Abstract: A display may have an array of display pixels that generate an image. A coherent fiber bundle may be mounted on the display pixels. The coherent fiber bundle may have a first surface that is adjacent to the display pixels and a second surface that is visible to a viewer. The coherent fiber bundle may contain fibers that carry light from the first surface to the second surface. The second surface may be planar or may have a central planar region and curved edge regions that run along opposing sides of the central planar region. The fibers may have cross-sectional surface areas with a first aspect ratio on the first surface and a second aspect ratio that is greater than the first aspect ratio on the second surface.

Abstract: An electronic device comprises a housing, a display coupled to the housing, and a protective cover coupled to the housing and covering the display. The protective cover comprises a transparent layer having a first surface facing the display and a second surface opposite the first surface. The protective cover also comprises a sapphire layer having a third surface corresponding to an exterior surface of the electronic device. The sapphire layer also has a fourth surface opposite the third surface and bonded to the second surface of the transparent layer via intermolecular forces.

Abstract: A display may have an array of display pixels that generate an image. A coherent fiber bundle may be mounted on the display pixels. The coherent fiber bundle may have a first surface that is adjacent to the display pixels and a second surface that is visible to a viewer. The coherent fiber bundle may contain fibers that carry light from the first surface to the second surface. The second surface may be planar or may have a central planar region and curved edge regions that run along opposing sides of the central planar region. The fibers may have cross-sectional surface areas with a first aspect ratio on the first surface and a second aspect ratio that is greater than the first aspect ratio on the second surface.

Abstract: Systems and methods for strengthening a sapphire part are described herein. One method may take the form of orienting a first surface of a sapphire member relative to an ion implantation device, selecting an ion implantation concentration and directing ions at the first surface of the sapphire member. The ions are embedded under the first surface to create compressive stress in the sapphire surface.

Abstract: An electronic device may include a biometric sensing device that has a sensing area, and a substrate positioned above the sensing area and/or the biometric sensing device. The substrate can include vias that are formed through at least a portion of the substrate. The vias can be positioned at least above the sensing area of the biometric sensing device. The vias may be filled with a conductive material or a dielectric material. Alternatively, some vias can be filled with a conductive material while other vias are filled with a non-conductive or dielectric material.

Abstract: An electronic device may be provided with a display mounted in a housing. The display may have an array of display pixels that provide light to a user. The array of display pixels may form active display structures with a rectangular shape. The rectangular active display structures may be surrounded by an inactive border region. Reflector structures may be used to reflect light that is emitted from peripheral portions of the active display structures to a portion of the display overlapping the inactive border region, thereby providing the display with an effective active area that is larger than the area of the active display structures. The reflector structures may include rotatable reflectors. Control circuitry may use a rotatable positioner to rotate rotatable reflector structures in synchronization with controlling which pixel data is displayed by the display pixels in the peripheral portions of the active display structures.

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

Abstract: An electronic device including a signal transmission system. The electronic device may include a housing, and a cover coupled to the housing and defining a groove formed in the cover. The electronic device may also include a signal transmission system positioned within the housing. The signal transmission system may include an antenna at least partially received within the groove formed in the cover. The antenna may have an antenna body, and a contact pad in electrical communication with the antenna body. The signal transmission system may also have a flexible member positioned adjacent the antenna body. The flexible member may contact the contact pad of the antenna.

Abstract: Systems and methods for strengthening a sapphire part are described herein. One embodiment may take the form of a method including orienting a first surface of a sapphire member relative to an ion implantation device and performing a first implantation step. The implanting step may include directing ions at the first surface of the sapphire member to embed them under the first surface. The systems and methods may also include one or more of heating the sapphire member to diffuse the implanted ions into deeper layers of sapphire member, cooling the sapphire member, and performing at least a second implantation step directing ions at the first surface of the sapphire member to embed the ions under the first surface.

Abstract: A strengthened film for a substrate such as a glass panel is provided. The strengthened film may be formed by implanting sodium in the film, and then performing an exchange through which the sodium is replaced by potassium. The film may be an anti-reflective coating. Related assemblies and methods are also provided.

