Abstract: A liquid epoxy composition containing a diglycidyl ether of a dihydric phenol and/or a diglycidyl ether of a tetrabrominated dihydric phenol, an epoxy with a functionality from 2.2 to 4, cycloaliphatic diamine curing agent, and thixotropic agent; and use thereof to fill drilled through-holes in circuit boards and cards and as isolation border around the edges of a board or card.

Abstract: Fluorinated polymeric composition exhibiting low dielectric constant and a low coefficient of thermal expansion containing a fluorinated polymeric material and a silica and/or quartz filler having a mean particle size of no greater than 7 microns, and use thereof to form a substrate having vias therein. Layers of the above composition are obtained by applying the composition to a substrate and then heating the composition to a temperature sufficient to cause the composition to fuse.

Abstract: A suture coating comprising a copolymer having about 60 to 80 weight percent of .beta.-hydroxybutyrate linkages is disclosed. The remaining linkages can be at least .beta.-hydroxyvalerate. In one embodiment, the coating is the copolymer combined with a stearoyl lactylate having the formula: ##STR1## wherein X is at least two, and R is an alkaine-earth metal.

Abstract: Dicyanato diphenyl fluorinated alkane resin precursor compositions are modified by the addition of minor predetermined amounts of aromatic diepoxides having high epoxide equivalent weights in order to reduce the curing temperature of prepregs and laminates, such as circuit boards, while retaining low dielectric constants, heat stability and high flame retardance.

Abstract: Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.

Abstract: A bone fixation device is disclosed. The device comprises an absorbable homopolymer of 1-lactide or d1-lactide, or a copolymer of 1-lactide, and a reinforcement material. The reinforcement material can be a particulate filler of hydroxyapatite or a plurality of alumina fibers.

Abstract: 4,4'-(Hexafluoroisopropylidene) bisphonol dicyanate and related compounds have reduced dielectric constant, reduced moisture absorption, and increase Tg making such compounds especially suitable for various electronic applications, such as circuit packaging or in forming prepregs and circuit boards.

Abstract: A surgical suture coating comprising a random copolymer is disclosed. The copolymer has about 25 to 75 weight percent of glycolic acid ester linkages. The remaining linkages comprise at least trimethylene carbonate. The copolymer has a glass transition temperature at or below ambient temperature.

Abstract: Curable compositions are provided comprising epoxide prepolymers and polyaminobenzoates, alone, or combined with reinforcements, e.g., graphite fibers, and, optionally modified with second resins. The cured fiber resin matrix compositions exhibit high toughness combined with excellent hot/wet strength.

Abstract: High molecular weight, essentially linear, thermoplastic amino-s-triazine resins having an inherent viscosity of at least about 0.55 dl./g. are disclosed, comprising recurring units of the formula: ##STR1## containing not less than 25 wt. % of triamino-s-triazine units of the formula: ##STR2## Such resins are suitable for molding or extrusion into films, fibers and filaments and for preparation of composite materials.Also disclosed is a process for the production of high molecular weight essentially linear, thermoplastic amino-s-triazine resins which comprises reacting, in contact with water, an inert, water-immiscible organic solvent for at least one of the reactants and a basic acid acceptor, substantially equimolar proportions of a triazine compound or a mixture of triazine compounds of the formula: ##STR3## with a diamine or a mixture of diamines of the formula: ##STR4## until a thermoplastic amino-s-triazine resin having an inherent viscosity of at least about 0.55 dl/g., is produced.

Abstract: Polymers of a polyfunctional epoxy compound, N,N,N',N'-tetraglycidyl-1,3-propylene bis(p-aminobenzoate), formed by reaction of such epoxy compound with aromatic polyamines. The disclosed polymers are useful as structural resins, e.g., as advanced composite matrix resins.

Abstract: A polyfunctional epoxy compound, N,N,N',N'-tetraglycidyl-1,3-propylene bis(p-aminobenzoate) is disclosed useful as an epoxide resin. Also disclosed are polymers of such compound formed by reaction with aromatic polyamines which are useful as structural resins, e.g., as advanced composite matrix resins.