Abstract: Inspection of solder paste on a printed circuit board using a before printing image (pre-application image) to normalize an after printing image (post-application image) of the printed circuit board. Existing lighting and optics used for alignment of the screen-printing stencil to the printed circuit board are used for the solder paste inspection. An embodiment is described wherein pad regions of the printed circuit board are inspected for information about the solder paste applied on the pad regions of the printed circuit board. A stencil in the screen printing process is also inspected using a before printing image (pre-application) to normalize an after printing image (post-application) of the stencil.

Abstract: An efficient and reliable method and apparatus is disclosed that finds a reference point of an object profile within an image when the object is of an unknown size. The object profile is modeled using a synthetic labeled-projection model, which in conjunction with the image, is projected over a portion of the image of the object profile to derive a histogram. The histogram is normalized and a maximum of a first derivative of the histogram is defined for that position. The position of the labeled-projection model is moved relative to the image, and the process is repeated until a selected portion of the image has been examined. The first derivative of the normalized labeled projection is greatest when a feature of the image and the feature denoted by a specific synthetic label of the labeled-projection model are aligned. The method and apparatus can locate the center of the object with reliability, because use of the labeled-projection model and the histogram minimizes the * effects of image artifacts.

Abstract: A system and method for analyzing 3D captured image data of scanned surfaces to locate object of interest, such as solder balls. A 3D model is created of an object of interest, the 3D model including weighted “don't care” areas where a match is not required. The 3D models which are used include geometric shapes, including a frustum, and models created from actual 3D image data of real objects. The 3D captured image data is processed to locate objects matching the 3D models, including processing by normalized correlation. Once the objects are located, the system selects data points within the 3D captured image data that are a predetermined distance away from the located objects. These data points are analyzed to determine a surface plane which fits the selected data points, thereby locating the surface in the 3D capture image data.

Abstract: A method and apparatus is provided that detects extended defects in a surface, by detecting connected features and classifying the connected features so as to identify defects. A method and apparatus is described which processes an image for edges, thresholds the edge and then determines whether the edges are connected features by examining the orientation of the edges compared to their neighboring edges. Application of the method to read/write heads in a storage-drive assembly application is disclosed. Particular enhancements of the method and apparatus for that application are described, including classifying the defects on a head based on their relationship to the boundary of the head, and applying hysteresis thresholding or diffusion to identify cracks which interfere with the function of the heads.

Abstract: The invention provides methods and apparatus for reducing the bandwidth of a multichannel image. In one aspect, the methods and apparatus call for acquiring a multichannel training image representing a training scene. Weighting factors for the respective channels are determined based on the contrast at corresponding locations in that multichannel training image. A reduced bandwidth runtime image is generated from the multichannel runtime images as a function of (i) the weighting factors determined from the training image and (ii) a multichannel image representing the runtime scene.

Abstract: A system to find wirebonded leads by obtaining an image of the crescent formed on a lead after wire bonding, or a difference image (taken from an image of the lead before bonding and the crescent and wire formed after bonding) to create an intermediate image having the desired rotation and registration characteristics. Using a caliper or other wire-finding tool, the invention locates the wire and generates a threshold value for a boundary tracker that will make the located wire the expected width. An alternative preferred embodiment uses the gray value of an edge of the wire as the threshold. An optional artificial boundary is created as a limit for a boundary tracker. The invention then applies a boundary tracker to the intermediate image using the threshold value generated and any artificial boundary created. It then applies a corner finder that restricts starting corner orientations and analyzes the boundary and its features to find crescent tips and extrema to obtain measurements for inspection.

Abstract: The invention provides machine vision methods and apparatus for determining a calibration relationship between the imaging reference frame of an image acquisition device (e.g., a camera) and the motion reference frame of a moveable object (e.g., a motion stage) by positioning the object so that a fiducial thereon (e.g., a calibration mark) lies at a first fiducial position in the field of view and recording the corresponding position of the object in the motion reference frame. The object is then repositioned so that the fiducial moves to a second fiducial position in the field of view. Again, the corresponding position of the object in the motion reference frame is recorded. Likewise, the object is moved to a third fiducial position in the field of view, and its corresponding position in the motion reference frame is recorded.

Abstract: The invention provides improved machine vision methods for determining a calibration relationship among the imaging reference frames of multiple cameras (or other image acquisition devices) that acquire images of a common moveable object. The calibration relationship includes parameters for transforming positional coordinates among the camera's respective imaging reference frames. The method includes placing on the common object, stage, or belt a plurality of fiducials, e.g., calibration marks, that are at known positions relative to each other with respect to a frame of reference referred to as the "alignment reference frame"; aligning an axis of the alignment reference frame with an axis of the object's reference frame of motion, i.e.

Abstract: A method is provided for determining a calibration relationship between a reference frame of motion of an object and a reference frame of a camera that generates images of the object. The method includes the steps of coupling a target to an object and placing the object at each of plural locations and orientations that are known with respect to the motion reference frame of the object. The location of the target(s) with respect to the object need not be known. An image of the object and target is generated while the object is at each of those locations/orientations. From each those images, the method determines the location/orientation of the target with respect to the reference frame of the camera.

Abstract: Inspection of solder paste on a printed circuit board using a before printing image (pre-image) to normalize an after printing image (post-image) of the printed circuit board. Existing lighting and optics used for alignment of the screen printing stencil to the printed circuit board are used for the solder paste inspection. A stencil in the screen printing process is also inspected using a before printing image (pre) to normalize an after printing image (post) of the stencil.

