Abstract: An LED assembly (10) includes an LED (12) and a lens (16). The lens covers on an outer periphery of the LED. The LED has an encapsulant (125) and an LED chip (121) received in the encapsulant (125) and having a light emitting surface (122). The lens has a light output surface (161) over the light emitting surface. The light output surface defines a plurality of annular, concentric grooves (163). Each groove (163) is cooperatively enclosed by a first groove wall (165) and a second groove wall (166). The first groove wall is a portion of a periphery of an imaginary cone and a conical tip of the imaginary cone is located on the light emitting surface of the LED chip.

Abstract: A light emitting diode (10) includes an LED chip (14) and an encapsulant (16) enclosing the LED chip. The LED chip has a light emitting surface (141), and the encapsulant has a light output surface (161) over the light emitting surface. The light output surface defines a plurality of annular, concentric grooves (163). Each groove is cooperatively enclosed by a first groove wall (165) and a second groove wall (166). The first groove wall is a portion of a circumferential side surface of a cone, and a conical tip of the cone is located on the light emitting surface of the LED chip.

Abstract: A light emitting diode (LED) (100) includes a base (200), a chip body (300) and an encapsulation portion (400) sealing the chip body (300) in the base (200). The base (200) has a concave depression (220) defined therein. The depression (220) has a bottom wall (222) and a sidewall (224) extending upwardly from the bottom wall (222). The sidewall (224) is arranged in a half-ellipsoidal surface round the bottom wall (222). The chip body (300) is disposed on the bottom wall (222). The encapsulation portion (400) has a bottom portion (440) and a top portion (420). The bottom portion (440) has an outer surface (442) matingly received in the depression (220), and the top portion (420) has a convex, half-ellipsoidal surface (422). The sidewall (224) reflects light generated by the chip body (300) to run through the convex, half-ellipsoidal surface (422).

Abstract: A light emitting diode (LED) lamp (100) includes a heat sink (200), an LED module (400) attached to a bottom side of the heat sink (200), and an air exhausting duct (300). The air exhausting duct includes a cover (320) and a hollow tube (340) extending upwardly from the cover. The cover is mounted on a top side of the heat sink with an air collecting chamber (326) defined between the heat sink and the cover. The air collecting chamber communicates with an air passage (342) defined in the tube.

Abstract: A light source module (100) includes a plurality of light emitting diodes (13), a heat dissipation device (30) and a thermoelectric cooler (20). The thermoelectric cooler has a cold side (21) and a hot side (23). The light emitting diodes are in thermal engagement with the cold side of the thermoelectric cooler. The heat dissipation device is in thermal engagement with the hot side of the thermoelectric cooler.

Abstract: A method and system for enabling an auxiliary system to retrieve the system information from a computing device are disclosed. Specifically, one embodiment of the present invention sets forth a method, which includes the steps of requesting for the system information from an embedded controller of the computing device through a first bi-directional data bus if the computing device is shut down, requesting for the system information from the computing device through the first bidirectional bus during the boot-up sequence of the computing device, and requesting for the system information from the computing device through a general purpose input/output (GPIO) after the computing device completes the boot-up sequence.

Abstract: A reading lamp (100) includes a lamp holder (20), a lampshade (40), a bracket (30) connecting the lamp holder with the lampshade, and a white light illuminator (50) received in the lampshade. The white light illuminator includes a light mixer (52), and at least a group of solid-state, light emitting elements (544) arranged to at least one side of the light mixer. The at least a group of solid-state, light emitting elements includes three kinds of solid-state, light emitting elements which respectively emit red, green and blue lights. The light mixer reflects, refracts and mixes the red, green and blue lights to obtain white light which directly radiates and spreads from a light emitting surface (521) of the light mixer.

Abstract: A reading lamp (100) includes a lamp holder (20), a lampshade (30), a bracket (40) connecting the lamp holder with the lampshade, and a white light illuminator (50) received in the lampshade. The white light illuminator includes a light mixer (52) having a light emitting surface (521), and a plurality of light emitting diodes (542) arranged at one side of the light mixer. At least a phosphor layer (523) is disposed on the light emitting surface of the light mixer. Lights emitted by the light emitting diodes enter into the light mixer and spread out of the light mixer from the light emitting surface. The lights spread from the light mixer activate the at least a phosphor layer to emit lights and mix with the light emitted by the at least a phosphor layer thereby obtaining white lights.

Abstract: A heat dissipation device (100) for dissipating heat of LEDs (80) includes a heat sink (10). The heat sink includes a plurality of fins (12). Each of the plurality of fins defines a plurality of notches (120) in a peripheral edge thereof. The fins are spaced from each other from top to bottom. The notches coincide with each other from top to bottom so as to form a plurality of vertical air channels (122) in a periphery of the heat sink. A thermal base (40) has a bottom face to which the LEDs are attached. A U-shaped heat pipe (30) has an evaporator (32) connected to the thermal base and a condenser (35) extending upwardly through the fins.

