Patents by Inventor Criswell Choi
Criswell Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10332686Abstract: High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.Type: GrantFiled: December 20, 2016Date of Patent: June 25, 2019Assignee: Thin Film Electronics ASAInventors: Arvind Kamath, Criswell Choi, Patrick Smith, Erik Scher, Jiang Li
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Publication number: 20170098508Abstract: High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.Type: ApplicationFiled: December 20, 2016Publication date: April 6, 2017Applicant: Thin Film Electronics ASAInventors: Arvind KAMATH, Criswell CHOI, Patrick SMITH, Erik SCHER, Jiang LI
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Patent number: 9552924Abstract: High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.Type: GrantFiled: February 3, 2015Date of Patent: January 24, 2017Assignee: Thin Film Electronics ASAInventors: Arvind Kamath, Criswell Choi, Patrick Smith, Erik Scher, Jiang Li
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Patent number: 9400953Abstract: Methods, algorithms, processes, circuits, and/or structures for laser patterning suitable for customized RFID designs are disclosed. In one embodiment, a method of laser patterning of an identification device can include the steps of: (i) depositing a patternable resist formulation on a substrate having configurable elements and/or materials thereon; (ii) irradiating the resist formulation with a laser tool sufficiently to change the solubility characteristics of the resist in a developer; and (iii) developing exposed areas of the resist using the developer. Embodiments of the present invention can advantageously provide a relatively low cost and high throughput approach for customized RFID devices.Type: GrantFiled: May 22, 2014Date of Patent: July 26, 2016Assignee: Thin Film Electronics ASAInventors: Criswell Choi, Joerg Rockenberger, Christopher Gudeman, J. Devin Mackenzie, Partick Smith, James Montague Cleeves
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Patent number: 9361573Abstract: Wireless devices such as sensors, interactive displays and electronic article surveillance (EAS) and/or radio frequency identification (RFID) tags including integrated circuitry and an antenna and/or inductor printed thereon, and methods for making and using the same, are disclosed. The device generally includes an integrated circuit on a substrate and an antenna, directly on the substrate and/or the integrated circuit, in electrical communication with the integrated circuit. The method of making a wireless device generally includes forming an integrated circuit on the substrate and printing at least part of an antenna or antenna precursor layer on the integrated circuit and/or substrate. The present invention advantageously provides a low cost wireless device capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional devices.Type: GrantFiled: January 19, 2015Date of Patent: June 7, 2016Assignee: Thin Film Electronics ASAInventors: Vikram Pavate, Criswell Choi
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Publication number: 20150146345Abstract: High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.Type: ApplicationFiled: February 3, 2015Publication date: May 28, 2015Applicant: Thin Film Electronics ASAInventors: Arvind KAMATH, Criswell CHOI, Patrick SMITH, Erik SCHER, Jiang LI
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Publication number: 20150129667Abstract: Wireless devices such as sensors, interactive displays and electronic article surveillance (EAS) and/or radio frequency identification (RFID) tags including integrated circuitry and an antenna and/or inductor printed thereon, and methods for making and using the same, are disclosed. The device generally includes an integrated circuit on a substrate and an antenna, directly on the substrate and/or the integrated circuit, in electrical communication with the integrated circuit. The method of making a wireless device generally includes forming an integrated circuit on the substrate and printing at least part of an antenna or antenna precursor layer on the integrated circuit and/or substrate. The present invention advantageously provides a low cost wireless device capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional devices.Type: ApplicationFiled: January 19, 2015Publication date: May 14, 2015Applicant: THIN FILM ELECTRONICS ASAInventors: Vikram PAVATE, Criswell CHOI
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Patent number: 9016585Abstract: Wireless devices such as sensors, interactive displays and electronic article surveillance (EAS) and/or radio frequency identification (RFID) tags including integrated circuitry and an antenna and/or inductor printed thereon, and methods for making and using the same, are disclosed. The device generally includes an integrated circuit on a substrate and an antenna, directly on the substrate and/or the integrated circuit, in electrical communication with the integrated circuit. The method of making a wireless device generally includes forming an integrated circuit on the substrate and printing at least part of an antenna or antenna precursor layer on the integrated circuit and/or substrate. The present invention advantageously provides a low cost wireless device capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional devices.Type: GrantFiled: November 24, 2009Date of Patent: April 28, 2015Assignee: Thin Film Electronics ASAInventors: Vikram Pavate, Criswell Choi
