent the first dielectric feature and electrically isolated from the semiconductive layer by the first dielectric feature.

Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are those as defined in the specification. The present invention also provides a polyimide precursor composition or a photosensitive polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.

Abstract: The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.

Abstract: The present disclosure relates to a polyimide precursor composition comprising an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.

Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.

Abstract: The present disclosure relates to a polyimide precursor composition comprising an antic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.

Abstract: The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.

Abstract: The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P?, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

Abstract: The present invention provides a process for preparing polyimides. The process includes cyclizing a polyimide precursor composition in a vacuum-like environment by using infrared radiation to give polyimide. The process can effectively reduce the cyclization temperature and time, thereby reducing energy and process costs.

Abstract: The present disclosure relates to a solvent-containing dry film and a method for applying a dry film on a substrate. The dry film includes a carrier and a resin layer. The resin layer contains a resin composition and a solvent and the solvent is present in a total amount of at least 5 wt % based on the total weight of the resin layer. The dry film of the present invention can be applied onto a substrate without the use of a prior art vacuum lamination apparatus. The application process is simple and is more cost-efficient than the prior art techniques.

Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.

Abstract: A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.

Abstract: The present invention provides a process for preparing polyimides. The process includes cyclizing a polyimide precursor composition in a vacuum-like environment by using infrared radiation to give polyimide. The process can effectively reduce the cyclization temperature and time, thereby reducing energy and process costs.

Abstract: A polyimide (PI) having two —COOH capping groups at each end is provided. A coating composition is further provided, which contains the PI and a hardening agent having 2 to 6 functional groups capable of reacting with —COOH. A PI coating layer and PI film formed by the coating composition of the present invention possess excellent chemical resistance and coefficient of thermal expansion (CTE), which makes them applicable in fabrication of protective materials for active/passive devices, optical materials, touch panels, copper foil substrates, soft flexible electronic materials or integrated circuit elements, or film substrate for glass film touch panels.

Abstract: The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.

Abstract: The present disclosure relates to a polyimide precursor composition comprising an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.