Abstract: The invention automatically inspects the bond of a wire to a contact pad on a semiconductor chip. The apparatus includes a movable platform for holding semiconductor chips situated in lead frames; a video camera for sensing images; illumination means for illuminating a chip in a lead frame; an image processor to digitize and analyze the images; a bonding mechanism; and a host controller electronically connected to bonding mechanism, movable platform, video camera, and image processor. Image processor locates a bond on a pad in a digitized image and provides a first nominal center of ball bond image. The invention aligns the center of a polar coordinate transform image having one or more segments with the nominal center of ball bond image and evaluates ball bond image using the polar coordinate transform image to create a polar projection histogram array and store it. An edge filter is applied to histogram array to detect peaks and store their number and values.

Abstract: The invention can be used to find the orientation of a semiconductor wafer without wafer handling, i.e., in a non-contact manner. The invention uses knowledge of the position of a semiconductor wafer, and the position of an orientation feature of the wafer, to find the orientation of the wafer. According to the invention, a curved band image is formed that includes an image of an orientation feature. The curved band image is then transformed into a straight band image. The longitudinal position of the orientation feature is then determined in the coordinate system of the straight band image, which longitudinal position is then converted into an angular displacement in the coordinate system of the curved band image to provide the orientation of the wafer.

Abstract: This invention provides a method and apparatus for automatically inspecting the connection of a wire to a lead on lead frame containing a semiconductor chip or similar device. Using an image processor to locate the general position of a soldered lead in a digitized image, the present invention creates a template of an idealized optical indentation left by a good bond; determines parameters such as wire angle, idealized position and shape thresholds for applying the template; conducts a normalized correlation search of the digitized image; compares the results returned to the parameters and reports the resulting signals generated by this comparison to a host controller or other control module.

Abstract: This invention provides a method and apparatus for automatically locating the bond of a wire to a lead frame and semiconductor chip or similar device as an in-process operation to facilitate in-process inspection. The apparatus includes a wire bonding machine, or similar apparatus, having a movable platform such as an X-Y table for holding semiconductor chips situated in lead frames; a video camera or other optical sensing or imaging device for generating images, which camera is typically positioned over the target chip and lead frame to be bonded; illumination means for illuminating the chip in a lead frame; an image processor capable of summing said absolute difference values, whereby each sum is stored as a difference metric, and digitizing and analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform, the camera and the image processor.

Abstract: The invention automatically inspects the bond of a wire to a contact pad on a semiconductor chip. The apparatus includes a movable platform for holding semiconductor chips situated in lead frames; a video camera for sensing images; illumination means for illuminating a chip in a lead frame; an image processor to digitize and analyze the images; a bonding mechanism; and a host controller electronically connected to bonding mechanism, movable platform, video camera, and image processor. Image processor locates a bond on a pad in a digitized image and provides a first nominal center of ball bond image. The invention aligns the center of a polar coordinate transform image having one or more segments with the nominal center of ball bond image and evaluates ball bond image using the polar coordinate transform image to create a polar projection histogram array and store it. An edge filter is applied to histogram array to detect peaks and store their number and values.

Abstract: Method and apparatus for automatically locating the center of a ball bond of a wire to a lead frame and semiconductor chip or similar device; analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform. The present invention constructs a synthetic flattened cone model using a center radius, and monotonically increasing slope values to generate a model having a variation in grey levels, and inner and outer radii that will encompass expected size variations in a ball bond; sets a threshold for acceptable normalized correlation search results; acquires a digitized image of the bond, including a nominal location for the bond; conducts a normalized correlation search of the digitized image at the bond location, using the flattened synthetic cone model; and indicates the presence and location of the expected circular object as the location having the largest coefficient which exceeds a threshold.

Abstract: A burned chrome-containing refractory and method which provides a refractory having less than 5 ppm total soluble chromium. Such product is obtained by adding to the starting mix less than 10 wt. % (often less than 3 wt. %) zirconia, silica, zircon, or molybdic oxide either individually or in combination.

Abstract: A rebonded, fused brick resulting from burning a mix consisting essentially of a fused magnesite chrome grain, a fused chrome-magnesite grain or mixtures thereof, and a chrome ore having a Cr.sub.2 O.sub.3 /(Al.sub.2 O.sub.3 +Fe.sub.2 O.sub.3) ratio of at least about 1.15, a maximum silica content of about 3.85, and an Fe.sub.2 O.sub.3 content of less than about 25% by weight.

Abstract: A mix for forming a carbon-bonded refractory comprising from about 8 to 30 wt. % of a high purity carbon, about 0.1 to 1 wt. % of aluminum metal, magnesium metal, or a mixture thereof, and the balance a high purity magnesite, and for each 100 wt. % of said magnesite, carbon, and metal, a carbonaceous bonding agent in an amount sufficient to bond the mix; said carbon containing at least about 98% carbon and said magnesite containing at least about 98% MgO, and containing less than about 0.03% boron oxide, less than about 0.3% silica, and having a CaO/SiO.sub.2 weight ratio above about 2, and the resultant carbon-bonded refractory shapes and liners for metal processing equipment, especially BOF, made from such shapes and the method of increasing the life of liners for such equipment.

Abstract: A mix for forming a carbon-bonded refractory shape comprising from about 70 to 92 wt. % of a high purity magnesite and about 8 to 30 wt. % of a high purity graphite, and for each 100 wt. % of said magnesite and graphite, from about 1.5 to 6 wt. % of a carbon-containing bonding agent; said graphite containing at least about 98% carbon and having at least about 75% by weight -65 mesh or finer particles and said magnesite containing at least about 98% MgO, and containing less than about 0.03% boron oxide, less than about 0.3% silica, and having a CaO/SiO.sub.2 weight ratio above about 2, and the resultant carbon-bonded refractory shape and liner for basic oxygen furnaces made from such shapes and the method of increasing the life of liners for basic oxygen furnaces.