Abstract: A new and useful method is provided for Goos-Hanchen compensation in an optical autofocus (AF) system that uses light reflected from a substrate to determine changes in the z position of a substrate. According to the method of the invention reflected light from the substrate is provided at a plurality of wavelengths and polarizations, detected and used to make corrections that compensate for the errors due to the Goos-Hanchen effect.

Abstract: A substrate handling structure is provided that is particularly useful with an imaging optical system that images a single reticle to a pair of imaging locations. The principles of the present invention provide substrate handling structures with new and useful metrology structures, and new and useful ways of moving substrates in relation to the imaging locations, that are designed to provide benefits in providing information as to the substrate position as a substrate is being imaged, while reducing the size of the support structure. These features are believed to be important as imaging of substrates in the 450 mm diameter range is developing.

Abstract: An autofocus system and method designed to account for instabilities in the system, e.g. due to instabilities of system components (e.g. vibrating mirrors, optics, etc) and/or environmental effects such as refractive index changes of air due to temperature, atmospheric pressure, or humidity gradients, is provided. An autofocus beam is split into a reference beam component (the split off reference channel) and a measurement beam component, by a beam splitting optic located a predetermined distance from (and in predetermined orientation relative to) the substrate, to create a first space between the beam splitting optic and the substrate. A reflector is provided that is spaced from the beam splitting optic by the predetermined distance, to create a second space between the reflector and the beam splitting optic.

Abstract: A new and useful optical imaging process is provided for imaging of a plurality of substrates, in a manner that makes efficient use of an optical imaging system with the capability to image a single reticle to a pair of imaging locations, and addresses the types of substrate stage movement patterns to accomplish such imaging in an efficient and effective manner. At least three substrates are imaged by moving their substrate stages in patterns whereby (i) two of the substrates are completely imaged at respective imaging locations, (ii) a substrate on at least one of the three stages is partially imaged at one imaging location and then partially imaged at the other imaging location, and (iii) the movement of the stages of the three substrates is configured to avoid movement of the stages of the three substrates in paths that would cause interference between movement of any one substrate stage with movement of any of the other substrate stages.

Abstract: An exposure apparatus (10) for transferring a mask pattern (12A) from a mask (12) to first and second substrates (14A) (14B) includes an illumination system (18) that generates and simultaneously directs a first beam (32A) at the mask pattern (12A) and a second beam (32B) at the mask pattern (12A). Further, the first beam (32A) is spaced apart from the second beam (32B) at the mask pattern (12A). As provided herein, the first beam (32A) directed at the mask (12) creates a first pattern beam (34A) that is transferred to a first substrate location (33A), and the second beam (32B) directed at the mask (12) creates a second pattern beam (34B) that is transferred to a second substrate location (33B). Moreover, the first substrate location (33A) is spaced apart from the second substrate location (33B). With this design, the first pattern beam (34A) can be transferred to the first substrate (14A) and the second pattern beam (34B) can be simultaneously transferred to the second substrate (14B).

Abstract: An exposure apparatus (10) for transferring a mask pattern (358) from a mask (12) to a substrate (14) includes a mask retainer (44), a substrate stage assembly (24), and an illumination system (18). The mask retainer (44) retains the mask (12). The substrate stage assembly (24) retains and positions the substrate (14). The illumination system (18) generates an illumination beam (31) that moves along a beam scan axis (35) relative to the mask (12) to scan at least a portion of the mask pattern (358). The beam scan axis (35) is substantially parallel to the mask pattern (358). The illumination system (18) can include an illumination source (32) that generates the illumination beam (31) and an illumination optical assembly (34) that guides the illumination beam (31). The illumination optical assembly (34) moves the illumination beam (31) relative to the mask (12) so that the illumination beam (31) scans substantially the entire mask pattern (358).

Abstract: An autofocus system (222C) for measuring the position of a work piece (200) along an axis includes a slit light source assembly (236), a slit detector assembly (238), and a control system (224). The slit light source assembly (236) directs a first slit of light (342A) at a first slit area (344A) of the work piece (200). The slit detector assembly (238) detects light reflected off of the first slit area (344A) and generates a first slit signal relating to the amount of light reflected off of the first slit area (344A) at the slit detector assembly (238). The control system (224) uses the first slit signal from the slit detector assembly (238), and first reflectance information of the first slit area (344A) to determine the position of the work piece (200) along the axis. With this design, the autofocus system (222C) can compensate for the changes in reflectivity of the work piece (200).

Abstract: An edge shot (“ES”) exposure apparatus (14) for transferring edge features (ef) to a substrate edge region (222) of a substrate (18) includes a feature transferer (55), and an ES wafer stage assembly (62). The feature transferer (55) transfers one or more edge features (ef) to the substrate edge region (222), while the ES wafer stage assembly (62) rotates the substrate (18) about a substrate axis (23). This allows the feature transferer (55) to transfer the edge features (ef) to a plurality of alternative locations in the substrate edge region (222). The ES exposure apparatus (14) can be used in conjunction with a primary exposure apparatus (12) that transfers usable features (uf) to a substrate usable region (220) of the substrate (18). With this design, the primary exposure apparatus (12) can be transferring usable features (uf) to a first substrate (18A) while the ES exposure apparatus (14) is transferring edge features (ef) to a second substrate (18B).