Patents by Inventor Darrell Rinerson

Darrell Rinerson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11672189
    Abstract: A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric filed to cause oxygen ionic motion.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: June 6, 2023
    Assignee: Hefei Reliance Memory Limited
    Inventors: Darrell Rinerson, Christophe J. Chevallier, Wayne Kinney, Roy Lambertson, John E. Sanchez, Jr., Lawrence Schloss, Philip Swab, Edmond Ward
  • Patent number: 11502249
    Abstract: A re-writeable non-volatile memory device including a re-writeable non-volatile two-terminal memory element (ME) having tantalum. The ME including a first terminal, a second terminal, a first layer of a conductive metal oxide (CMO), and a second layer in direct contact with the first layer. The second layer and the first layer being operative to store at least one-bit of data as a plurality of resistive states, and the first and second layer are electrically in series with each other and with the first and second terminals.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: November 15, 2022
    Assignee: Hefei Reliance Memory Limited
    Inventors: Christophe J. Chevallier, Steve Kuo-Ren Hsia, Wayne Kinney, Steven Longcor, Darrell Rinerson, John Sanchez, Philip F. S. Swab, Edmond R. Ward
  • Patent number: 11398256
    Abstract: Embodiments relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement a memory architecture that includes local bit lines for accessing subsets of memory elements, such as memory elements based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes a cross-point memory array formed above a logic layer. The cross-point memory array includes X-lines and Y-lines, of which at least one Y-line includes groups of Y-line portions. Each of the Y-line portions can be arranged in parallel with other Y-line portions within a group of the Y-line portions. Also included are memory elements disposed between a subset of the X-lines and the group of the Y-line portions. In some embodiments, a decoder is configured to select a Y-line portion from the group of Y-line portions to access a subset of the memory elements.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: July 26, 2022
    Assignee: Unity Semiconductor Corporation
    Inventors: Chang Hua Siau, Christophe Chevallier, Darrell Rinerson, Seow Fong Lim, Sri Rama Namala
  • Patent number: 11063214
    Abstract: A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric filed to cause oxygen ionic motion.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: July 13, 2021
    Assignee: Hefei Reliance Memory Limited
    Inventors: Darrell Rinerson, Christophe J. Chevallier, Wayne Kinney, Roy Lambertson, John E. Sanchez, Jr., Lawrence Schloss, Philip Swab, Edmond Ward
  • Publication number: 20210193917
    Abstract: A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric filed to cause oxygen ionic motion.
    Type: Application
    Filed: March 8, 2021
    Publication date: June 24, 2021
    Inventors: Darrell RINERSON, Christophe J. CHEVALLIER, Wayne KINNEY, Roy LAMBERTSON, John E. SANCHEZ, JR., Lawrence SCHLOSS, Philip SWAB, Edmond WARD
  • Publication number: 20210013262
    Abstract: A re-writeable non-volatile memory device including a re-writeable non-volatile two-terminal memory element (ME) having tantalum. The ME including a first terminal, a second terminal, a first layer of a conductive metal oxide (CMO), and a second layer in direct contact with the first layer. The second layer and the first layer being operative to store at least one-bit of data as a plurality of resistive states, and the first and second layer are electrically in series with each other and with the first and second terminals.
