Patents by Inventor David John Russell
David John Russell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11957124Abstract: A disposable set of components for an organ perfusion system comprising a fluid supply duct for supplying fluid to the organ, a fluid removal duct for removing fluid from the organ, and a surrogate organ removably connected between the fluid supply duct and the fluid removal duct so as to form a fluid circuit, so that fluid can be circulated in the circuit in preparation for connection of the organ.Type: GrantFiled: December 23, 2019Date of Patent: April 16, 2024Assignee: ORGANOX LIMITEDInventors: Stuart Brian William Kay, David George Robinson, Philip David Canner, Peter Alan Salkus, Leslie James Russell, Peter John Friend, Constantin C. Coussios
-
Patent number: 9659131Abstract: An approach is provided in which a laminate substrate includes top layers, bottom layers, and a core layer. The top layers are positioned between the core layer and a top surface metallurgy (TSM) layer and include at least one top conductive layer. The bottom layers are positioned between the core layer and a bottom surface metallurgy (BSM) layer and include at least one bottom conductive layer includes a material void pattern that is based upon the top conductive layer and reduces warpage of the laminate substrate.Type: GrantFiled: June 29, 2015Date of Patent: May 23, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Edmund Blackshear, Anson Jay Call, Vijayeshwar Das Khanna, Douglas Oliver Powell, David John Russell
-
Publication number: 20150317423Abstract: An approach is provided in which a laminate substrate includes top layers, bottom layers, and a core layer. The top layers are positioned between the core layer and a top surface metallurgy (TSM) layer and include at least one top conductive layer. The bottom layers are positioned between the core layer and a bottom surface metallurgy (BSM) layer and include at least one bottom conductive layer includes a material void pattern that is based upon the top conductive layer and reduces warpage of the laminate substrate.Type: ApplicationFiled: June 29, 2015Publication date: November 5, 2015Inventors: Edmund Blackshear, Anson Jay Call, Vijayeshwar Das Khanna, Douglas Oliver Powell, David John Russell
-
Patent number: 9105535Abstract: An approach is provided in which a laminate substrate includes top layers, bottom layers, and a core layer. The top layers are positioned between the core layer and a top surface metallurgy (TSM) layer and include at least one top conductive layer. The bottom layers are positioned between the core layer and a bottom surface metallurgy (BSM) layer and include at least one bottom conductive layer that includes a material void pattern that is based upon the top conductive layer and reduces warpage of the laminate substrate.Type: GrantFiled: June 19, 2012Date of Patent: August 11, 2015Assignee: International Business Machines CorporationInventors: Edmund Blackshear, Anson Jay Call, Vijayeshwar Das Khanna, Douglas Oliver Powell, David John Russell
-
Patent number: 8841209Abstract: A method for forming coreless flip chip ball grid array (FCBGA) substrates comprising the steps of sequentially depositing a pair of laminates, each having a plurality of insulated metallization layers simultaneously respectively on each side of a temporary carrier substrate, and then removing the temporary carrier to separate the pair of laminates, so that each laminate has an outer ball grid metal pad array, and during the depositing of the pair of laminates on the carrier substrate, further depositing a supporting layer of dielectric material enclosing the metal pad array, wherein said supporting layers of dielectric material provides structural support for each of the laminates after the separation.Type: GrantFiled: August 18, 2011Date of Patent: September 23, 2014Assignee: International Business Machines CorporationInventors: Sylvie Allard, Jean Audet, Kevin Arthur Dore, Sylvain Pharand, David John Russell
-
Publication number: 20130334711Abstract: An approach is provided in which a laminate substrate includes top layers, bottom layers, and a core layer. The top layers are positioned between the core layer and a top surface metallurgy (TSM) layer and include at least one top conductive layer. The bottom layers are positioned between the core layer and a bottom surface metallurgy (BSM) layer and include at least one bottom conductive layer includes a material void pattern that is based upon the top conductive layer and reduces warpage of the laminate substrate.Type: ApplicationFiled: June 19, 2012Publication date: December 19, 2013Applicant: International Business Machines CorporationInventors: Edmund Blackshear, Anson Jay Call, Vijayeshwar Das Khanna, Douglas Oliver Powell, David John Russell
-
