Patents by Inventor Darrel R. Frear
Darrel R. Frear has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9638597Abstract: A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance.Type: GrantFiled: September 24, 2014Date of Patent: May 2, 2017Assignee: NXP USA, Inc.Inventors: Stephen R. Hooper, Darrel R. Frear, Thomas C. Speight
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Patent number: 9598280Abstract: A device in which an electronic circuit positioned within a cavity of a package housing is encased by a bubble restrictor material, with a media resistant material overlaying the bubble restrictor material. The bubble restrictor material functions to inhibit the formation and growth of moisture-related bubbles within the material, including at the interfaces of the material and surfaces within the package housing. The media resistant material is resistant to physical and chemical alterations by media within an external environment to which the device is exposed. The media resistant material and bubble resistant material function to transfer a sensed characteristic of the media to the electronic circuit.Type: GrantFiled: November 10, 2014Date of Patent: March 21, 2017Assignee: NXP USA, Inc.Inventors: Akhilesh K. Singh, Dwight L. Daniels, Darrel R. Frear, Stephen R. Hooper
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Patent number: 9510495Abstract: Embodiments include devices and methods of their manufacture. A device embodiment includes a package housing, at least one electronic circuit (e.g., a sensor circuit), a first material, and a second material. The package housing includes a cavity that is partially defined by a cavity bottom surface, and the cavity bottom surface includes a mounting area and a non-mounting area. The at least one electronic circuit is attached to the cavity bottom surface over the mounting area. The first material has a relatively high, first modulus of elasticity, and covers the non-mounting area. The second material has a relatively low, second modulus of elasticity, and is disposed over the first material within the cavity.Type: GrantFiled: November 27, 2012Date of Patent: November 29, 2016Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Stephen R. Hooper, Darrel R. Frear, William C. Stermer, Jr.
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Patent number: 9466413Abstract: Embodiments of inductive communication devices include first and second galvanically isolated IC die and a dielectric structure. Each IC die has a coil proximate to a first surface of the IC die. The IC die are arranged so that the first surfaces of the IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. The dielectric structure is positioned within the gap directly between the first and second coils, and a plurality of conductive structures are positioned in or on the dielectric structure and electrically coupled with the second IC die. The conductive structures include portions configured to function as bond pads, and the bond pads may be coupled to package leads using wirebonds. During operation, signals are conveyed between the IC die through inductive coupling between the coils.Type: GrantFiled: June 28, 2013Date of Patent: October 11, 2016Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Fred T. Brauchler, John M. Pigott, Darrel R. Frear, Vivek Gupta, Randall C. Gray, Norman L. Owens, Carl E. D'Acosta
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Publication number: 20160130136Abstract: A device in which an electronic circuit positioned within a cavity of a package housing is encased by a bubble restrictor material, with a media resistant material overlaying the bubble restrictor material. The bubble restrictor material functions to inhibit the formation and growth of moisture-related bubbles within the material, including at the interfaces of the material and surfaces within the package housing. The media resistant material is resistant to physical and chemical alterations by media within an external environment to which the device is exposed. The media resistant material and bubble resistant material function to transfer a sensed characteristic of the media to the electronic circuit.Type: ApplicationFiled: November 10, 2014Publication date: May 12, 2016Inventors: AKHILESH K. SINGH, DWIGHT L. DANIELS, DARREL R. FREAR, STEPHEN R. HOOPER
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Publication number: 20160084722Abstract: A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance.Type: ApplicationFiled: September 24, 2014Publication date: March 24, 2016Applicant: FREESCALE SEMICONDUCTOR INC.Inventors: Stephen R. Hooper, Darrel R. Frear, Thomas C. Speight
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Publication number: 20150001948Abstract: Embodiments of inductive communication devices include first and second galvanically isolated IC die and a dielectric structure. Each IC die has a coil proximate to a first surface of the IC die. The IC die are arranged so that the first surfaces of the IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. The dielectric structure is positioned within the gap directly between the first and second coils, and a plurality of conductive structures are positioned in or on the dielectric structure and electrically coupled with the second IC die. The conductive structures include portions configured to function as bond pads, and the bond pads may be coupled to package leads using wirebonds. During operation, signals are conveyed between the IC die through inductive coupling between the coils.Type: ApplicationFiled: June 28, 2013Publication date: January 1, 2015Inventors: Fred T. BRAUCHLER, John M. PIGOTT, Darrel R. FREAR, Vivek GUPTA, Randall C. GRAY, Norman L. OWENS, Carl E. D'ACOSTA
