Abstract: A frequency processing system (1000, 1100, 1200, 1300) for detecting, tuning, or stabilizing light frequency or wavelength in a light beam (1012, 1112, 1212, 1312) produced by a light source (1010, 1110, 1210, 1310). A grating block (1014, 1114, 1214, 1314) receives the light beam (1012, 1112, 1212, 1312) and may produce diffracted beams (1018, 1118, 1218, 1318a-b) and a passed beam (1016, 1116, 1216, 1316). The diffracted beams (1018, 1118, 1218, 1318a-b) are received by respective detectors (1020, 1120, 1220, 1320a-b) which produce measurement signals (1022, 1122, 1322a-b) that are communicated to a processor (1024, 1124, 1224, 1324). The processor (1024, 1124, 1224, 1324) then produces control signals (1026, 1126, 1226, 1326a-b) that are communicated to the light source (1010, 1110, 1210, 1310) where they are usable for detecting, tuning, or stabilizing the light frequency or wavelength.

Abstract: A process (400) to construct single- and multi-dimensional optical gratings (100, 800) of interlayers (110, 230, 310, 808) of differing refractive index, either in or atop a non-fiber substrate material (104, 202, 302). The optical gratings (100, 800) may particularly be Bragg type gratings, and thus suitable for receiving a laser beam (102, 240, 802) and forming there from one or more reflected beam portions (118, 248, 810) having one or more narrow wavelengths and a passed beam portion (120, 250, 812) of other wavelengths.

Abstract: An electronic package assembly where a low profile integrated circuit chip package is soldered to an organic (e.g., epoxy resin) substrate, e.g., a printed circuit board or card, the projecting conductive leads of the integrated circuit chip package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with ultraviolet photocured encapsulant material (e.g., polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder.

Abstract: A completion assembly for use in a lateral well bore has a base pipe with a plurality of holes through the sidewall of the base pipe. Flow through the holes is regulated to produce an influx difference between the ends of the base pipe. Flow can be regulated by variably spacing or sizing the holes. Flow can also be regulated by selectively inserting a rod between adjacent splines located on the base pipe to cover and block the flow through certain holes in the base pipe. Flow can also be regulated using a rotatable sleeve adjacent to the base pipe such that rotation of the sleeve brings the holes and openings in the pipe and sleeve, respectively, into and out of alignment. A filter can be used to filter sand and other particulates. An erosion inhibitor can be used to extend the useful life of the assembly.

Abstract: Fillers coated with a fluorosilane coating are provided as well as compositions containing the coated fillers. Compositions are especially suitable for substrates for printed circuit boards and cards.

Abstract: Fillers coated with a fluorosilane coating are provided as well as compositions containing the coated fillers. Compositions are especially suitable for substrates for printed circuit boards and cards.

Abstract: A photosensitive composition containing a curable cyanate ester and a cationic photoinitiator; and use thereof to form a resist image.

Abstract: Compositions containing bisphenol M dicyanate, prepolymer thereof, or mixtures thereof, and 4,4'-ethylidene bisphenol dicyanate, prepolymer thereof or mixtures thereof; and filler having maximum particle size of 20 microns and being substantially free of alpha particle emissions. The compositions are useful in forming interconnection structures for forming an integrated semiconductor device to a carrier substrate.

Abstract: A photosensitive composition containing a curable cyanate ester and a cationic photoinitiator; and use thereof to form a resist image.

Abstract: A rigid-flexible circuit board is fabricated by providing a core having a dielectric substrate and conductive layer thereon. A sub-composite comprising a polyimide and rigid dielectric substrate adjacent the conductive layer and in both the rigid and flexible segments of the board is provided. A release layer corresponding to the flexible segment of the board is provided. A rigid bonding layer is provided at rigid segments of the board but not at the flexible segments. A composite is formed by providing a second conductive layer adjacent the rigid bonding layer. The composite is laminated. Portions of the second conductive layer corresponding to the flexible segment and release layer are removed.

Abstract: Disclosed are thin film triazine adhesives on organic carriers, method for making them and microelectronic circuit packages incorporating them. The circuit package has a substrate made up of organic, dielectric, polymeric sheets. At least one pair of the polymeric sheets face each other and are adhesively joined together by a triazine polymer.

Abstract: A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.

Abstract: Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.

Abstract: Disclosed is a polymeric product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Also disclosed is an organic polymeric dielectric composite of organic polymeric films, as polyimide films, dispersed in and reinforcing the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Further disclosed is an electronic circuit package that is adapted to receive at least one microelectronic circuit chip, with at least one layer having a substrate of an organic polymeric dielectric composite of organic polymeric films and the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane.

Abstract: Composition and solder interconnection structure for its use, wherein the gap created by solder connections between a carrier substrate and a semiconductor chip device mounted thereon is filled with the solvent free formulation obtained by curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof, polyol, and filler which is substantially free of alpha particle emissions.

Abstract: The present invention features a highly oriented, triazine superstructural network, whose structural alignment is magnetically induced in the liquid crystalline phase during the curing process of its liquid crystalline cyanate ester precursor. High mechanical strength cross-linked network structures are prepared from a new class of liquid crystalline dicyanate compounds. Optionally ring substituted di-(4-hydroxyphenyl)-terephthalate is synthesized as a precursor in the preparation of highly structured triazine networks. The orientation of the triazine networks has been accomplished by magnetically aligning the liquid crystalline phase of the precursor during the curing reaction.

Abstract: A flame retardant, low dielectric constant, controlled coefficient of thermal expansion, low cost prepreg material which includes randomly distributed silane coated hollow microspheres has been prepared by standard impregnation and lamination techniques. Laminates made of this prepreg can be drilled cleanly for through holes and can be used as a substrate for surface mounted devices.

Abstract: Disclosed are an electronic package and electronic package module. The module has a dielectric core with surface circuitization on at least one surface. The dielectric core is a composite having a thermoplastic layer interposed between two separate layers of thermoset adhesive, as epoxy dicyanate adhesive. The thermoplastic layer is preferably a polyimide. The adhesive is preferably an epoxy or dicyanate adhesive, for example a homogeneous film of thermoset resin, or a fiber reinforced thermoset resin, such as a polytetrafluorethylene reinforced epoxy or a glass fiber reinforced adhesive. The use of a thermoplastic polyimide layer interposed between adhesive layers provides a core that is particularly amenable to manufacture as a thin core.

Abstract: A liquid expoxy composition containing a diglycidyl ether of a dihydric phenol and/or a diglycidyl ether of a tetrabrominated dihydric phenol, an epoxy with a functionality from 2.2 to 4, cycloaliphatic diamine curing agent, and thixotropic agent; and use thereof to fill drilled through-holes in circuit boards and cards and as isolation border around the edges of a board or card.

Abstract: Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.