Patents by Inventor Dinhphuoc Vu Hoang
Dinhphuoc Vu Hoang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9806395Abstract: A coupler is presented that has high-directivity and low coupling coefficient variation. The coupler includes a first trace with a first edge substantially parallel to a second edge and substantially equal in length to the second edge. The first trace includes a third edge substantially parallel to a fourth edge. The fourth edge is divided into three segments. The outer segments are a first distance from the third edge. The middle segment is a second distance from the third edge. Further, the coupler includes a second trace, which includes a first edge substantially parallel to a second edge and substantially equal in length to the second edge. The second trace includes a third edge substantially parallel to a fourth edge. The fourth edge is divided into three segments. The outer segments are a first distance from the third edge. The middle segment is a second distance from the third edge.Type: GrantFiled: December 19, 2014Date of Patent: October 31, 2017Assignee: Skyworks Solutions, Inc.Inventors: Yang Li, Xuanang Zhu, Dinhphuoc Vu Hoang, Guohao Zhang, Russ Alan Reisner, Dmitri Prikhodko, Jiunn-Sheng Guo, Bradley David Scoles, David Viveiros, Jr.
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Publication number: 20170301629Abstract: Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).Type: ApplicationFiled: April 13, 2017Publication date: October 19, 2017Inventors: Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Howard E. Chen, Dinhphuoc Vu Hoang
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Patent number: 9703913Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. The racetrack layout can be determined based on identifying low radiating areas of a module and/or areas of a module that are less sensitive to external radiation. The racetrack can be disposed below a surface of a module on which a radio frequency component is disposed. The racetrack and a conductive layer over the radio frequency component can form part of a radio frequency isolation structure around the RF component.Type: GrantFiled: February 17, 2016Date of Patent: July 11, 2017Assignee: Skyworks Solutions, Inc.Inventors: Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
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Patent number: 9692357Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier die including a power amplifier configured to amplify a radio frequency (RF) signal, the power amplifier including a heterojunction bipolar transistor (HBT) and a p-type field effect transistor (PFET), the PFET including a semiconductor segment that includes substantially the same material as a layer of a collector of the HBT, the semiconductor segment corresponding to a channel of the PFET; a load line electrically connected to an output of the power amplifier and configured to provide impedance matching at a fundamental frequency of the RF signal; and a harmonic termination circuit electrically connected to the output of the power amplifier and configured to terminate at a phase corresponding to a harmonic frequency of the RF signal. Other embodiments of the module are provided along with related methods and components thereof.Type: GrantFiled: April 14, 2015Date of Patent: June 27, 2017Assignee: Skyworks Solutions, Inc.Inventors: Dinhphuoc Vu Hoang, Hardik Bhupendra Modi, Hsiang-Chih Sun, Peter J. Zampardi, Jr., Guohao Zhang
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Patent number: 9653409Abstract: Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).Type: GrantFiled: December 18, 2015Date of Patent: May 16, 2017Assignee: Skyworks Solutions, Inc.Inventors: Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Howard E. Chen, Dinhphuoc Vu Hoang
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Patent number: 9646936Abstract: A radio frequency (RF) module comprises RF-shielding structure for providing three-dimensional electromagnetic interference shielding with respect to one or more RF devices disposed on the module. The RF-shielding may comprise wirebond structures disposed adjacent to or surrounding an RF device. Two or more intramodule devices may have wirebond structures configured to at least partially block certain types of RF signals disposed between the devices, thereby reducing effects of cross-talk between the devices.Type: GrantFiled: November 10, 2015Date of Patent: May 9, 2017Assignee: Skyworks Solutions, Inc.Inventors: Howard E. Chen, Matthew Sean Read, Anthony James LoBianco, Hoang Mong Nguyen, Guohao Zhang, Dinhphuoc Vu Hoang
