Abstract: In some embodiments, processes for testing for structural flaws in sapphire parts such as display cover plates used in the manufacturing of electronic devices are disclosed. A process may include transmitting a destructive acoustic signal onto a sapphire part, and determining whether the sapphire part failed in response to the destructive signal. The destructive acoustic signal may include a Rayleigh acoustic wave, wherein the destructive acoustic signal breaks the sapphire part if the sapphire part has a surface flaw larger than a specified size. In this manner, only sapphire parts that can withstand the destructive acoustic signal are used in manufacturing of the electronic device.

Abstract: Systems and methods for continuous sapphire growth are disclosed. One embodiment may take the form of a method including feeding a base material into a crucible located within a growth chamber, heating the crucible to melt the base material and initiating crystalline growth in the melted base material to create a crystal structure. Additionally, the method includes pulling the crystal structure away from crucible and feeding the crystal structure out of the growth chamber.

Abstract: Systems and method for creating crystalline parts having a desired primary and secondary crystallographic orientations are provided. One embodiment may take the form of a method of manufacturing a part having a crystalline structure. The method includes melting aluminum oxide and drawing the melted aluminum oxide up a slit. Additionally, the method includes orienting the seed crystal relative to a growth apparatus such that a crystalline structure grows having a desired primary plane and a desired secondary plane orientation. Moreover, the method includes pulling the crystal as it forms to create a ribbon shaped crystalline structure and cutting a part from the crystalline structure.

Abstract: A layered coating for a sapphire component is described herein. The sapphire component comprises one or more layers of alumina adhered to the surface of a sapphire member. At least the first layer of alumina adheres to the surface of the sapphire member filling all defects in the surface forming a pristine new layer that also provides isolation from damage.

Abstract: A material testing apparatus and methods of testing material are disclosed. The material testing apparatus may include a support ring contacting a test material and a moveable contact component positioned adjacent to the support ring. The moveable contact component may include a substantially curved contact surface comprising a radius-varying curvature profile formed between a center and a perimeter of the substantially curve contact surface. The curvature profile may be based on a predetermined deflection-force profile specific to the test material. Additionally, the curvature profile may also be based on the material characteristics of the test material, the physical characteristics of the test material, the physical characteristics of the support ring and/or a testing process performed on the test material.

Abstract: A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device.

Abstract: A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device.

Abstract: Methods and a system for proof testing brittle components of electronic devices are disclosed. The method may include positioning the brittle component relative to a probe of a testing system, contacting the probe to a surface of the brittle component at a first location, and applying a first force at the first location using the probe to create a first localized tensile band below the surface of the brittle component. The method may also include contacting the probe to the surface of the brittle component at a second location, distinct from the first location, and applying a second force at the second location using the probe to create a second localized tensile band below the surface of the brittle component.

Abstract: A method of modifying a substrate formed of non-deformable material is disclosed. In some embodiments, techniques are disclosed for identifying a region of a planar substrate that is susceptible to stretching during a subsequent shaping operation. In some embodiments, techniques are disclosed for adding an amount of non-deformable material to the planar substrate at an identified location and in a single operation, acting on the substrate until the substrate has a shape corresponding to a uniform thickness and a three-dimensional curvature.

Abstract: A manufacturing method for sapphire crystal material is disclosed, including a laser-etched bar code formed into the interior of the sapphire crystal material. The laser-etched bar code may be associated with one or more manufacturing parameters or other manufacturing data. The sapphire crystal may be used to create a cover sheet for use with a display screen of a portable electronic device.

Abstract: A material testing apparatus and methods of testing material are disclosed. The material testing apparatus may include a support ring contacting a test material and a moveable contact component positioned adjacent to the support ring. The moveable contact component may include a substantially curved contact surface comprising a radius-varying curvature profile formed between a center and a perimeter of the substantially curve contact surface. The curvature profile may be based on a predetermined deflection-force profile specific to the test material. Additionally, the curvature profile may also be based on the material characteristics of the test material, the physical characteristics of the test material, the physical characteristics of the support ring and/or a testing process performed on the test material.