    Type: Application
    Filed: September 22, 2020
    Publication date: January 14, 2021
    Inventors: Christophe J. CHEVALLIER, Steve Kuo-Ren HSIA, Wayne KINNEY, Steven LONGCOR, Darrell RINERSON, John SANCHEZ, Philip F.S. SWAB, Edmond R. WARD
  • Patent number: 10833125
    Abstract: A re-writeable non-volatile memory device including a re-writeable non-volatile two-terminal memory element (ME) having tantalum. The ME including a first terminal, a second terminal, a first layer of a conductive metal oxide (CMO), and a second layer in direct contact with the first layer. The second layer and the first layer being operative to store at least one-bit of data as a plurality of resistive states, and the first and second layer are electrically in series with each other and with the first and second terminals.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: November 10, 2020
    Assignee: Hefei Reliance Memory Limited
    Inventors: Christophe J. Chevallier, Steve Kuo-Ren Hsia, Wayne Kinney, Steven Longcor, Darrell Rinerson, John Sanchez, Philip F. S. Swab, Edmond R. Ward
  • Patent number: 10797106
    Abstract: A re-writeable non-volatile memory device including a re-writeable non-volatile two-terminal memory element (ME) having tantalum. The ME including a first terminal, a second terminal, a first layer of a conductive metal oxide (CMO), and a second layer in direct contact with the first layer. The second layer and the first layer being operative to store at least one-bit of data as a plurality of resistive states, and the first and second layer are electrically in series with each other and with the first and second terminals.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: October 6, 2020
    Assignee: Hefei Reliance Memory Limited
    Inventors: Christophe J. Chevallier, Steve Kuo-Ren Hsia, Wayne Kinney, Steven Longcor, Darrell Rinerson, John Sanchez, Philip F. S. Swab, Edmond R. Ward
  • Publication number: 20200302973
    Abstract: Embodiments relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement a memory architecture that includes local bit lines for accessing subsets of memory elements, such as memory elements based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes a cross-point memory array formed above a logic layer. The cross-point memory array includes X-lines and Y-lines, of which at least one Y-line includes groups of Y-line portions. Each of the Y-line portions can be arranged in parallel with other Y-line portions within a group of the Y-line portions. Also included are memory elements disposed between a subset of the X-lines and the group of the Y-line portions. In some embodiments, a decoder is configured to select a Y-line portion from the group of Y-line portions to access a subset of the memory elements.
    Type: Application
    Filed: April 9, 2020
    Publication date: September 24, 2020
    Inventors: Chang Hua Siau, Christophe Chevallier, Darrell Rinerson, Seow Fong Lim, Sri Rama Namala
  • Publication number: 20200259079
    Abstract: A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric filed to cause oxygen ionic motion.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 13, 2020
    Inventors: Darrell RINERSON, Christophe J. CHEVALLIER, Wayne KINNEY, Roy LAMBERTSON, John E. SANCHEZ, JR., Lawrence SCHLOSS, Philip SWAB, Edmond WARD
  • Patent number: 10680171
    Abstract: A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric filed to cause oxygen ionic motion.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: June 9, 2020
    Assignee: Hefei Reliance Memory Limited
    Inventors: Darrell Rinerson, Christophe J. Chevallier, Wayne Kinney, Roy Lambertson, John E. Sanchez, Jr., Lawrence Schloss, Philip Swab, Edmond Ward
  • Patent number: 10622028
    Abstract: Embodiments relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement a memory architecture that includes local bit lines for accessing subsets of memory elements, such as memory elements based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes a cross-point memory array formed above a logic layer. The cross-point memory array includes X-lines and Y-lines, of which at least one Y-line includes groups of Y-line portions. Each of the Y-line portions can be arranged in parallel with other Y-line portions within a group of the Y-line portions. Also included are memory elements disposed between a subset of the X-lines and the group of the Y-line portions. In some embodiments, a decoder is configured to select a Y-line portion from the group of Y-line portions to access a subset of the memory elements.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: April 14, 2020
    Assignee: Unity Semiconductor Corporation
    Inventors: Chang Hua Siau, Christophe Chevallier, Darrell Rinerson, Seow Fong Lim, Sri Rama Namala
  • Publication number: 20190305047
    Abstract: A re-writeable non-volatile memory device including a re-writeable non-volatile two-terminal memory element (ME) having tantalum. The ME including a first terminal, a second terminal, a first layer of a conductive metal oxide (CMO), and a second layer in direct contact with the first layer. The second layer and the first layer being operative to store at least one-bit of data as a plurality of resistive states, and the first and second layer are electrically in series with each other and with the first and second terminals.
