Abstract: A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout (62a, 64a) cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.

Abstract: A heat pipe (100) includes a first substrate (102) including a plurality of first low fins (14) and high fins (16), and a second substrate (104) opposing the first substrate and including a plurality of second low fins (14) and high fins (16). A plurality of micro grooves (18) is formed between adjacent fins to form liquid channels (106) of the heat pipe. The first and second high fins are received in corresponding micro grooves of the heat pipe and soldered to the second and first substrates, respectively.

Abstract: A retaining device includes a retention frame (20), a back plate (40), a clip (10) and a wire arm (30). The retention frame forms a pair of protrusions (24, 25) at respective opposite sides thereof and an ear (26) at one of said sides of the retention frame. A pair of posts (44) extends from the back plate and further protrudes from the protrusions. The clip comprises a pressing lever (12) and a pair of legs (14, 16) depending from the lever. A pair of hooks (142, 162) is inwardly formed from the legs for engaging with the posts. The wire arm comprises a locating portion (34) positioned on the retention frame, a pressing portion (32) resting on the clip and an operating portion (36) clamped under the ear of the retention frame. The locating portion and the operating portion extend in opposite directions from the pressing portion.

Abstract: A heat sink includes a base plate (30), and a plurality of fins (10) mounted on the base plate. Each fin includes a main body (12), and two upper locking members (14). Two retaining holes (22) are defined in the main body. Each locking member includes a horizontal part (16), and a vertical part (18). A slot (15) is defined in the horizontal part. A key (20) is formed in the vertical part. In assembly, a second fin is moved relative to a first fin until the locking members of the second fin are received in the corresponding slots of the first fin, and the keys of the second fin snappingly engage in the corresponding retaining holes of the main body of the first fin. Thus, the two fins are interlocked together. The other fins are then sequentially interlocked with the second fin onward, in similar fashion.

Abstract: A clip for fastening a heat sink to a CPU mounted on a ZIF connector is made by stamping a metal sheet. The clip has an elongated body portion for pressing the heat sink toward the CPU. A first arm extends downward from a first end of the body portion and defines a hole about its free end for fitting with a first lug of the connector. A second arm extends downward from a second end of the body portion and defines a hole about its free end for fitting with a second lug of the connector. A handle portion is formed by plastic injection molding to be fixed to upper end of the second arm. The handle portion is used for receiving a manipulating force of the clip exerted directly by fingers of an operator. A pair of tabs integrally formed with the second arm is located below the handle portion and projects toward each other. A tool may be used to extend to abut the tabs via the handle portion, whereby the manipulating force of the clip may be exerted to the clip through the tool.