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Patent number: 9004366Abstract: Printed integrated circuitry and attached antenna and/or inductor for sensors, electronic article surveillance (EAS), radio frequency (RF) and/or RF identification (RFID) tags and devices, and methods for its manufacture. The tag generally includes printed integrated circuitry on one carrier and an antenna and/or inductor on another carrier, the integrated circuitry being electrically coupled to the antenna and/or inductor. The method of manufacture generally includes of printing an integrated circuit having a plurality of first pads on a carrier, forming an antenna and/or inductor having a plurality of second pads on a substrate, and attaching at least two of the first pads of the printed integrated circuit to corresponding second pads of the antenna and/or inductor.Type: GrantFiled: October 10, 2008Date of Patent: April 14, 2015Assignee: Thin Film Electronics ASAInventors: Patrick Smith, Criswell Choi, Vikram Pavate, James Montague Cleeves, Vivek Subramanian, Richard Young, Vince Biviano
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Patent number: 8973231Abstract: High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition are disclosed. The method generally includes the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. The methods provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.Type: GrantFiled: April 23, 2013Date of Patent: March 10, 2015Assignee: Thin Film Electronics ASAInventors: Arvind Kamath, Criswell Choi, Patrick Smith, Erik Scher, Jiang Li
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Patent number: 8933806Abstract: The present invention relates to methods of making capacitors for use in surveillance/identification tags or devices, and methods of using such surveillance/identification devices. The capacitors manufactured according to the methods of the present invention and used in the surveillance/identification devices described herein comprise printed conductive and dielectric layers. The methods and devices of the present invention improve the manufacturing tolerances associated with conventional metal-plastic-metal capacitor, as well as the deactivation reliability of the capacitor used in a surveillance/identification tag or device.Type: GrantFiled: August 20, 2012Date of Patent: January 13, 2015Assignee: Thin Film Electronics ASAInventors: Vivek Subramanian, Patrick Smith, Vikram Pavate, Arvind Kamath, Criswell Choi, Aditi Chandra, James Montague Cleeves
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Patent number: 8912890Abstract: The disclosure relates to surveillance and/or identification devices having capacitors connected in parallel or in series, and methods of making and using such devices. Devices with capacitors connected in parallel, where one capacitor is fabricated with a relatively thick capacitor dielectric and another is fabricated with a relatively thin capacitor dielectric achieve both a high-precision capacitance and a low breakdown voltage for relatively easy surveillance tag deactivation. Devices with capacitors connected in series result in increased lateral dimensions of a small capacitor. This makes the capacitor easier to fabricate using techniques that may have relatively limited resolution capabilities.Type: GrantFiled: October 1, 2012Date of Patent: December 16, 2014Assignee: Thin Film Electronics ASAInventors: Patrick Smith, Criswell Choi, James Montague Cleeves, Vivek Subramanian, Arvind Kamath, Steven Molesa
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Patent number: 8758982Abstract: Methods, algorithms, processes, circuits, and/or structures for laser patterning suitable for customized RFID designs are disclosed. In one embodiment, a method of laser patterning of an identification device can include the steps of: (i) depositing a patternable resist formulation on a substrate having configurable elements and/or materials thereon; (ii) irradiating the resist formulation with a laser tool sufficiently to change the solubility characteristics of the resist in a developer; and (iii) developing exposed areas of the resist using the developer. Embodiments of the present invention can advantageously provide a relatively low cost and high throughput approach for customized RFID devices.Type: GrantFiled: November 8, 2006Date of Patent: June 24, 2014Assignee: Thin Film Electronics ASAInventors: Criswell Choi, Patrick Smith, James Montague Cleeves, Joerg Rockenberger, Christopher Gudeman, J. Devin MacKenzie
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Publication number: 20140091909Abstract: The present invention relates to surveillance and/or identification devices having capacitors connected in parallel or in series, and methods of making and using such devices. Devices with capacitors connected in parallel, where one capacitor is fabricated with a relatively thick capacitor dielectric and another is fabricated with a relatively thin capacitor dielectric achieve both a high-precision capacitance and a low breakdown voltage for relatively easy surveillance tag deactivation. Devices with capacitors connected in series result in increased lateral dimensions of a small capacitor. This makes the capacitor easier to fabricate using techniques that may have relatively limited resolution capabilities.Type: ApplicationFiled: October 1, 2012Publication date: April 3, 2014Inventors: Patrick SMITH, Criswell CHOI, James Montague CLEEVES, Vivek SUBRAMANIAN, Arvind KAMATH, Steven MOLESA
