Abstract: Damascene or non-damascene processing when used with a method that includes (a) forming a mask having an opening therethrough on a structure, said opening having sidewalls; (b) implanting an inhibiting species into said structure through the opening so as to form an inhibiting region in said structure; and (c) growing a dielectric layer on the structure in said opening, wherein the inhibiting region partially inhibits growth of the dielectric layer is capable of forming a semiconductor structure, e.g., MOSFET or anti-fuse, including a dual thickness dielectric layer. Alternatively, the dual thickness dielectric can be formed by replacing the inhibiting species mentioned above with a dielectric growth enhancement species which forms an enhancing region in the structure which aids in the growth of the dielectric layer.

Abstract: An integrated circuit is provided that contains a coaxial signal line formed at least partially within a silicon-containing substrate. The coaxial signal line comprises an inner conductor having a length, said length axially surrounded by, and insulated from, an outer conductor along said length. A method of preparing such an integrated circuit having said coaxial signal line formed at least partially within a silicon-containing substrate is also disclosed herein.

Abstract: Damascene or non-damascene processing when used with a method that includes (a) forming a mask having an opening therethrough on a structure, said opening having sidewalls; (b) implanting an inhibiting species into said structure through the opening so as to form an inhibiting region in said structure; and (c) growing a dielectric layer on the structure in said opening, wherein the inhibiting region partially inhibits growth of the dielectric layer is capable of forming a semiconductor structure, e.g., MOSFET or anti-fuse, including a dual thickness dielectric layer. Alternatively, the dual thickness dielectric can be formed by replacing the inhibiting species mentioned above with a dielectric growth enhancement species which forms an enhancing region in the structure which aids in the growth of the dielectric layer.

Abstract: A universal fuse latch device includes a latch circuit receiving an electrical signal for initializing the latch circuit to a first state; one or more legs connected at the latch node, with a first leg implementing a fuse type element capable of transitioning the latch from the first state to a second state; and a second leg including an anti-fuse type element, wherein the fuse latch is provided with a fuse resistance trip point to ensure adequate reading of one of the fuse and anti-fuse type elements. The universal fuse latch device may be part of a programmable fuse bank including a plurality of information fuse latches for storing redundancy information in a memory system and capable of being simultaneously interrogated. A master fuse control device comprising the universal fuse latch circuit is programmed in accordance with a priority of legs to be interrogated in the information fuse latches.

Abstract: Damascene or non-damascene processing when used with a method that includes (a) forming a mask having an opening therethrough on a structure, said opening having sidewalls; (b) implanting an inhibiting species into said structure through the opening so as to form an inhibiting region in said structure; and (c) growing a dielectric layer on the structure in said opening, wherein the inhibiting region partially inhibits growth of the dielectric layer is capable of forming a semiconductor structure, e.g., MOSFET or anti-fuse, including a dual thickness dielectric layer. Alternatively, the dual thickness dielectric can be formed by replacing the inhibiting species mentioned above with a dielectric growth enhancement species which forms an enhancing region in the structure which aids in the growth of the dielectric layer.

Abstract: A universal fuse latch device comprises a latch circuit receiving a precharge signal and latching the precharge signal at a latch node thereof for initializing the latch to a first state; and one or more legs connected at the latch node, with a first leg implementing a fuse type element capable of transitioning the latch from the first state to a second state, and a second leg including an anti-fuse type element, wherein the fuse latch is provided with a fuse resistance trip point to ensure adequate programming of one of the fuse and anti-fuse type element. In one application, the universal fuse latch device is implemented as part of a programmable fuse bank comprising a plurality of information fuse latches for storing redundancy information in a memory system and capable of being simultaneously interrogated. A master fuse control device comprising the universal fuse latch circuit is provided that is programmed in accordance with a priority of legs to be interrogated in the information fuse latches.

Abstract: Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire pair connectors according to the present invention provide superior electrical performance, which includes reduced line inductance, incorporation of integrated passive components, and attachment of discrete passive and active components to the microflex. All of these features enable operation of the chip at increased frequencies.

Abstract: Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire pair connectors according to the present invention provide superior electrical performance, which includes reduced line inductance, incorporation of integrated passive components, and attachment of discrete passive and active components to the microflex. All of these features enable operation of the chip at increased frequencies.

