Abstract: An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

Abstract: Disclosed is a method for producing a high-temperature-resistant, lead-free solder joint between a circuit board and a part, wherein a lead-free solder preform is used that has a composite material having a first composite component arranged substantially in layers and wherein the part is soldered with the solder preform in a hot-bar selective soldering process. Also disclosed is a high-temperature-resistant, lead-free solder joint and a field device of automation technology for determining and/or monitoring the process variable of a medium with a high-temperature-resistant, lead-free solder joint.

Abstract: An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

Abstract: Disclosed is a method for producing a high-temperature-resistant, lead-free solder joint between a circuit board and a part, wherein a lead-free solder preform is used that has a composite material having a first composite component arranged substantially in layers and wherein the part is soldered with the solder preform in a hot-bar selective soldering process. Also disclosed is a high-temperature-resistant, lead-free solder joint and a field device of automation technology for determining and/or monitoring the process variable of a medium with a high-temperature-resistant, lead-free solder joint.

Abstract: The present disclosure relates to a method for positioning at least two circuit boards in a housing having a non-conductive surface, a first securement location for securing the first circuit board, and a second securement location for securing the second circuit board, wherein at least one conductive trace is arranged in the housing and is connected non-releasably with the housing, and wherein the conductive trace electrically contacts the first securement location with the second securement location, the method comprising securing the circuit boards in the securement locations of the housing such that the first circuit board is electrically in contact with the first securement location and the second circuit board is electrically in contact with the second securement location, wherein the first circuit board and the second circuit board are electrically in contact with one another via the at least one conductive trace.

Abstract: The present disclosure relates to a method for positioning at least two circuit boards in a housing having a non-conductive surface, a first securement location for securing the first circuit board, and a second securement location for securing the second circuit board, wherein at least one conductive trace is arranged in the housing and is connected non-releasably with the housing, and wherein the conductive trace electrically contacts the first securement location with the second securement location, the method comprising securing the circuit boards in the securement locations of the housing such that the first circuit board is electrically in contact with the first securement location and the second circuit board is electrically in contact with the second securement location, wherein the first circuit board and the second circuit board are electrically in contact with one another via the at least one conductive trace.

Abstract: A method for connecting a component to a support via soldering between a first contact surface of the component and a second contact surface of the support. The method is distinguished by features including that at least one spacer is embodied in such a manner and arranged between the first contact surface and the second contact surface that the first contact surface and the second contact surface are spaced from one another, and that the soldering is executed in such a manner that the component and the support are connected with one another via the first contact surface and the second contact surface. Also claimed is a component connectable with a support via soldering is intended.

Abstract: A method for connecting a component to a support via soldering between a first contact surface of the component and a second contact surface of the support. The method is distinguished by features including that at least one spacer is embodied in such a manner and arranged between the first contact surface and the second contact surface that the first contact surface and the second contact surface are spaced from one another, and that the soldering is executed in such a manner that the component and the support are connected with one another via the first contact surface and the second contact surface. Also claimed is a component connectable with a support via soldering is intended.

Abstract: A circuit board having, between the circuit board and a component arranged thereon, an electrical and mechanical connection of high mechanical-load-bearing ability. The circuit board includes at least one internally situated conductor path, a first insulating layer arranged on a first surface of the circuit board, a second insulating layer arranged on a second surface of the circuit board, a first contact location at which the conductor path is accessible, a second contact location, at which the conductor path is accessible through a bore passing completely through the circuit board, and an electronic component arranged on the first surface. The component has a first contact surface, which is connected with the first contact location by solder or electrically conductive adhesive, and a second contact surface which is connected with the second contact location by solder or adhesive.

Abstract: In order to secure wired components of large mass or non-uniform mass distribution safely on a circuit board, without the components needing, as currently usual, to be glued onto the circuit board or held on the circuit board with snap-in holders, integrated into a connection bore for receiving a connection wire, or pin, of an electronic component a holding mechanism for secured holding of the connection wire, or pin. The holding mechanism represents a narrowing in the connection bore to a diameter smaller than that of the connection wire, or pin. The holding mechanism can be implemented, for example, by a connection bore embodied in the form of a bore drilled from one side of the circuit board, not completely through the circuit board. In such case, a edge remains as a narrowing, which securely seizes the connection pin of the relevant component and holds the component fixed to the circuit board.

Abstract: A circuit board with a holding mechanism integrated into the circuit board for the holding of wired, electronic components. To this end, a connection bore is provided for receiving a connection wire or pin of the component. The connection bore is formed from two neighboring and partially mutually overlapping bores. In such case, the first bore is so placed relative to a second bore that ridges are formed in the interior of the connection bore as a result of the overlapping of the first and second bores. The ridges provide a narrowing of the open passageway through the connection bore. In this narrowing, the connection wire or pin is controllably, securely seized by the ridges.

