Patents by Inventor Dietmar Birgel

Dietmar Birgel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6437989
    Abstract: This circuit board contains electronic components having electrical contacts. At least one of the electrical contacts is initially glued to the circuit board using a conductive adhesive and at least one of the electrical contacts is connected to the circuit board by soldering. The circuit board is suitable for fast mechanical mass production. Further a method for the manufacture of the connection between the circuit board and the electronic components is disclosed, in which a solder is applied to soldering points and a conductive adhesive is applied to adhesive points. The circuit board with the components is then placed in a furnace to connect the components to the circuit board.
    Type: Grant
    Filed: May 24, 2000
    Date of Patent: August 20, 2002
    Assignee: Endress + Hauser GmbH + Co.
    Inventors: Sergej Lopatin, Dietmar Birgel, Karl-Peter Hauptvogel
  • Patent number: 6266022
    Abstract: The invention relates to a device (1) for determining the filling level in a container (4). Moreover, the invention also relates to a method for fastening an input coupling unit (9) on the antenna (7), the antenna (7) being used in the device (1) according to the invention. It is the object of the invention to provide overvoltage protection for an antenna (7), and a method for producing such an antenna (7). The object is achieved by virtue of the fact that the antenna (7) comprises at least two dielectric layers (12, 13). The first dielectric layer (12) has at least one cutout (15) for holding the input coupling unit (9). The second dielectric layer (13) bears an antenna structure (16) on the side facing the first dielectric layer (12) and has a conductive coating (17) with openings (18) on the side averted from the first dielectric layer (12). Contacts (19) are provided in the second dielectric layer (13) and the conductive layer (17) which connect the input coupling unit (9) to the conductive coating (17).
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: July 24, 2001
    Assignee: Endress + Hauser GmbH + Co.
    Inventors: Roland Müller, Thomas Malzahn, Karl-Peter Hauptvogel, Dietmar Birgel