Abstract: A downconverter layer transfer device, and methods of making and using the downconverter layer transfer device, are disclosed.

Abstract: A method includes mounting a ceramic phosphor on an acrylic-free and metal-containing catalyst-free tacky layer of a dicing tape, dicing the ceramic phosphor from the dicing tape into ceramic phosphor plates, removing the ceramic phosphor plates from the dicing tape, and attaching the ceramic phosphor plates on light-emitting device (LED) dies.

Abstract: A downconverter layer transfer device, and methods of making and using the downconverter layer transfer device, are disclosed. A downconverter layer transfer device includes a release liner and a downconverter layer disposed on the release liner, the downconverter layer including a downconverter material dispersed throughout an adhesive, the downconverter layer being solid and non-adhesive at a first temperature, and adhesive at an elevated temperature above the first temperature.

Abstract: A downconverter layer transfer device, and methods of making and using the downconverter layer transfer device, are disclosed.

Abstract: Methods of producing substrates having selected active chemical regions by employing elements of the substrates in assisting the localization of active chemical groups in desired regions of the substrate. The methods may include optical, chemical and/or mechanical processes for the deposition, removal, activation and/or deactivation of chemical groups in selected regions of the substrate to provide selective active regions of the substrate.

Abstract: Methods of producing substrates having selected active chemical regions by employing elements of the substrates in assisting the localization of active chemical groups in desired regions of the substrate. The methods may include optical, chemical and/or mechanical processes for the deposition, removal, activation and/or deactivation of chemical groups in selected regions of the substrate to provide selective active regions of the substrate.

Abstract: Light emitting devices (LEDs) are described herein. An LED includes a light emitting semiconductor structure, a wavelength converting material and an off state white material. The light emitting semiconductor structure includes a light-emitting active layer disposed between an n-layer and a p-layer. The wavelength converting material has a first surface adjacent the light emitting semiconductor structure and a second surface opposite the first surface. The off state white material is in direct contact with the second surface of the wavelength converting material and includes multiple core-shell particles disposed in an optically functional material. Each of the core-shell particles includes a core material encased in a polymer or inorganic shell. The core material includes a phase change material.

Abstract: Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication.

Abstract: Methods of producing substrates having selected active chemical regions by employing elements of the substrates in assisting the localization of active chemical groups in desired regions of the substrate. The methods may include optical, chemical and/or mechanical processes for the deposition, removal, activation and/or deactivation of chemical groups in selected regions of the substrate to provide selective active regions of the substrate.

Abstract: A method includes mounting a ceramic phosphor on an acrylic-free and metal-containing catalyst-free tacky layer of a dicing tape, dicing the ceramic phosphor from the dicing tape into ceramic phosphor plates, removing the ceramic phosphor plates from the dicing tape, and attaching the ceramic phosphor plates on light-emitting device (LED) dies.

Abstract: A method includes mounting a ceramic phosphor (102) on an acrylic-free and metal-containing catalyst-free tacky layer (108) of a dicing tape (104), dicing the ceramic phosphor (102) from the dicing tape (104) into ceramic phosphor plates (11)2, removing the ceramic phosphor plates (112) from the dicing tape (104), and attaching the ceramic phosphor plates (112) on light-emitting device (LED) dies.

Abstract: Methods of producing substrates having selected active chemical regions by employing elements of the substrates in assisting the localization of active chemical groups in desired regions of the substrate. The methods may include optical, chemical and/or mechanical processes for the deposition, removal, activation and/or deactivation of chemical groups in selected regions of the substrate to provide selective active regions of the substrate.

Abstract: Light emitting devices (LEDs) are described herein. An LED includes a light emitting semiconductor structure, a wavelength converting material and an off state white material. The light emitting semiconductor structure includes a light-emitting active layer disposed between an n-layer and a p-layer. The wavelength converting material has a first surface adjacent the light emitting semiconductor structure and a second surface opposite the first surface. The off state white material is in direct contact with the second surface of the wavelength converting material and includes multiple core-shell particles disposed in an optically functional material. Each of the core-shell particles includes a core material encased in a polymer or inorganic shell. The core material includes a phase change material.

Abstract: Light emitting devices (LEDs) are described herein. An LED includes a light emitting semiconductor structure, a wavelength converting material and an off state white material. The light emitting semiconductor structure includes a light-emitting active layer disposed between an n-layer and a p-layer. The wavelength converting material has a first surface adjacent the light emitting semiconductor structure and a second surface opposite the first surface. The off state white material is in direct contact with the second surface of the wavelength converting material and includes multiple core-shell particles disposed in an optically functional material. Each of the core-shell particles includes a core material encased in a polymer or inorganic shell. The core material includes a phase change material.

Abstract: Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication.

Abstract: Methods of producing substrates having selected active chemical regions by employing elements of the substrates in assisting the localization of active chemical groups in desired regions of the substrate. The methods may include optical, chemical and/or mechanical processes for the deposition, removal, activation and/or deactivation of chemical groups in selected regions of the substrate to provide selective active regions of the substrate.

Abstract: Light emitting devices (LEDs) are described herein. An LED includes a light emitting semiconductor structure, a wavelength converting material and an off state white material. The light emitting semiconductor structure includes a light-emitting active layer disposed between an n-layer and a p-layer. The wavelength converting material has a first surface adjacent the light emitting semiconductor structure and a second surface opposite the first surface. The off state white material is in direct contact with the second surface of the wavelength converting material and includes multiple core-shell particles disposed in an optically functional material. Each of the core-shell particles includes a core material encased in a polymer or inorganic shell. The core material includes a phase change material.

Abstract: A method includes mounting a ceramic phosphor (102) on an acrylic-free and metal-containing catalyst-free tacky layer (108) of a dicing tape (104), dicing the ceramic phosphor (102) from the dicing tape (104) into ceramic phosphor plates (11)2, removing the ceramic phosphor plates (112) from the dicing tape (104), and attaching the ceramic phosphor plates (112) on light-emitting device (LED) dies.

Abstract: Embodiments of the invention include a luminescent material. Particles of the luminescent material include a core of a first semiconductor material, a first shell of a second semiconductor material surrounding the core, a second shell of an insulating material disposed on a surface of the first shell, and a coating disposed on a surface of the second shell. The core shows quantum confinement and has a size in the nanometer range in at least one dimension.

Abstract: A light emission device comprising a light emitting element, a wavelength conversion (e.g. phosphor) element, and a filter that reduces Color over Angle (CoA) effects by at least partially reflecting light from the light emitting element that strike the filter at near-normal angles of incidence. In some embodiments, a combined phosphor and filter layer is formed over the LED die. The filter may comprise a dispersion of self-aligning moieties, such as dielectric platelets in a film that is vacuum laminated to the LED structure. Xirallic® Galaxy Blue pigment, comprising an aluminum oxide core coated on both sides with thin films of SnO2, and TiO2, and Ronastar® Blue, comprising Calcium Aluminum Borosilicate and TiO2 may provide the dielectric platelets.