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Publication number: 20160380603Abstract: Disclosed are devices and methods for improving power added efficiency and linearity of radio-frequency power amplifiers implemented in flip-chip configurations. In some embodiments, a harmonic termination circuit can be provided so as to be separate from an output matching network configured to provide impedance matching at a fundamental frequency. The harmonic termination circuit can be configured to terminate at a phase corresponding to a harmonic frequency of the power amplifier output. Such a configuration of separate fundamental matching network and harmonic termination circuit allows each to be tuned separately to thereby improve performance parameters such as power added efficiency and linearity.Type: ApplicationFiled: September 12, 2016Publication date: December 29, 2016Inventors: Guohao Zhang, Hardik Bhupendra Modi, Jaydutt Jagdish Joshi, Bhuvaneshwaran Vijayakumar, Dinhphuoc Vu Hoang
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Publication number: 20160380594Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier configured to provide a radio frequency signal at an output, an output matching network coupled to the output of the power amplifier and configured to provide impedance matching at a fundamental frequency of the radio frequency signal, and a harmonic termination circuit coupled to the output of the power amplifier. The power amplifier is included on a power amplifier die. The output matching network can include a first circuit element electrically connected to an output of the power amplifier by way of a pad on a top surface of a conductive trace, in which the top surface has an unplated portion between the pad the power amplifier die. The harmonic termination circuit can include a second circuit element. The first and second circuit elements can have separate electrical connections to the power amplifier die. Other embodiments of the module are provided along with related methods and components thereof.Type: ApplicationFiled: September 8, 2016Publication date: December 29, 2016Inventors: Weimin Sun, Peter J. Zampardi, JR., Hongxiao Shao, Guohao Zhang, Hardik Bhupendra Modi, Dinhphuoc Vu Hoang
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Patent number: 9515029Abstract: A radio frequency (RF) module comprises a conductive top layer configured to improve RF interference-shielding functionality with respect to one or more RF devices disposed on the module. The conductive top layer may be segmented as to form one or more segments of the top layer that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated, top conductive layers correspond to different devices of the module. The top layer may be etched or cut to achieve such segmentation.Type: GrantFiled: October 16, 2015Date of Patent: December 6, 2016Assignee: Skyworks Solutions, Inc.Inventors: Howard E. Chen, Matthew Sean Read, Anthony James LoBianco, Hoang Mong Nguyen, Guohao Zhang, Dinhphuoc Vu Hoang
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Patent number: 9506968Abstract: Disclosed are systems, devices and methods related to scanners that are utilized for multiple electrical and/or magnetic field measurements at different locations of a radio-frequency (RF) module. In some embodiments, a scanning system can includes a miniature probe such as a magnetic probe, a fixture system configured to hold a device under test (DUT) such as an RF module, an operating system configured to operate the DUT, and a measurement system configured to obtain field strength measurements through the miniature probe at different locations of the DUT. Such measurements can yield a near-field distribution over a plurality of selected areas of the DUT, with each of the selected areas being smaller than an overall lateral area of the DUT. In some implementations, such a scanning system is utilized to facilitate applications such as electromagnetic (EM) shielding designs.Type: GrantFiled: September 7, 2013Date of Patent: November 29, 2016Assignee: SKYWORKS SOLUTIONS, INC.Inventors: Dinhphuoc Vu Hoang, Dean Kazuo Enomoto, Guohao Zhang, Hoang Mong Nguyen, Howard E. Chen
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Patent number: 9467940Abstract: Disclosed are devices and methods for improving power added efficiency and linearity of radio-frequency power amplifiers implemented in flip-chip configurations. In some embodiments, a harmonic termination circuit can be provided so as to be separate from an output matching network configured to provide impedance matching at a fundamental frequency. The harmonic termination circuit can be configured to terminate at a phase corresponding to a harmonic frequency of the power amplifier output. Such a configuration of separate fundamental matching network and harmonic termination circuit allows each to be tuned separately to thereby improve performance parameters such as power added efficiency and linearity.Type: GrantFiled: November 9, 2012Date of Patent: October 11, 2016Assignee: Skyworks Solutions, Inc.Inventors: Guohao Zhang, Hardik Bhupendra Modi, Jaydutt Jagdish Joshi, Bhuvaneshwaran Vijayakumar, Dinhphuoc Vu Hoang