Patent number: 8530345Abstract: An electronic apparatus and method of fabrication of the apparatus, the apparatus including a first electronic device having an interconnection surface with a first plurality of interconnection pads extending from the surface by a first distance and a second plurality of alignment posts extending from the surface by a second distance greater than the first distance, and a second electrical device having an interconnection surface with a first plurality of electrical interconnection pads, each pad arranged to contact a corresponding first electronic device interconnection surface pad upon assembly of the first electronic device interconnection surface upon the second electronic device interconnection surface, the second electronic device interconnection surface including a third plurality of alignment posts, each located to be adjacent to at least one of the first electronic device alignment posts upon assembly.Type: GrantFiled: February 12, 2013Date of Patent: September 10, 2013Assignee: International Business Machines CorporationInventors: David Justin West, David John Russell
-
Patent number: 8465334Abstract: The present invention relates to a fin box adapted to be fitted to a watercraft and to receive a fin having a base. The fin box includes an elongate receiving portion having a length. The base is adapted to be inserted into the receiving portion substantially laterally. The fin during insertion into the receiving portion is disposed at a lower than 90 degree angle to the receiving portion.Type: GrantFiled: December 15, 2008Date of Patent: June 18, 2013Assignee: Origin Fin Systems Pty Ltd.Inventors: Michael John Hort, Eric John Wolinski, David John Russell Wood
-
Patent number: 8415792Abstract: An electronic apparatus and method of fabrication of the apparatus, the apparatus including a first electronic device having an interconnection surface with a first plurality of interconnection pads extending from the surface by a first distance and a second plurality of alignment posts extending from the surface by a second distance greater than the first distance, and a second electrical device having an interconnection surface with a first plurality of electrical interconnection pads, each pad arranged to contact a corresponding first electronic device interconnection surface pad upon assembly of the first electronic device interconnection surface upon the second electronic device interconnection surface, the second electronic device interconnection surface including a third plurality of alignment posts, each located to be adjacent to at least one of the first electronic device alignment posts upon assembly.Type: GrantFiled: August 4, 2010Date of Patent: April 9, 2013Assignee: International Business Machines CorporationInventors: David Justin West, David John Russell
-
Publication number: 20130043060Abstract: A method for forming coreless flip chip ball grid array (FCBGA) substrates comprising the steps of sequentially depositing a pair of laminates, each having a plurality of insulated metallization layers simultaneously respectively on each side of a temporary carrier substrate, and then removing the temporary carrier to separate the pair of laminates, so that each laminate has an outer ball grid metal pad array, and during the depositing of the pair of laminates on the carrier substrate, further depositing a supporting layer of dielectric material enclosing the metal pad array, wherein said supporting layers of dielectric material provides structural support for each of the laminates after the separation.Type: ApplicationFiled: August 18, 2011Publication date: February 21, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Sylvie Allard, Jean Audet, Kevin Arthur Dore, Sylvain Pharand, David John Russell
-
Publication number: 20120279436Abstract: A fin collar including a body having a proximal region locatable adjacent to an underside of a water craft. The fin collar also including a distal region, the body including a longitudinally extending slot adapted to receive a watercraft fin, the slot extending through the body between the proximal and distal regions. An outer surface of the body includes a fluid flow modification surface which extends around a perimeter of the body.Type: ApplicationFiled: May 4, 2012Publication date: November 8, 2012Inventors: David John Russell Wood, Michael John Hort, Anthony Fontana, Eric Wolinski
-
Publication number: 20110039463Abstract: The present invention relates to a fin box adapted to be fitted to a watercraft and to receive a fin having a base. The fin box includes an elongate receiving portion having a length. The base is adapted to be inserted into the receiving portion substantially laterally. The fin during insertion into the receiving portion is disposed at a lower than 90 degree angle to the receiving portion.Type: ApplicationFiled: December 15, 2008Publication date: February 17, 2011Applicant: ORIGIN FIN SYSTEMS PTY LTD.Inventors: Michael John Hort, Eric John Wolinski, David John Russell Wood
-
Patent number: 7118837Abstract: Photoimagable polymers, as well as dielectric materials and their manufacture and use in the production of printed circuit boards and printed wiring boards are described. The polymers comprise between about 30 and about 70 parts of a polyfunctional resin and between about 70 and about 30 parts of the condensation product of an epihalohydrin and a bisphenol based on 100 parts by weight of resin. The polymer is cured by a photocationic initiator. It is characterized by a glass transition temperature of at least about 140° C. and a flex fatigue life of at least about 10,000 cycles at a 3% strain. Optionally, less than 10 parts of a third specified epoxy resin may be added to the mixture to improve flexibility without decreasing the glass transition temperature of the polymer.Type: GrantFiled: October 18, 2004Date of Patent: October 10, 2006Assignee: International Business Machines CorporationInventors: Vladimir Jakubek, Heike Appelt, David John Russell, Cory J. Ruud
