Abstract: Embodiments described herein include a chipless patterned conductor, comprising one or more glyphs. Each glyph comprises a disk and a ring structure including at least one ring surrounding the disk. One or more of a spacing between the disk and the at least one ring and a width of the at least one ring is configured to determine a characteristic resonant frequency of the glyph. At least one notch is disposed in at least one of the disk and at least one ring of the ring structure. The at least one notch is configured such that the magnitude of resonances in the glyph are dependent on polarization direction.

Abstract: Disclosed herein are embodiments of compositions for gas sensing and sensors utilizing the same. In one embodiment, a composition comprises carbon nanotubes and polymer-coated metal nanoparticles bound to the carbon nanotubes.

Abstract: Disclosed herein are embodiments of compositions for gas sensing and sensors utilizing the same. In one embodiment, a composition comprises carbon nanotubes and and polymer-coated metal nanoparticles bound to the carbon nanotubes.

Abstract: A capacitive relative humidity sensor includes a first electrode and a second electrode, where at least the one of the electrodes is a water-permeable electrode. The electrodes act in conjunction with a water-sensitive hygroscopic dielectric material. The design enables low-cost and simple fabrication of fast-responding and stable relative humidity sensors using digital fabrication techniques.

Abstract: Gas sensors for the detection of rare events consume very little or no power. The sensors include materials that interact with a target gas. Accumulation of the target gas on the sensor materials leads to a change in electrical properties of the sensor. The sensors may have high gain, meaning that a large electrical change is induced upon gas accumulation. The sensor might change from an extremely high resistance (open circuit) to a measurably low resistance, or it might change from a relatively low capacitance to a high capacitance. The gas sensors are connected to electronics that can transmit an alarm signal after gas has been detected. The electronics may be in a low power sleep mode until awakened by a signal from the sensor.

Abstract: A printed resistive gas detector configuration that is simple, inexpensive and compact, fabricated for incorporation into an electronic device, such as an electronic computing and/or communication device, the printed resistive gas detector configuration designed to continuously monitor for predetermined types of gasses. The printed resistive gas detector configuration manufactured by the use of printing technology to print on a flexible substrate.

Abstract: A microchannel heat pipe formed on a substrate surface using co-extruding a primary material and a secondary material such that the primary material forms side wall portions that are spaced apart by the secondary material, and an upper wall portion is formed across the upper ends of the side walls to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.

Abstract: Disclosed are methods and systems of providing carbon nanotubes decorated with polymer coated metal nanoparticles. Then, annealing the metal coated carbon nanotubes to reduce a quantity of hydrophilic components of the polymer coating.

Abstract: A system of sensor nodes is combined with an RF hub that transmits RF power to the sensors and receives data therefrom. The sensor nodes contain: one or more sensors for measuring indoor conditions, an antenna, an energy storage element, and electronics for powering the system via harvesting RF energy, reading sensor data, and communicating sensor data. The sensors, antenna, and other components on the nodes can be fabricated conventionally, or via printing. They may be fabricated as “flexible hybrid electronics”, in which conventional components are bonded onto flexible substrates. The RF hub consists of one or more antennas capable of transmitting RF power electronics for steering the center of radiation of the RF power in at least one direction or in more than one direction electronics for receiving a demodulating RF data signal. The RF hub may be powered directly from the building.

Abstract: A memory circuit has a ferroelectric memory cell having a word line and a bit line, an input transistor connected to the bit line, a gain element electrically connected the bit line, wherein the gain element includes a feedback capacitor, and an output terminal. A method of reading a memory cell includes applying a voltage to a word line of the memory cell, causing charge to transfer from the memory cell to a feedback capacitor, generating a voltage, amplifying the voltage by applying a gain having a magnitude of less than three, sensing an output voltage at an output node to determine a state of the memory cell, and storing the memory state in a latch.

Abstract: A method for generating a microchannel heat pipe on a substrate surface includes co-extruding a primary material and a secondary material such that the primary material forms side walls that are spaced apart by the secondary material to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body structure having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid. The co-extrusion process is modified such that the side and upper walls are self-formed either while flowing inside a co-extrusion printhead, or immediately upon exiting the printhead.