    Type: Application
    Filed: May 14, 2019
    Publication date: October 3, 2019
    Inventors: Christophe J. CHEVALLIER, Steve Kuo-Ren HSIA, Wayne KINNEY, Steven LONGCOR, Darrell RINERSON, John SANCHEZ, Philip F.S. SWAB, Edmond R. WARD
  • Patent number: 10340312
    Abstract: A re-writeable non-volatile memory device including a re-writeable non-volatile two-terminal memory element (ME) having tantalum. The ME including a first terminal, a second terminal, a first layer of a conductive metal oxide (CMO), and a second layer in direct contact with the first layer. The second layer and the first layer being operative to store at least one-bit of data as a plurality of resistive states, and the first and second layer are electrically in series with each other and with the first and second terminals.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: July 2, 2019
    Assignee: Hefei Reliance Memory Limited
    Inventors: Christophe J. Chevallier, Steve Kuo-Ren Hsia, Wayne Kinney, Steven Longcor, Darrell Rinerson, John Sanchez, Philip F. S. Swab, Edmond R. Ward
  • Publication number: 20190173006
    Abstract: A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric filed to cause oxygen ionic motion.
    Type: Application
    Filed: January 30, 2019
    Publication date: June 6, 2019
    Inventors: Darrell RINERSON, Christophe J. CHEVALLIER, Wayne KINNEY, Roy LAMBERTSON, John E. SANCHEZ, JR., Lawrence SCHLOSS, Philip SWAB, Edmond WARD
  • Patent number: 10224480
    Abstract: A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric filed to cause oxygen ionic motion.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: March 5, 2019
    Assignee: Hefei Reliance Memory Limited
    Inventors: Darrell Rinerson, Christophe J. Chevallier, Wayne Kinney, Roy Lambertson, John E. Sanchez, Jr., Lawrence Schloss, Philip Swab, Edmond Ward
  • Publication number: 20180342268
    Abstract: Embodiments relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement a memory architecture that includes local bit lines for accessing subsets of memory elements, such as memory elements based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes a cross-point memory array formed above a logic layer. The cross-point memory array includes X-lines and Y-lines, of which at least one Y-line includes groups of Y-line portions. Each of the Y-line portions can be arranged in parallel with other Y-line portions within a group of the Y-line portions. Also included are memory elements disposed between a subset of the X-lines and the group of the Y-line portions. In some embodiments, a decoder is configured to select a Y-line portion from the group of Y-line portions to access a subset of the memory elements.
    Type: Application
    Filed: May 18, 2018
    Publication date: November 29, 2018
    Inventors: Chang Hua Siau, Christophe Chevallier, Darrell Rinerson, Seow Fong Lim, Sri Rama Namala
  • Patent number: 10002646
    Abstract: Embodiments relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement a memory architecture that includes local bit lines for accessing subsets of memory elements, such as memory elements based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes a cross-point memory array formed above a logic layer. The cross-point memory array includes X-lines and Y-lines, of which at least one Y-line includes groups of Y-line portions. Each of the Y-line portions can be arranged in parallel with other Y-line portions within a group of the Y-line portions. Also included are memory elements disposed between a subset of the X-lines and the group of the Y-line portions. In some embodiments, a decoder is configured to select a Y-line portion from the group of Y-line portions to access a subset of the memory elements.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: June 19, 2018
    Assignee: Unity Semiconductor Corporation
    Inventors: Chang Hua Siau, Christophe Chevallier, Darrell Rinerson, Seow Fong Lim, Sri Rama Namala
  • Publication number: 20180130946
    Abstract: A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric filed to cause oxygen ionic motion.
    Type: Application
    Filed: October 30, 2017
    Publication date: May 10, 2018
    Inventors: Darrell Rinerson, Christophe J. Chevallier, Wayne Kinney, Roy Lambertson, John E. Sanchez, JR., Lawrence Schloss, Philip Swab, Edmond Ward
  • Publication number: 20180122857
    Abstract: A re-writeable non-volatile memory device including a re-writeable non-volatile two-terminal memory element (ME) having tantalum. The ME including a first terminal, a second terminal, a first layer of a conductive metal oxide (CMO), and a second layer in direct contact with the first layer. The second layer and the first layer being operative to store at least one-bit of data as a plurality of resistive states, and the first and second layer are electrically in series with each other and with the first and second terminals.
    Type: Application
    Filed: October 30, 2017
    Publication date: May 3, 2018
    Inventors: Christophe J. Chevallier, Steve Kuo-Ren Hsia, Wayne Kinney, Steven Longcor, Darrell Rinerson, John Sanchez, Philip F.S. Swab, Edmond R. Ward