Abstract: A semiconductor device and method of manufacture are provided. In some embodiments isolation regions are formed by modifying a dielectric material of a dielectric layer such that a first portion of the dielectric layer is more readily removed by an etching process than a second portion of the dielectric layer. The modifying of the dielectric material facilitates subsequent processing steps that allow for the tuning of a profile of the isolation regions to a desired geometry based on the different material properties of the modified dielectric material.

Abstract: The present invention discloses an analysis method and system for detecting vascular structures at arterial, capillary, and venous phases from time-series digital subtraction angiographic images. The method comprises the steps of: acquiring a time-series dataset of a subject using at least one rotating x-ray source and detector pair; administrating a contrast media to a blood vessel of the subject during the data acquisition; applying a motion artifact correction to the time-series dataset; and applying a segmentation method to the time-series dataset for identifying vascular structures with different flow patterns of the contrast media. The invention offers the potential to efficiently provide quantitative flow changes inside the clinical operation room without manual selection and motion artifact error.

Abstract: A pallium formed by folding up a single rectangular piece of fabric and partially fastening the two opposite short sides of the folded piece of fabric so that a main opening is defined in one long side of the folded piece of fabric and two small side openings are defined in the two opposite short sides of the folded piece of fabric.

Abstract: A ventilating insole (1) comprises an upper insole (11); a lower insole (12), a stripe (13) positioned between the upper insole (11) and lower insole (12), a ventilation layer (14) upon (or below) the upper insole (11), and a plurality of spiral springs(15) attached between the upper insole (11) and lower insole (12). The upper insole (11) has a plurality of air inlets (111) at the rear end and a plurality of air outlets (112) at a front end. The ventilation layer (14) is attached to the upper insole. The ventilation layer has a plurality of air inlet holes (141) communicable to the air inlets (111) of the upper insole but no holes communicable to the air outlets (112). By the air inlets (111) and air inlet holes (141), when the insole (1) is treaded, the air in the air chamber S will flows to the air outlets (112) of the upper insole and the ventilation layer (14); then air flows to the toes. Thus heat of the foot of the user is dissipated.