Abstract: Provided is a slurry composition including abrasive particles, halogen oxide, and nitroxide compound. The combination of halogen oxide and nitroxide compound has a synergistic effect to remove a substrate containing tungsten and silicon oxide. Moreover, a use of the slurry composition and a polishing method using the slurry composition are provided.

Abstract: A connector module including a connector and a heatsink is provided. The connector includes a shaft. The heatsink includes a groove recessed in a single direction. The heatsink is adapted to move along a direction opposite to the recessed direction of the groove to insert the shaft into the groove. The shaft is pivoted in the groove so that the heatsink is adapted to pivotally rotate relative to the connector.

Abstract: An interface card fixing device adapted to fix an interface card to a main board is provided. The interface card fixing device includes a base, a fixing portion, an engaging portion and a connecting portion. The base includes a first surface and a second surface opposite to each other and a protrusion protruding from the first surface. The base has a through hole passing through the first surface, the second surface and the protrusion so that the protrusion forms a hollow cylinder. The fixing portion extends from the second surface of the base and includes a breach communicating with the through hole. The engaging portion is adapted to pass through the through hole and the breach, and fix to the base. The connecting portion is connected to the base and the engaging portion. A main board module having the interface card fixing device is further provided.

Abstract: Provided is a slurry composition including abrasive particles, halogen oxide, and nitroxide compound. The combination of halogen oxide and nitroxide compound has a synergistic effect to remove a substrate containing tungsten and silicon oxide. Moreover, a use of the slurry composition and a polishing method using the slurry composition are provided.

Abstract: A connector cover is adapted to cover a connector. A fixing member of the connector protrudes from a connector lateral and includes a base portion and a top board located on the base portion. The top board and the base portion form a T shape pillar. The connector cover includes four cover laterals, and one of the cover laterals includes a concave. A position of the concave located on the cover lateral corresponds to a position of the fixing member located on the connector lateral, and a width of the concave is close to a width of base portion. When the connector cover is assembled to the connector, the cover laterals lean against the connector laterals. The base portion is located in the concave and walls of the cover lateral besides the concave is near or lean against the base portion. A connector and a connector module are further provided.

Abstract: A connector cover is adapted to cover a connector. A fixing member of the connector protrudes from a connector lateral and includes a base portion and a top board located on the base portion. The top board and the base portion form a T shape pillar. The connector cover includes four cover laterals, and one of the cover laterals includes a concave. A position of the concave located on the cover lateral corresponds to a position of the fixing member located on the connector lateral, and a width of the concave is close to a width of base portion. When the connector cover is assembled to the connector, the cover laterals lean against the connector laterals. The base portion is located in the concave and walls of the cover lateral besides the concave is near or lean against the base portion. A connector and a connector module are further provided.

Abstract: A connector cover adapted to cover a connector is provided. Two protrusions protruding from two ends of a connector body of the connector have two protrusion inner walls facing to each other and two grooves caved in the protrusion inner walls. The connector cover includes a cover body, having a cover top surface, and at least one cover protrusion disposed at a side of the cover body and protruding from the cover top surface. Each cover protrusion includes two cover protrusion side surfaces and at least one covering portion. Each covering portion, extending from one of the cover protrusion side surfaces and bending along outline of the protrusion protrusion inner wall to cover at least a portion of the protrusion protrusion inner wall, includes a protruding arm adapted to be located in the groove A cover module is further provided.

Abstract: A connector cover adapted to cover a connector is provided. Two protrusions protruding from two ends of a connector body of the connector have two protrusion inner walls facing to each other and two grooves caved in the protrusion inner walls. The connector cover includes a cover body, having a cover top surface, and at least one cover protrusion disposed at a side of the cover body and protruding from the cover top surface. Each cover protrusion includes two cover protrusion side surfaces and at least one covering portion. Each covering portion, extending from one of the cover protrusion side surfaces and bending along outline of the protrusion protrusion inner wall to cover at least a portion of the protrusion protrusion inner wall, includes a protruding arm adapted to be located in the groove A cover module is further provided.

Abstract: A PCI-E connector cover includes a first, a second cover lateral sides, a plurality of bending arms, a cover top surface and a plurality of connecting posts. The first, the second cover lateral sides and the cover top surface are adapted to cover a first, a second connector lateral sides and a connector top surface of a PCI-E connector. The bending arms are connected to the first cover lateral side and lean against a first connector concave of the PCI-E connector so as to keep an interval between the first cover lateral side and the first connector concave. The cover top surface is connected to the first, the second cover lateral sides. The connecting posts are extended from the first and the second cover lateral sides to fix to a main board. A PCI-E connector module is further provided.