Abstract: An electromechanical transducer with at least one piezoelectric element with a first surface on which a first electrode is applied, and at least one contact flag, through which the piezoelectric element is electrically connected. The electrical connection of the piezoelectric element is of very high contact reliability, in that the contact flag directly contacts the first electrode and exhibits at least one depression, into which an adhesive is placed, by which the contact flag is connected with the electrode.

Abstract: A circuit board and method for populating, securing and electrical contacting of components thereon is provided, as an alternative to the known pressfit technology. After the soldering of SMD-components on a first side of a circuit board, conductive adhesive and solder paste are applied on a second side of the circuit board and a connection pin of a thermally critical THT-component is inserted into the special connection bore from the first side of the circuit board. Then, on the second side of the circuit board, SMD-components are set into the solder paste. In a reflow soldering oven, the SMD components are soldered and the conductive adhesive is dried and cured.

Abstract: The invention relates to an electromechanical transducer that is easy and inexpensive to produce. The inventive transducer comprises stacked piezoelectric elements between which contact electrodes (G, S, E) are interposed via which the piezoelectric elements are electrically connected. The contact electrodes (G, S, E) are configured as planar terminal lugs that are connected to the outside from a flexible printed board.

Abstract: A method for populating and soldering a circuit board, which is populated with a wired, electrical component having at least one connection wire or pin and a housing or casing thermally critical for conventional, automatic soldering methods. Additionally, a reflow oven for the soldering of the circuit board and a circuit board for such method are discussed. Soldering of the thermally critical component in the reflow oven is enabled by using the circuit board itself for the thermal shielding of the thermally critical THT-components against the heat energy acting on the circuit board and required for the soldering. The circuit boards are placed on frames for this purpose, for example, and transported through the reflow oven in such a manner that the thermally critical components are arranged on the under side of the circuit board facing away from the heat energy.

Abstract: A circuit board with a contact sleeve mounted thereon. The contact sleeve is electrically connectable in the manner used for an SMD-component. An upper side of the circuit board has a recess and a metallizing bordering the recess, the metallizing being connected to a conductor path extending on the circuit board, and, set in the recess, a contact sleeve, which is both mechanically secured and electrically connected to the metallizing by means of a solder connection.

Abstract: A circuit board having, between the circuit board and a component arranged thereon, an electrical and mechanical connection of high mechanical-load-bearing ability. The circuit board includes at least one internally situated conductor path, a first insulating layer arranged on a first surface of the circuit board, a second insulating layer arranged on a second surface of the circuit board, a first contact location at which the conductor path is accessible, a second contact location, at which the conductor path is accessible through a bore passing completely through the circuit board, and an electronic component arranged on the first surface. The component has a first contact surface, which is connected with the first contact location by solder or electrically conductive adhesive, and a second contact surface which is connected with the second contact location by solder or adhesive.

Abstract: An electromechanical transducer with at least one piezoelectric element (1, 13, 33) with a first surface on which a first electrode (3, 15, 17) is applied, and at least one contact flag (5, 29, 31), through which the piezoelectric element (1, 13, 33) is electrically connected, having an electrical connection of the piezoelectric element (1, 13, 33) of very high contact reliability, in that the contact flag (5, 29, 31) directly contacts the first electrode (3, 15, 17) and exhibits at least one depression (7, 25, 27, 39), into which an adhesive (9) is placed, by which the contact flag (5, 29, 31) is connected with the electrode (3, 15, 17).

Abstract: A circuit board (15) with a contact sleeve (17) mounted thereon. The contact sleeve (17) is electrically connectable in the manner used for an SMD-component. An upper side of the circuit board (15) has a recess (23) and a metallizing (25, 26) bordering the recess (23), the metallizing (25, 26) being connected to a conductor path (27) extending on the circuit board (15), and, set in the recess (23), a contact sleeve (17), which is both mechanically secured and electrically connected to the metallizing (25) by means of a solder connection (29).

Abstract: The invention relates to an electromechanical transducer that is easy and inexpensive to produce. The inventive transducer comprises stacked piezoelectric elements (1, 3, 5, 7, 9, 11) between which contact electrodes (G, S, E) are interposed via which the piezoelectric elements (1, 3, 5, 7, 9, 11) are electrically connected. The contact electrodes (G, S, E) are configured as planar terminal lugs (33, 35, 37, 39, 41, 43,45,47, 55, 57, 59, 61, 63, 65, 67, 69, 77, 79, 81, 83, 85, 87, 89, 91) that are connected to the outside from a flexible printed board (13, 13a, 13b, 13c).