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Publication number: 20150004902Abstract: Embodiments of inductive communication devices include first and second galvanically isolated IC die. The first IC die has a first coil proximate to a first surface of the first IC die, and the second IC die has a second coil proximate to a first surface of the second IC die. The first and second IC die are arranged so that the first surfaces of the first and second IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. One or more dielectric components are positioned within the gap directly between the first and second coils. During operation, a first signal is provided to the first coil, and the first coil converts the signal into a time-varying magnetic field. The magnetic field couples with the second coil, which produces a corresponding second signal.Type: ApplicationFiled: June 28, 2013Publication date: January 1, 2015Inventors: John M. Pigott, Fred T. Brauchler, Darrel R. Frear, Vivek Gupta, Randall C. Gray, Norman L. Owens, Carl E. D'Acosta
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Patent number: 8742555Abstract: A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped to resist movement against encapsulating mold material in a plane of the edge feature. By bending a portion of the edge feature, improved mold locking of the flag is provided in multiple planes.Type: GrantFiled: August 30, 2011Date of Patent: June 3, 2014Inventors: Jian Wen, Darrel R. Frear, William G. McDonald
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Publication number: 20140146509Abstract: Embodiments include devices and methods of their manufacture. A device embodiment includes a package housing, at least one electronic circuit (e.g., a sensor circuit), a first material, and a second material. The package housing includes a cavity that is partially defined by a cavity bottom surface, and the cavity bottom surface includes a mounting area and a non-mounting area. The at least one electronic circuit is attached to the cavity bottom surface over the mounting area. The first material has a relatively high, first modulus of elasticity, and covers the non-mounting area. The second material has a relatively low, second modulus of elasticity, and is disposed over the first material within the cavity.Type: ApplicationFiled: November 27, 2012Publication date: May 29, 2014Inventors: STEPHEN R. HOOPER, DARREL R. FREAR, WILLIAM C. STERMER, JR.
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Publication number: 20130049181Abstract: A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped to resist movement against encapsulating mold material in a plane of the edge feature. By bending a portion of the edge feature, improved mold locking of the flag is provided in multiple planes.Type: ApplicationFiled: August 30, 2011Publication date: February 28, 2013Inventors: Jian Wen, Darrel R. Frear, William G. McDonald
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Publication number: 20120252169Abstract: An integrated circuit assembly includes a panel including an semiconductor device at least partially surrounded by an encapsulant. A panel upper surface and a device active surface are substantially coplanar. The assembly further includes one or more interconnect layers overlying the panel upper surface. Each of the interconnect layers includes an insulating film having contacts formed therein an interconnect metallization formed thereon. A lower surface of the panel is substantially coplanar with either a backside of the device or a lower surface of a thermally and electrically conductive slab that has an upper surface in thermal contact with the device backside. The assembly may also include a set of panel vias. The panel vias are thermally and electrically conductive conduits extending through the panel between the interconnect layer and suitable for bonding with a land grid array (LGA) or other contact structure of an underlying circuit board.Type: ApplicationFiled: June 14, 2012Publication date: October 4, 2012Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: Neil T. Tracht, Darrel R. Frear, James R. Griffiths, Lizabeth Ann A. Keser, Tien Yu T. Lee, Elie A. Maalouf
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Patent number: 8217511Abstract: An integrated circuit assembly includes a panel including an semiconductor device at least partially surrounded by an encapsulant. A panel upper surface and a device active surface are substantially coplanar. The assembly further includes one or more interconnect layers overlying the panel upper surface. Each of the interconnect layers includes an insulating film having contacts formed therein an interconnect metallization formed thereon. A lower surface of the panel is substantially coplanar with either a backside of the device or a lower surface of a thermally and electrically conductive slab that has an upper surface in thermal contact with the device backside. The assembly may also include a set of panel vias. The panel vias are thermally and electrically conductive conduits extending through the panel between the interconnect layer and suitable for bonding with a land grid array (LGA) or other contact structure of an underlying circuit board.Type: GrantFiled: July 31, 2007Date of Patent: July 10, 2012Assignee: Freescale Semiconductor, Inc.Inventors: Neil T. Tracht, Darrel R Frear, James R. Griffiths, Lizabeth Ann A. Keser, Tien Yu T. Lee, Elie A. Maalouf
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Patent number: 7981730Abstract: An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (1) using a double side adhesive tape (2), and then sequentially depositing an insulating layer (15) and a conductive shielding layer (16) before encapsulating the modules with a molding compound (17). After removing the adhesive tape (2) to expose a surface of the encapsulated modules, a multi-layer circuit substrate (100) is formed over the exposed surface, where the circuit substrate includes shielding via structures (101-112) that are aligned with and electrically connected to the conductive shielding layer (16), thereby encircling and shielding the circuit module(s).Type: GrantFiled: July 9, 2008Date of Patent: July 19, 2011Assignee: Freescale Semiconductor, Inc.Inventors: Jinbang Tang, Darrel R. Frear, Scott M. Hayes, Douglas G. Mitchell