Abstract: A Voice-over-IP capable SideShow device is disclosed. Specifically, according to one embodiment of the present invention, a SideShow device capable of supporting Voice-over-Internet-Protocol (VoIP) includes a modifiable content endpoint and a virtual UART. The content endpoint enables the SideShow device to support a set of configurable functions and associate customized events with the set of configurable functions for the SideShow device to display customized graphical user interface. The virtual UART facilitates the accessing of hardware resources in the SideShow device.

Abstract: An LED lamp (100) has a heat dissipation device (50) which includes a base (51) and a plurality of fins (53) extending from an outer side of the base. The base includes two channels (553). A capillary wick structure is formed in each of the channels. The channels contain working liquid therein. Two ends of each channel are sealed to form a heat pipe structure (55) in the base.

Abstract: A method for controlling a remote LED lamp includes: using a memory unit (452) to record a standard value for indicating a normal environmental brightness and a reference value for indicating a normal LED brightness; using a first sensor (41) to detect real-time brightness of the environmental light and transmit a signal (31) indicating the real-time brightness to the memory unit; using the memory unit to compare the signal with the standard value to obtain a result; using a driving unit (451) to control the LED light lamp to be turned on/off according to the result.

Abstract: An LED lamp (100) includes a heat sink (10), a powerless fan (30) and a plurality of LEDs (50). The fan is secured to the heat sink. The fan has an impeller (33) located above the heat sink. The LEDs are attached to a bottom of the heat sink. Heat generated by the LEDs is transferred to the heat sink, and accordingly, a natural convection is formed by a temperature gradient of air in the heat sink and pushes the impeller to rotate to generate a forced airflow toward the heat sink, which, in turn, enhances the natural convection of the air in the heat sink.

Abstract: An LED lamp (100) includes a frame (12), at least one LED module (20), a heat sink (32) and a cover (50). The LED module has a plurality of LEDs (220). The heat sink is mounted on the frame. The at least one LED module is attached to a bottom of the heat sink, whereby heat generated by the LEDs can be dissipated by the heat sink. A heat pipe (35) interconnects the heat sink and the cover. Thus, the heat generated by the LEDs can also be dissipated by the cover via the heat pipe. The cover is secured so as to shield a top portion of the heat sink and space from the top portion of the heat sink.

Abstract: A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (10) and a fan (30) generating airflow. The heat sink has a base (11) and a plurality of first fins (13) extending therefrom. First airflow channels (132) are defined between the first fins. A plurality of second fins (15) are transversely attached to the first fins. The second fins have second airflow channels (152) defined therebetween. The second airflow channels communicate with the first airflow channels.

Abstract: A heat dissipation device includes a column (1) for being positioned on an electronic device for dissipating heat therefrom, a plurality of fin units (5) attached to and stacked along the column, an H-shaped securing member (3) attached to the column below the fin units for securing the heat dissipation device to the electronic device, a pair of fan supports (7) extending from opposite sides of the securing member, and a fan (9) mounted on the fan supports. The fin units define a plurality of sprial air passages along an axis of the column which consist with air flow of the fan. Each of the fin units is configured by a metal disc with a plurality of sectors (54, 54?, 54?) and channels (56, 56?, 56?) between adjacent sectors.

Abstract: A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (10) and a fan (30) generating airflow. The heat sink has a base (11) and a plurality of first fins (13) extending therefrom. First airflow channels (132) are defined between the first fins. A plurality of second fins (15) are transversely attached to the first fins. The second fins have second airflow channels (152) defined therebetween. The second airflow channels communicate with the first airflow channels.

Abstract: A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout (62a, 64a) cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.

Abstract: A heat dissipation assembly includes a heat sink having a base and a plurality of heat dissipation fins disposed on the base, thermal interface material applied to the base opposing the fins, and a cap covering the base. The cap includes a body which shields the thermal interface material, and first and second wings extending from the body. The first wing is rotatable relative to the body to facilitate detaching the cap from the base of the heat sink.

Abstract: A heat dissipation device includes a column (1) for being positioned on an electronic device for dissipating heat therefrom, a plurality of fin units (5) attached to and stacked along the column, an H-shaped securing member (3) attached to the column below the fin units for securing the heat dissipation device to the electronic device, a pair of fan supports (7) extending from opposite sides of the securing member, and a fan (9) mounted on the fan supports. The fin units define a plurality of sprial air passages along an axis of the column which consist with air flow of the fan. Each of the fin units is configured by a metal disc with a plurality of sectors (54, 54?, 54?) and channels (56, 56?, 56?) between adjacent sectors.