Abstract: Printed flexible hybrid electronic systems may require electrical interconnection to peripheral elements. For example, a printed sensor tag with wireless communication may need to connect to a printed sensing electrode on a separated substrate. Frequently, it is desired that these interconnections be detachable in order to replace peripheral elements or to facilitate low cost and simplified assembly, test, rework, and repair. Unlike conventional printed circuit board, mounting a connector on a flexible substrate for detachable connection is challenging due to low temperature requirements. Provide is a teaching of a thin film or form of electrical connection for two circuit elements on separate flexible substrates. The connection is detachable and re-attachable for replacing different circuit elements. The detachable connection is in embodiments realized by selective deposition of fine patterns of conductive materials and non-conductive repositionable pressure-sensitive adhesive.

Abstract: Disclosed herein are embodiments of compositions for gas sensing and sensors utilizing the same. In one embodiment, a composition comprises carbon nanotubes and and polymer-coated metal nanoparticles bound to the carbon nanotubes.

Abstract: A printed resistive gas detector configuration that is simple, inexpensive and compact, fabricated for incorporation into an electronic device, such as an electronic computing and/or communication device, the printed resistive gas detector configuration designed to continuously monitor for predetermined types of gasses. The printed resistive gas detector configuration manufactured by the use of printing technology to print on a flexible substrate.

Abstract: A thin film device has a source region, a drain region, a first gate disposed between the source region and the drain region, a second gate disposed between the source region and the drain region, wherein the second gate region is in close proximity with the first gate region, a semiconductor film disposed between the source region, the drain region, and the first and second gate regions, and a dielectric material disposed between the source region, the drain region, the first and second gate regions, and the semiconductor film.

Abstract: A system of sensor nodes is combined with an RF hub that transmits RF power to the sensors and receives data therefrom. The sensor nodes contain: one or more sensors for measuring indoor conditions, an antenna, an energy storage element, and electronics for powering the system via harvesting RF energy, reading sensor data, and communicating sensor data. The sensors, antenna, and other components on the nodes can be fabricated conventionally, or via printing. They may be fabricated as “flexible hybrid electronics”, in which conventional components are bonded onto flexible substrates. The RF hub consists of one or more antennas capable of transmitting RF power electronics for steering the center of radiation of the RF power in at least one direction or in more than one direction electronics for receiving a demodulating RF data signal. The RF hub may be powered directly from the building.

Abstract: A first structure has alternating fingers of first and second materials, the first material having a higher thermal conductivity than the second material, a second structure has alternating fingers of third and fourth materials, positioned to selectively contact the first structure, and an actuator connected to move the second structure. A method of manufacturing a heat switch includes forming a first structure in a first material having finger separated from each other by gaps, forming a second structure in the first material having fingers at least partially separated from each other by gaps, positioning the first and second structure adjacent to and in contact with each other, and connecting the second structure to an actuator. A method of operating includes receiving an activation signal at an actuator, and using the actuator to move one structure relative to another structure to change alignment between two regions of different thermal conductivity.

Abstract: A thin film device has a source region, a drain region, a first gate disposed between the source region and the drain region, a second gate disposed between the source region and the drain region, wherein the second gate region is in close proximity with the first gate region, a semiconductor film disposed between the source region, the drain region, and the first and second gate regions, and a dielectric material disposed between the source region, the drain region, the first and second gate regions, and the semiconductor film.

Abstract: A centralized server-based system and method for managing and reserving parking spaces capable of charging an EV, that is, a plug-in hybrid or fully electric vehicle, treats sets of parking spaces as interchangeable pooled resources. An EV motorist can book a reservation with charging of the EV by specifying parking in a desired location. Parking spaces serve dual uses for parking alone or parking with charging. The parking spaces are handled as a common parking pool, such as on one side of a city block, and each space has equal access to a charging station. The server determines charging capacity availability within a time window and the motorist can choose a parking time up to or beyond, if permitted, the maximum charging time needed to charge the EV. Non-EV motorists can similarly reserve parking within a parking pool with the server ensuring optimal use of charging capacity and parking spaces.

Abstract: Multiple thin film transistors are aligned in serial and parallel orientation. A second source region is disposed between a first source region and a first drain region. A second drain region is disposed between the first source region and the first drain region. The second drain region and the second source region substantially coincide. A first gate is disposed between the first source region and the coinciding second source and second drain regions. A second gate region is disposed between the first drain region and the coinciding second source and second drain regions. An semiconductor is disposed between the first source region, the first drain region, and the coinciding second source and second drain regions. A dielectric material is disposed between the semiconductor substrate and the first and second gates.