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Patent number: 7838420Abstract: A packaged semiconductor device includes an interconnect layer over a first side of a polymer layer, a semiconductor device surrounded on at least three sides by the polymer layer and coupled to the interconnect layer, a first conductive element over a second side of the polymer layer, wherein the second side is opposite the first side, and a connector block within the polymer layer. The connector block has at least one electrical path extending from a first surface of the connector block to a second surface of the connector block. The at least one electrical path electrically couples the interconnect layer to the first conductive element. A method of forming the packaged semiconductor device is also described.Type: GrantFiled: August 29, 2007Date of Patent: November 23, 2010Assignee: Freescale Semiconductor, Inc.Inventors: Jinbang Tang, Darrel R. Frear, William H. Lytle
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Patent number: 7763976Abstract: A disclosed integrated circuit (IC) module includes an IC panel and multi level circuit structure, referred to as an IPD structure, overlying an upper surface of the IC panel. The IC panel includes an electrically conductive embedded ground plane (EGP), an integrated circuit (IC) die, and an encapsulating material. The EGP is a substantially planar structure that includes or defines a plurality of cavities. The EGP may include or define an IC cavity and an IPD cavity. The IC die may be positioned within the IC cavity such that a perimeter of the IC cavity surrounds the IC die. The IPD structure may define or include a passive device such as an inductor. The passive device may be positioned or located overlying the void in the EGP.Type: GrantFiled: September 30, 2008Date of Patent: July 27, 2010Assignee: Freescale Semiconductor, Inc.Inventors: Jinbang Tang, Darrel R. Frear, Robert J. Wenzel
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Publication number: 20100078760Abstract: A disclosed integrated circuit (IC) module includes an IC panel and multi level circuit structure, referred to as an IPD structure, overlying an upper surface of the IC panel. The IC panel includes an electrically conductive embedded ground plane (EGP), an integrated circuit (IC) die, and an encapsulating material. The EGP is a substantially planar structure that includes or defines a plurality of cavities. The EGP may include or define an IC cavity and an IPD cavity. The IC die may be positioned within the IC cavity such that a perimeter of the IC cavity surrounds the IC die. The IPD structure may define or include a passive device such as an inductor. The passive device may be positioned or located overlying the void in the EGP.Type: ApplicationFiled: September 30, 2008Publication date: April 1, 2010Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: Jinbang Tang, Darrel R. Frear, Robert J. Wenzel
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Publication number: 20100006988Abstract: An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (1) using a double side adhesive tape (2), and then sequentially depositing an insulating layer (15) and a conductive shielding layer (16) before encapsulating the modules with a molding compound (17). After removing the adhesive tape (2) to expose a surface of the encapsulated modules, a multi-layer circuit substrate (100) is formed over the exposed surface, where the circuit substrate includes shielding via structures (101-112) that are aligned with and electrically connected to the conductive shielding layer (16), thereby encircling and shielding the circuit module(s).Type: ApplicationFiled: July 9, 2008Publication date: January 14, 2010Inventors: Jinbang Tang, Darrel R. Frear, Scott M. Hayes, Douglas G. Mitchell
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Publication number: 20090072357Abstract: An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (10) using a double side adhesive tape (12) before encapsulating the modules with a molding compound (16), and then forming shielding via ring structures (51-54) in the molding compound (16) to surround and shield each module. After removing the adhesive tape (12) to expose a surface of the encapsulated modules, a multi-layer circuit substrate (101) is formed over the exposed surface, where the circuit substrate includes shielding via structures (121-124) that are aligned with and electrically connected to the shielding via ring structures (51-54), thereby encircling and shielding the circuit module(s).Type: ApplicationFiled: September 13, 2007Publication date: March 19, 2009Inventors: Jinbang Tang, Darrel R. Frear, Jong-Kai Lin
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Publication number: 20090057849Abstract: A packaged semiconductor device includes an interconnect layer over a first side of a polymer layer, a semiconductor device surrounded on at least three sides by the polymer layer and coupled to the interconnect layer, a first conductive element over a second side of the polymer layer, wherein the second side is opposite the first side, and a connector block within the polymer layer. The connector block has at least one electrical path extending from a first surface of the connector block to a second surface of the connector block. The at least one electrical path electrically couples the interconnect layer to the first conductive element. A method of forming the packaged semiconductor device is also described.Type: ApplicationFiled: August 29, 2007Publication date: March 5, 2009Inventors: Jinbang Tang, Darrel R. Frear, William H. Lytle