Abstract: Damascene or non-damascene processing when used with a method that includes (a) forming a mask having an opening therethrough on a structure, said opening having sidewalls; (b) implanting an inhibiting species into said structure through the opening so as to form an inhibiting region in said structure; and (c) growing a dielectric layer on the structure in said opening, wherein the inhibiting region partially inhibits growth of the dielectric layer is capable of forming a semiconductor structure, e.g., MOSFET or anti-fuse, including a dual thickness dielectric layer. Alternatively, the dual thickness dielectric can be formed by replacing the inhibiting species mentioned above with a dielectric growth enhancement species which forms an enhancing region in the structure which aids in the growth of the dielectric layer.

Abstract: A variable power device circuit includes a plurality of devices for driving a load. Each of the devices has a body, which is electrically isolated from the substrate. All of the devices are coupled to an output node. The load is also coupled to the output node. A controller selectively turns on individual or multiple ones of the devices based on the electrical requirements of the load.

Abstract: An integrated circuit is provided that contains a coaxial signal line formed at least partially within a silicon-containing substrate. The coaxial signal line comprises an inner conductor having a length, said length axially surrounded by, and insulated from, an outer conductor along said length. A method of preparing such an integrated circuit having said coaxial signal line formed at least partially within a silicon-containing substrate is also disclosed herein.

Abstract: Through-chip conductors for low inductance chip-to-chip integration and off-chip connections in a semiconductor package is disclosed. A semiconductor device has active devices on the front surface, a first through-chip conductor having first electrical/physical characteristics passing from the front surface of the device to the back surface, a second through-chip conductor having second electrical/physical characteristics passing to the back surface, and an off-chip or chip-to-chip connector electrically connecting the active devices on the front surface to a different level of packaging.

Abstract: An integrated circuit that contains a coaxial signal line formed at least partially within a silicon-containing substrate. The coaxial signal line comprises an inner conductor having a length, said length axially surrounded by, and insulated from, an outer conductor along said length. A method of preparing such an integrated circuit having said coaxial signal line formed at least partially within a silicon-containing substrate is also disclosed herein.

Abstract: An integrated circuit includes a CPU, a power management unit and plural functional units each dedicated to executing different functions. The power management unit controls the threshold voltage of the different functional units to optimize power/performance operation of the circuit and intelligent power management control responds to the instruction stream and decodes each instruction in turn. This information identifies which of the functional units are required for the particular instruction and by comparing that information to power status, the intelligent power control determines whether the functional units required to execute the command are at the optimum power level. If they are, the command is allowed to proceed, otherwise the intelligent power control either stalls the instruction sequence or modifies process speed.

Abstract: Described is an antifuse array comprising a plurality of antifuse elements and a plurality of cell plates. Each of the antifuse elements comprises a programming transistor and one of the cell plates. The programming transistor and the cell plate of each antifuse element are both activated to program the antifuse element. Each of the cell plates is coupled to a portion of the plurality of antifuse elements and to one of a plurality of decode circuits, and the decode circuits selectively activate its coupled cell plate. With a preferred embodiment, a multitude of interconnect lines are connected to the antifuses and in particular, each interconnect line intersects each of the cell plates and is associated with one antifuse in each group of antifuses. With this preferred embodiment, the array of antifuses are decoded by predecoding one of the cell plates by elevating the cell plate voltage from ground to a program voltage, and decoding one of the interconnect lines to program one of the antifuses.

Abstract: Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire pair connectors according to the present invention provide superior electrical performance, which includes reduced line inductance, incorporation of integrated passive components, and attachment of discrete passive and active components to the microflex. All of these features enable operation of the chip at increased frequencies.

Abstract: Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire pair connectors according to the present invention provide superior electrical performance, which includes reduced line inductance, incorporation of integrated passive components, and attachment of discrete passive and active components to the microflex. All of these features enable operation of the chip at increased frequencies.

Abstract: Thin-film microflex twisted-wire pair and other connectors are disclosed. Semiconductor packages include microflex technology that electrically connects at least one chip to another level of packaging. Microflex connectors, such as thin-film twisted-wire pair connectors according to the present invention provide superior electrical performance, which includes reduced line inductance, incorporation of integrated passive components, and attachment of discrete passive and active components to the microflex. All of these features enable operation of a chip at increased frequencies.

Abstract: The advantages of the invention are realized by a chip-on-chip module having at least two fully functional chips, electrically connected together, and a chip-on-chip component connection/interconnection for electrically connecting the fully functional chips to external circuitry.

Abstract: Selective electrical connections between an electronic component and a test substrate are made using an electrical conductive material. The conductive material of the present invention is a dissolvable material, allowing for rework and repair of a wafer at the wafer-level, and retesting at the wafer-level. In addition, the conductive material may also be used in a permanent package, since the conductive material of the present invention provides complete electrical conductivity and connection between the electronic component and the substrate.