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Publication number: 20160181206Abstract: Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).Type: ApplicationFiled: December 18, 2015Publication date: June 23, 2016Inventors: Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Howard E. Chen, Dinhphuoc Vu Hoang
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Patent number: 9374045Abstract: This disclosure relates to a harmonic termination circuit that is separate from a load line. In one embodiment, the load line is configured to match an impedance at the power amplifier output at a fundamental frequency of the power amplifier output and the harmonic termination circuit is configured to terminate at a phase corresponding to a harmonic frequency of the power amplifier output. According to certain embodiments, the load line and the harmonic termination circuit can be electrically coupled to the power amplifier output external to a power amplifier die via different output pins of the power amplifier die.Type: GrantFiled: February 13, 2015Date of Patent: June 21, 2016Assignee: Skyworks Solutions, Inc.Inventors: Guohao Zhang, Hardik Bhupendra Modi, Dinhphuoc Vu Hoang
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Publication number: 20160163661Abstract: Aspects of the present disclosure relate to a racetrack that forms part of an RF isolation structure of a packaged module and wireless devices that include such a packaged module. The racetrack can be disposed in a substrate and around an RF component that is on the substrate. The racetrack can include at least one break and/or at least one narrowed section without significantly degrading the EMI performance of the RF isolation structure.Type: ApplicationFiled: February 17, 2016Publication date: June 9, 2016Inventors: Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
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Publication number: 20160162620Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. The racetrack layout can be determined based on identifying low radiating areas of a module and/or areas of a module that are less sensitive to external radiation. The racetrack can be disposed below a surface of a module on which a radio frequency component is disposed. The racetrack and a conductive layer over the radio frequency component can form part of a radio frequency isolation structure around the RF component.Type: ApplicationFiled: February 17, 2016Publication date: June 9, 2016Inventors: Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
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Patent number: 9295157Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area.Type: GrantFiled: July 10, 2013Date of Patent: March 22, 2016Assignee: Skyworks Solutions, Inc.Inventors: Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
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Publication number: 20160064337Abstract: A radio frequency (RF) module comprises RF-shielding structure for providing three-dimensional electromagnetic interference shielding with respect to one or more RF devices disposed on the module. The RF-shielding may comprise wirebond structures disposed adjacent to or surrounding an RF device. Two or more intramodule devices may have wirebond structures configured to at least partially block certain types of RF signals disposed between the devices, thereby reducing effects of cross-talk between the devices.Type: ApplicationFiled: November 10, 2015Publication date: March 3, 2016Inventors: Howard E. Chen, Matthew Sean Read, Anthony James LoBianco, Hoang Mong Nguyen, Guohao Zhang, Dinhphuoc Vu Hoang
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Publication number: 20160043813Abstract: Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.Type: ApplicationFiled: October 14, 2015Publication date: February 11, 2016Inventors: Howard E. Chen, Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Guohao Zhang, Dinhphuoc Vu Hoang
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Publication number: 20160044842Abstract: A radio frequency (RF) module comprises a conductive top layer configured to improve RF interference-shielding functionality with respect to one or more RF devices disposed on the module. The conductive top layer may be segmented as to form one or more segments of the top layer that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated, top conductive layers correspond to different devices of the module. The top layer may be etched or cut to achieve such segmentation.Type: ApplicationFiled: October 16, 2015Publication date: February 11, 2016Inventors: Howard E. Chen, Matthew Sean Read, Anthony James LoBianco, Hoang Mong Nguyen, Guohao Zhang, Dinhphuoc Vu Hoang
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Patent number: 9252107Abstract: Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).Type: GrantFiled: May 29, 2013Date of Patent: February 2, 2016Assignee: Skyworks Solutions, Inc.Inventors: Matthew Sean Read, Hoang Mong Nguyen, Anthony James LoBianco, Howard E. Chen, Dinhphuoc Vu Hoang