Abstract: A cover glass including a center region and an outer region abutting the center region at an interface. The interface inhibits crack propagation from the outer region to the center region and vice versa. In another embodiment the cover glass may include mitigation voids introduced into the cover glass to inhibit crack propagation. The interface may be formed from the mitigation voids.

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Abstract: A cover glass including a center region and an outer region abutting the center region at an interface. The interface inhibits crack propagation from the outer region to the center region and vice versa. In another embodiment the cover glass may include mitigation voids introduced into the cover glass to inhibit crack propagation. The interface may be formed from the mitigation voids.

Abstract: Systems and methods for polishing a ceramic component using a laser. The ceramic component may include a planar region that is polished using, for example, a mechanical or chemical mechanical polishing operation to produce a polished face. A contoured region that is adjacent to the planar region may be irradiated using a laser to heat the ceramic material within the contoured region. The irradiation may reduce the surface roughness of the contoured region to produce a polished surface. The ceramic component may be heated prior to being irradiated with the laser to reduce thermal gradients within the ceramic component.

Abstract: A system for heat treating sapphire components to increase strength while maintaining the optical finish and/or transparency of the component. The system may include a fixture positioned in a furnace and configured to suspend an array or group of sapphire components. The fixture may include notches or other features to assist in locating and positioning the sapphire components. Shield elements or enclosures may also be interspersed with the sapphire components and may help produce a more uniform heat distribution and protect the sapphire components from emissions or deposits. Some aspects are directed to a sleeve tool and fixture jig that can be used to assemble the sapphire components onto the fixture in a way that reduces the risk of marring or otherwise damaging the sapphire components.

Abstract: A system and processes for heat treating sapphire components to improve strength while maintaining the optical finish and/or transparency of the component. The processes may include an annealing process that uses an inert gas to reduce potential contaminants and the presence of reactive gasses. The process may also include a multi-stage heating process that may reduce thermally induced stress within the sapphire component which may produce slip lines or other optical defects. The process may also include a series of wet ultrasonic cleaning operations that reduce potential contaminants which may cause optical defects in an annealed sapphire component. An example system, fixtures, and shields are also described, which may improve the quality of the heat-treating process.

Abstract: This is directed to a cable structure for use with an electronic device. The cable structure can include one or more conductors around which a sheath is provided. To prevent the cable structure from tangling, the cable structure can include a core placed between the conductors and the sheath, where a stiffness of the core can be varied along different segments of the cable structure to facilitate or hinder bending of the cable structure in different areas. The size and distribution of the stiffer portions can be selected to prevent the cable from forming loops. The resistance of the core to bending can be varied using different approaches including, for example, by varying the materials used in the core, varying a cross-section of portions of the core, or combinations of these.

Abstract: An electronic device may be provided with a display mounted in a housing. The display may have an array of display pixels that provide image light to a user. The array of display pixels may form an active display structure with a rectangular shape. The rectangular active display structure may be surrounded by an inactive border region. Optical structures such as a sheet of glass or another optical member may have portions that are configured to bend light from the display pixels along the periphery of the active display structure. The optical member may have an area that is larger than the area of the active display structure, so that the presence of the optical member may serve to enlarge the apparent size of the display. Solidified liquid polymer may be used to support the optical structures and may be interposed between the optical structures and the active display structures.

Abstract: A display may have an array of display pixels that generate an image. A coherent fiber bundle may be mounted on the display pixels. The coherent fiber bundle may have a first surface that is adjacent to the display pixels and a second surface that is visible to a viewer. The coherent fiber bundle may contain fibers that carry light from the first surface to the second surface. The second surface may be planar or may have a central planar region and curved edge regions that run along opposing sides of the central planar region. The fibers may have cross-sectional surface areas with a first aspect ratio on the first surface and a second aspect ratio that is greater than the first aspect ratio on the second surface.