Abstract: Methods for creating sapphire windows are provided herein. In particular, one embodiment may take the form of a method of manufacturing sapphire windows. The method includes obtaining a polished sapphire wafer and applying decoration to the sapphire wafer. The method also includes cutting the sapphire wafer into discrete windows. In some embodiments, the cutting step comprises laser ablation of the sapphire.

Abstract: A protective film configured to protect a substrate such as a glass panel for a display is provided. The protective film may include a discontinuous outer layer including a multitude of panels and gaps positioned therebetween. Further, the protective film may include a flexible layer positioned between the discontinuous outer layer and the substrate. When panels of the discontinuous outer layer are impacted by a foreign object, the force may be transferred to the flexible layer, rather than propagating through the outer layer. In this regard, the gaps between the panels of the discontinuous outer layer may prevent the formation of cracks that may otherwise occur. Related assemblies and methods are also provided.

Abstract: Apparatus, systems and methods for increasing the strength of glass are disclosed. The strengthening of one portion of the glass article can be performed to a greater degree than another portion. Additionally, to mitigate against any distortion, such as warpage, physical manipulation of the glass article can be performed prior to or during strengthening, namely chemical strengthening. For example, in accordance with one embodiment, an outer surface of a glass article (e.g., cover glass) can be chemically strengthened to a greater degree than an inner surface of the glass article, yet the asymmetric strengthening does not induce distortion of the glass article because the glass article was physically manipulated, such as being bent, to counter any such distortion. Accordingly, glass articles that have undergone chemical strengthening processing are able to be not only thin and undistorted but also sufficiently strong and resistant to damage.

Abstract: An electronic device may be provided with a display mounted in a housing. The display may have an array of display pixels that provide image light to a user. The array of display pixels may form active display structures with a rectangular shape. The rectangular active display structures may be surrounded by an inactive border region. Liquid crystal light distribution structures may be used to distribute light that is emitted from peripheral portions of the active display structures to a portion of the display overlapping the inactive border region, thereby increasing the apparent area of the display. The light distribution structures may include a liquid crystal cell, a reflecting polarizer, and a reflector that reflects light from the peripheral portions of the active display structures vertically upwards after the light has passed through the liquid crystal cell and has reflected off of the reflecting polarizer.

Abstract: An electronic device may include a biometric sensing device that has a sensing area, and a substrate positioned above the sensing area and/or the biometric sensing device. The substrate can include vias that are formed through at least a portion of the substrate. The vias can be positioned at least above the sensing area of the biometric sensing device. The vias may be filled with a conductive material or a dielectric material. Alternatively, some vias can be filled with a conductive material while other vias are filled with a non-conductive or dielectric material.

Abstract: Methods related to efficient processing of sapphire are discussed which are expected to both speed manufacture of corundum for applications and make the use of conundrum cost effective. In particular, one embodiment may take the form of a method of cutting a hard transparent material having a polished surface. The method includes roughening the polished surface, directing a laser beam at the hard transparent material to melt the material and removing the melted hard material.

Abstract: A method of inspecting and forming sapphire structures. The method of inspecting a sapphire structure may include may include providing an annealed sapphire structure, and measuring a profile of at least a portion of the annealed sapphire structure. The profile of at least the portion of the annealed sapphire structure may be measured using a non-x-ray based measuring device. Additionally, the method of inspecting may include identifying a defect within at least a portion of the measured profile of the annealed sapphire structure.

Abstract: A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.

Abstract: In some embodiments, processes for testing for structural flaws in sapphire parts such as display cover plates used in the manufacturing of electronic devices are disclosed. A process may include transmitting a destructive acoustic signal onto a sapphire part, and determining whether the sapphire part failed in response to the destructive signal. The destructive acoustic signal may include a Rayleigh acoustic wave, wherein the destructive acoustic signal breaks the sapphire part if the sapphire part has a surface flaw larger than a specified size. In this manner, only sapphire parts that can withstand the destructive acoustic signal are used in manufacturing of the electronic device.

Abstract: A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device.