Patents by Inventor David M. Kindlon

David M. Kindlon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967561
    Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
    Type: Grant
    Filed: June 6, 2023
    Date of Patent: April 23, 2024
    Assignee: Apple Inc.
    Inventors: Daniel D. Sunshine, Paul S. Drzaic, Daniel A. Podhajny, David M. Kindlon, Hoon Sik Kim, Kathryn P. Crews, Yung-Yu Hsu
  • Publication number: 20240068135
    Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Inventors: Kyle L. Chatham, Kathryn P. Crews, Didio V. Gomes, Benjamin J. Grena, Storrs T. Hoen, Steven J. Keating, David M. Kindlon, Daniel A. Podhajny, Andrew L. Rosenberg, Daniel D. Sunshine, Lia M. Uesato, Joseph B. Walker, Felix Binder, Bertram Wendisch, Martin Latta, Ulrich Schläpfer, Franck Robin, Michael Baumann, Helen Wächter Fischer
  • Patent number: 11913143
    Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: February 27, 2024
    Assignee: Apple Inc.
    Inventors: Kyle L Chatham, Kathryn P. Crews, Didio V. Gomes, Benjamin J. Grena, Storrs T. Hoen, Steven J. Keating, David M. Kindlon, Daniel A. Podhajny, Andrew L. Rosenberg, Daniel D. Sunshine, Lia M. Uesato, Joseph B. Walker, Felix Binder, Bertram Wendisch, Martin Latta, Ulrich Schläpfer, Franck Robin, Michael Baumann, Helen Wächter Fischer
  • Publication number: 20240032203
    Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
    Type: Application
    Filed: October 3, 2023
    Publication date: January 25, 2024
    Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
  • Patent number: 11864322
    Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: January 2, 2024
    Assignee: Apple Inc.
    Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
  • Patent number: 11821115
    Abstract: A stretchable fabric signal path may include a conductive strand located between first and second outer fabric layers. The outer fabric layers may be formed from intertwined strands of elastic material. The conductive strand may have a wavy shape to accommodate stretching of the stretchable fabric signal path. First and second inner fabric layers may be located between the outer stretchable fabric layers. The inner fabric layers may be formed from intertwined strands of non-elastic material. The inner fabric layers may have strands that are intertwined with the outer fabric layers to serve as anchor points for maintaining the shape of the conductive strand as the stretchable fabric signal path expands and contracts. The outer fabric layers and inner fabric layers may be woven. The conductive strand may convey electrical signals such as audio signals, power signals, data signals, or other suitable signals.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: November 21, 2023
    Assignee: Apple Inc.
    Inventors: Benjamin J. Grena, Didio V. Gomes, Joshua A. Hoover, Seul Bi Kim, David M. Kindlon, Kevin T. Pham, Daniel A. Podhajny, Robert J. Rose, Andrew L. Rosenberg, Miikka O. Tikander
  • Publication number: 20230317626
    Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
    Type: Application
    Filed: June 6, 2023
    Publication date: October 5, 2023
    Inventors: Daniel D. Sunshine, Paul S. Drzaic, Daniel A. Podhajny, David M. Kindlon, Hoon Sik Kim, Kathryn P. Crews, Yung-Yu Hsu
  • Patent number: 11765838
    Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: September 19, 2023
    Assignee: Apple Inc.
    Inventors: Bilal Mohamed Ibrahim Kani, Ali N. Ergun, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Benjamin J. Grena, David M. Kindlon, Lan H. Hoang
  • Patent number: 11710703
    Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: July 25, 2023
    Assignee: Apple Inc.
    Inventors: Daniel D. Sunshine, Paul S. Drzaic, Daniel A. Podhajny, David M. Kindlon, Hoon Sik Kim, Kathryn P. Crews, Yung-Yu Hsu
  • Publication number: 20230189445
    Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
    Type: Application
    Filed: February 3, 2023
    Publication date: June 15, 2023
    Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
  • Patent number: 11668026
    Abstract: A fabric-based item may include fabric formed from intertwined strands of material. The fabric may include first and second fabric layers that at least partially surround a pocket. Initially, the pocket may be completely enclosed by the first and second layers of fabric. A shim may be placed in the pocket before the pocket is closed. An opening may be formed in the first layer of fabric to expose a conductive strand in the pocket. The shim may prevent the cutting tool from cutting all the way through to the second layer of fabric. After cutting the hole in the first layer of fabric, the shim may be removed and an electrical component may be soldered to the conductive strand in the pocket. A polymer material may be injected into the pocket to encapsulate the electrical component. The polymer material may interlock with the surrounding pocket walls.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: June 6, 2023
    Assignee: Apple Inc.
    Inventors: Peter F. Coxeter, Didio V. Gomes, Benjamin J. Grena, Steven J. Keating, David M. Kindlon, Maurice P. May, Daniel A. Podhajny, Andrew L. Rosenberg, Daniel D. Sunshine
  • Publication number: 20230130936
    Abstract: Weaving equipment may include warp strand positioning equipment that positions warp strands and weft strand positioning equipment that inserts weft strands among the warp strands to form fabric. The fabric may include insulating strands and conductive strands. The conductive strands may be coupled to electrical components. The warp strand positioning equipment may position the warp strands to form a shed. Component insertion equipment may be used to insert electrical components into the shed. The weaving equipment may have a reed. The reed may be used to help position an electrical component in the fabric. The weaving equipment may have take-down equipment and individually controllable warp fiber positioning and tensioning devices.