Abstract: A PCI-E connector cover includes a first, a second cover laterals, a plurality of bending arms, a cover top surface and a plurality of connecting posts. The first, the second cover laterals and the cover top surface are adapted to cover a first, a second connector laterals and a connector top surface of a PCI-E connector. The bending anus are connected to the first cover lateral and lean against a first connector concave of the PCI-E connector so as to keep an interval between the first cover lateral and the first connector concave. The cover top surface is connected to the first, the second cover laterals. The connecting posts are extended from the first and the second cover laterals to fix to a main board. A PCI-E connector module is further provided.

Abstract: A stud used to support a circuit board on a case, the case has a tapped hole, and the circuit board has a locating hole. The stud includes a main body. The main body includes a screw thread portion and a carrying surface, wherein the main body is fixed to the tapped hole of the case by the screw thread portion, and the carrying surface withstands the circuit board, the carrying surface has an opening and a tooling groove, the opening is corresponding to the locating hole of the circuit board. A hand tool is inserting into the tooling groove of main body, and the shape of the hand tool corresponds to the shape of the tooling groove, so that the main body is able to be fixed to the case or detached from the case by the hand tool.

Abstract: An electronic connector includes a body and a fixing member penetrating through the body. A fastening section of the fixing member is inserted in the body, and an extending section of the fixing member protrudes from the body. The fastening section withstands a block portion of the body toward the extending section inside the body. In this way, when the electronic connector is assembled with a circuit board, the body of the electronic connector is fixed to the circuit board by the fastening section of the fixing member, for avoiding the body separating from the fixing member.

Abstract: An electronic connector includes a body and a fixing member penetrating through the body. A fastening section of the fixing member is inserted in the body, and an extending section of the fixing member protrudes from the body. The fastening section withstands a block portion of the body toward the extending section inside the body. In this way, when the electronic connector is assembled with a circuit board, the body of the electronic connector is fixed to the circuit board by the fastening section of the fixing member, for avoiding the body separating from the fixing member.

Abstract: A silica having metal ions absorbed thereon and a fabricating method thereof are provided. The silica having metal ions absorbed thereon is a silica having metal ions absorbed thereon and being modified with persulfate salt. The method includes following steps. A solution is provided, and the solution includes silica and persulfate salt therein. The solution is heated to react the silica with the persulfate salt, so as to obtain silica modified with persulfate salt. Metal ion source is added in the solution, the metal ion source dissociates metal ions, and the silica modified with persulfate salt absorbs the metal ions to obtain the silica having metal ions absorbed thereon.

Abstract: A memory connector with an increased pin interval is disclosed including a main body and a plurality of pins. The body includes a bottom, and the pins are disposed on the bottom along a longitudinal direction in an interlaced way. A recess is formed on the bottom of the main body corresponding to each of the pins at one end of the pin. The arrangement of the pins therein solves the problem of insufficient space for wiring lines of the main board, which is occurred frequently when the pins are fabricated by an SMD process, without increasing any manufacturing cost in particular.

Abstract: A silica having metal ions absorbed thereon and a fabricating method thereof are provided. The silica having metal ions absorbed thereon is a silica having metal ions absorbed thereon and being modified with persulfate salt. The method includes following steps. A solution is provided, and the solution includes silica and persulfate salt therein. The solution is heated to react the silica with the persulfate salt, so as to obtain silica modified with persulfate salt. Metal ion source is added in the solution, the metal ion source dissociates metal ions, and the silica modified with persulfate salt absorbs the metal ions to obtain the silica having metal ions absorbed thereon.

Abstract: A circuit board is provided, comprising a substrate, a first conductive layer, at least one through hole, a protection layer, a plurality of contacts and a fixing element. The first conductive layer is formed on the substrate. The through hole is formed on the substrate and the first conductive layer. The protection layer is formed on the first conductive layer, wherein the protection layer comprises a plurality of hollow portions, the hollow portions surround the through hole, and the first conductive layer is exposed in the hollow portions. The contacts are disposed in the hollow portions, wherein the contacts are protruding from a surface of the protection layer. The fixing element is fixed in the through hole, wherein the fixing element contacts the contacts.

Abstract: A circuit board is provided, comprising a substrate, a first conductive layer, at least one through hole, a protection layer, a plurality of contacts and a fixing element. The first conductive layer is formed on the substrate. The through hole is formed on the substrate and the first conductive layer. The protection layer is formed on the first conductive layer, wherein the protection layer comprises a plurality of hollow portions, the hollow portions surround the through hole, and the first conductive layer is exposed in the hollow portions. The contacts are disposed in the hollow portions, wherein the contacts are protruding from a surface of the protection layer. The fixing element is fixed in the through hole, wherein the fixing element contacts the contacts.