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Patent number: 8461628Abstract: A MOS transistor with a laser-patterned metal gate, and methods for its manufacture. The method generally includes forming a layer of metal-containing material on a dielectric film, wherein the dielectric film is on an electrically functional substrate comprising an inorganic semiconductor; laser patterning a metal gate from the metal-containing material layer; and forming source and drain terminals in the inorganic semiconductor in locations adjacent to the metal gate. The transistor generally includes an electrically functional substrate; a dielectric film on at least portions of the electrically functional substrate; a laser patterned metal gate on the dielectric film; and source and drain terminals comprising a doped inorganic semiconductor layer adjacent to the metal gate. The present invention advantageously provides MOS thin film transistors having reliable electrical characteristics quickly, efficiently, and/or at a low cost by eliminating one or more conventional photolithographic steps.Type: GrantFiled: August 11, 2005Date of Patent: June 11, 2013Assignee: Kovio, Inc.Inventors: Criswell Choi, Joerg Rockenberger, J. Devin MacKenzie, Christopher Gudeman
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Patent number: 8446706Abstract: High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.Type: GrantFiled: October 10, 2008Date of Patent: May 21, 2013Assignee: Kovio, Inc.Inventors: Arvind Kamath, Criswell Choi, Patrick Smith, Erik Scher, Jiang Li
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Publication number: 20130069785Abstract: The present invention relates to methods of making capacitors for use in surveillance/identification tags or devices, and methods of using such surveillance/identification devices. The capacitors manufactured according to the methods of the present invention and used in the surveillance/identification devices described herein comprise printed conductive and dielectric layers. The methods and devices of the present invention improve the manufacturing tolerances associated with conventional metal-plastic-metal capacitor, as well as the deactivation reliability of the capacitor used in a surveillance/identification tag or device.Type: ApplicationFiled: August 20, 2012Publication date: March 21, 2013Inventors: Vivek SUBRAMANIAN, Patrick Smith, Vikram Pavate, Arvind Kamath, Criswell Choi, Aditi Chandra, James Montague Cleeves
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Patent number: 8296943Abstract: The present invention relates to surveillance and/or identification devices having capacitors connected in parallel or in series, and methods of making and using such devices. Devices with capacitors connected in parallel, where one capacitor is fabricated with a relatively thick capacitor dielectric and another is fabricated with a relatively thin capacitor dielectric achieve both a high-precision capacitance and a low breakdown voltage for relatively easy surveillance tag deactivation. Devices with capacitors connected in series result in increased lateral dimensions of a small capacitor. This makes the capacitor easier to fabricate using techniques that may have relatively limited resolution capabilities.Type: GrantFiled: May 15, 2009Date of Patent: October 30, 2012Assignee: Kovio, Inc.Inventors: Patrick Smith, Criswell Choi, James Montague Cleeves, Vivek Subramanian, Arvind Kamath, Steven Molesa
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Patent number: 8264359Abstract: The present invention relates to methods of making capacitors for use in surveillance/identification tags or devices, and methods of using such surveillance/identification devices. The capacitors manufactured according to the methods of the present invention and used in the surveillance/identification devices described herein comprise printed conductive and dielectric layers. The methods and devices of the present invention improve the manufacturing tolerances associated with conventional metal-plastic-metal capacitor, as well as the deactivation reliability of the capacitor used in a surveillance/identification tag or device.Type: GrantFiled: October 10, 2008Date of Patent: September 11, 2012Assignee: Kovio, Inc.Inventors: Vivek Subramanian, Patrick Smith, Vikram Pavate, Arvind Kamath, Criswell Choi, Aditi Chandra, James Montague Cleeves
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Patent number: 8227320Abstract: The present invention relates to methods of making capacitors for use in surveillance/identification tags or devices, and methods of using such surveillance/identification devices. The capacitors manufactured according to the methods of the present invention and used in the surveillance/identification devices described herein comprise printed conductive and dielectric layers. The methods and devices of the present invention improve the manufacturing tolerances associated with conventional metal-plastic-metal capacitor, as well as the deactivation reliability of the capacitor used in a surveillance/identification tag or device.Type: GrantFiled: October 10, 2008Date of Patent: July 24, 2012Assignee: Kovio, Inc.Inventors: Vivek Subramanian, Patrick Smith, Vikram Pavate, Arvind Kamath, Criswell Choi, Aditi Chandra, James Montague Cleeves