    Type: Application
    Filed: December 22, 2022
    Publication date: April 27, 2023
    Inventors: Daniel D. Sunshine, Daniel A. Podhajny, Didio V. Gomes, Maurice Philip May, David M. Kindlon, Andrew L. Rosenberg
  • Patent number: 11601756
    Abstract: An electronic device such as a pair of headphones may be provided with left and right speakers for playing audio to a user. Control circuitry in the electronic device may play audio through the speakers in an unreversed configuration in which left channel audio is played through a first of the speakers that is adjacent to a left ear of the user and right channel audio is played through a second of the speakers that is adjacent to a right ear of the user or a reversed configuration in which these channel assignments are reversed. The headphones may have ear cups that house the speakers. Capacitive touch sensors, force sensors, and other sensors on the ear cups may measure ear shapes and finger grip positions on the ear cups to determine whether to operate in the unreversed or reversed configuration. Sensors may gather gestures and other user touch input.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: March 7, 2023
    Assignee: Apple Inc.
    Inventors: Jonathan R. Peterson, Daniel D. Sunshine, Yohji Hamada, Daniel A. Podhajny, Kathryn P. Crews, Jahan Minoo, David M. Kindlon
  • Publication number: 20230061553
    Abstract: One or more electrical components may be incorporated into a piece of fabric. The electrical component may include an internal portion that is located inside of the fabric, an external portion that is located on an exterior surface of the fabric, and protrusions that extend through the fabric to electrically and/or mechanically couple the internal and external portions of the electrical component. The internal portion of the component may be inserted into the fabric during formation of the fabric. The external portion of the component may be coupled to the internal portion after the fabric is formed by inserting the protrusions on the internal portion into recesses in the external portion. The external portion of the component may contain skin-facing and/or viewer-facing input-output devices, while the internal portion may contain circuitry that electrically communicates with the input-output devices in the external portion.
    Type: Application
    Filed: July 11, 2022
    Publication date: March 2, 2023
    Inventors: Yue Chen, Didio V. Gomes, Benjamin J. Grena, Storrs T. Hoen, David M. Kindlon, Daniel A. Podhajny, Andrew L. Rosenberg
  • Publication number: 20230055647
    Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
    Type: Application
    Filed: August 20, 2021
    Publication date: February 23, 2023
    Inventors: Bilal Mohamed Ibrahim Kani, Ali N. Ergun, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Benjamin J. Grena, David M. Kindlon, Lan H. Hoang
  • Publication number: 20230056922
    Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
    Type: Application
    Filed: June 10, 2022
    Publication date: February 23, 2023
    Inventors: Bilal Mohamed Ibrahim Kani, Ali N. Ergun, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Benjamin J. Grena, David M. Kindlon, Lan H. Hoang
  • Patent number: 11576262
    Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: February 7, 2023
    Assignee: Apple Inc.
    Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
  • Publication number: 20230000435
    Abstract: A fabric-based item may be provided with a stretchable band. The stretchable band may be formed from a ring-shaped strip of stretchable fabric having an opening configured to fit around a body part of a user. Circuitry may be coupled to strands of material in the stretchable band. The circuitry may include sensor circuitry for making measurements on the body part such as electrocardiogram measurements, blood pressure measurements, and respiration rate measurements. Wireless communications circuitry in the fabric-based item may be used to communicate wirelessly with external electronic equipment. A wireless power transmitting device may transmit wireless power. A coil formed from conductive strands in the fabric-based item may be used by wireless power receiving circuitry in the fabric-based item to receive the wireless power. The coil may have one or more turns that run around the ring-shaped strip of stretchable fabric.
    Type: Application
    Filed: August 31, 2022
    Publication date: January 5, 2023
    Inventors: Steven J. Keating, Daniel D. Sunshine, Benjamin J. Grena, Daniel A. Podhajny, Jerzy S. Guterman, Jessica J. Lu, David M. Kindlon
  • Patent number: 11535963
    Abstract: Weaving equipment may include warp strand positioning equipment that positions warp strands and weft strand positioning equipment that inserts weft strands among the warp strands to form fabric. The fabric may include insulating strands and conductive strands. The conductive strands may be coupled to electrical components. The warp strand positioning equipment may position the warp strands to form a shed. Component insertion equipment may be used to insert electrical components into the shed. The weaving equipment may have a reed. The reed may be used to help position an electrical component in the fabric. The weaving equipment may have take-down equipment and individually controllable warp fiber positioning and tensioning devices.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: December 27, 2022
    Assignee: Apple Inc.
    Inventors: Daniel D. Sunshine, Daniel A. Podhajny, Didio V. Gomes, Maurice Philip May, David M. Kindlon, Andrew L. Rosenberg
  • Patent number: 11484264
    Abstract: A fabric-based item may be provide with a stretchable band. The stretchable band may be formed from a ring-shaped strip of stretchable fabric having an opening configured to fit around a body part of a user. Circuitry may be coupled to strands of material in the stretchable band. The circuitry may include sensor circuitry for making measurements on the body part such as electrocardiogram measurements, blood pressure measurements, and respiration rate measurements. Wireless communications circuitry in the fabric-based item may be used to communicate wirelessly with external electronic equipment. A wireless power transmitting device may transmit wireless power. A coil formed from conductive strands in the fabric-based item may be used by wireless power receiving circuitry in the fabric-based item to receive the wireless power. The coil may have one or more turns that run around the ring-shaped strip of stretchable fabric.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: November 1, 2022
    Assignee: Apple Inc.
    Inventors: Steven J. Keating, Daniel D. Sunshine, Benjamin J. Grena, Daniel A. Podhajny, Jerzy S. Guterman, Jessica J. Lu, David M. Kindlon