-
Patent number: 6806033Abstract: Photoimagable polymers, as well as dielectric materials and their manufacture and use in the production of printed circuit boards and printed wiring boards are described. The polymers comprise between about 30 and about 70 parts of a polyfunctional resin and between about 70 and about 30 parts of the condensation product of an epihalohydrin and a bisphenol based on 100 parts by weight of resin. The polymer is cured by a photocationic initiator. It is characterized by a glass transition temperature of at least about 140° C. and a flex fatigue life of at least about 10,000 cycles at a 3% strain. Optionally, less than 10 parts of a third specified epoxy resin may be added to the mixture to improve flexibility without decreasing the glass transition temperature of the polymer.Type: GrantFiled: January 8, 2002Date of Patent: October 19, 2004Assignee: International Business Machines CorporationInventors: Vladimir Jakubek, Heike Appelt, David John Russell, Cory J. Ruud
-
Patent number: 6680440Abstract: The present invention provides new methods for electroless plating of metal particularly gold and copper onto substrates, such as circuitized substrates, which reduces processing steps, reduces metal consumption, and reduces the scraping of parts due to contamination. The method employs a permanent plating resist. The method for electrolessly plating metal onto a substrate, including the following steps: providing: an uncured, photoimagable, dielectric permanent plating resist comprising: from about 10 to 80% of phenoxy polyol resin which is the condensation product of epichlorohydrin and bisphenol A, having a molecular weight of from about 40,000 to 130,000; from about 20 to 90% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 4,000 to 10,000; from 0 to 50% of a diglycidyl ether of bisphenol A having a molecular weight of from about 600 to 2,500; and from about 0.Type: GrantFiled: February 23, 1998Date of Patent: January 20, 2004Assignee: International Business Machines CorporationInventors: David John Russell, Gerald Walter Jones, Heike Marcello, Voya Rista Markovich
-
Publication number: 20030165771Abstract: Photoimagable polymers, as well as dielectric materials and their manufacture and use in the production of printed circuit boards and printed wiring boards are described. The polymers comprise between about 30 and about 70 parts of a polyfunctional resin and between about 70 and about 30 parts of the condensation product of an epihalohydrin and a bisphenol based on 100 parts by weight of resin. The polymer is cured by a photocationic initiator. It is characterized by a glass transition temperature of at least about 140° C. and a flex fatigue life of at least about 10,000 cycles at a 3% strain. Optionally, less than 10 parts of a third specified epoxy resin may be added to the mixture to improve flexibility without decreasing the glass transition temperature of the polymer.Type: ApplicationFiled: January 8, 2002Publication date: September 4, 2003Applicant: International Business Machines CorporationInventors: Vladimir Jakubek, Heike Appelt, David John Russell, Cory J. Ruud
-
Patent number: 6576382Abstract: An improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of a difunctional epoxy resin. The photosensitive cationically polymerizable epoxy based system is especially useful as a solder mask and does not contain bromine.Type: GrantFiled: May 9, 2002Date of Patent: June 10, 2003Assignee: International Business Machines CorporationInventors: Richard Allen Day, David John Russell, Donald Herman Glatzel
-
Publication number: 20020177072Abstract: According to the present invention, an improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of an difunctional epoxy resin. Since the photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns. The photosensitive cationically polymerizable non-brominated epoxy based solder mask has a glass transition temperature greater than about 100° C., preferably greater than about 110° C.Type: ApplicationFiled: May 9, 2002Publication date: November 28, 2002Applicant: International Business Machines CorporationInventors: Richard Allen Day, David John Russell, Donald Herman Glatzel
-
Patent number: 6210862Abstract: According to the present invention, an improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of an difunctional epoxy resin. Since the photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns. The photosensitive cationically polymerizable non-brominated epoxy based solder mask has a glass transition temperature greater than about 100° C., preferably greater than about 110° C.Type: GrantFiled: September 10, 1998Date of Patent: April 3, 2001Assignee: International Business Machines CorporationInventors: Richard Allen Day, David John Russell, Donald Herman Glatzel
-
Patent number: 6180317Abstract: An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60° C. and about 110° C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.Type: GrantFiled: November 18, 1991Date of Patent: January 30, 2001Assignee: International Business Machines CorporationInventors: Robert David Allen, Richard Allen Day, Donald Herman Glatzel, William Dinan Hinsberg, John Richard Mertz, David John Russell, Gregory Michael Wallraff