Abstract: Thermoelectric devices with interface materials and methods of manufacturing the same are provided. A thermoelectric device can include at least one shunt, at least one thermoelectric element in thermal and electrical communication with the at least one shunt, and at least one interface material between the at least one shunt and the at least one thermoelectric element. The at least one interface material can comprise a plurality of regions comprising a core material with each region separated from one another and surrounded by a shell material. The interface material can be configured to undergo deformation under (i) a normal load between the at least one shunt and the at least one thermoelectric element or (ii) a shear load between the at least one shunt and the at least one thermoelectric element. The deformation can reduce interface stress between the at least one shunt and the at least one thermoelectric element.

Abstract: Features for a vapor compression system configured to cool and/or heat (i.e. thermally condition) two or more distinct climate controlled vehicle interior components via a common thermal bus are disclosed. Some embodiments employ a single compressor. Some embodiments employ multiple compressors and/or thermal buses, each servicing components located within respective interior thermal zones of a vehicle, for example a front row seat zone, second and/or third row seat zones, and/or an overhead zone and/or a trunk zone.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include a heat spreader positioned near a localized heat general of the electrical device. A fin can be connected to the heat spreader with a thermoelectric device positioned on the fin. Electric power can be directed to the thermoelectric device to provide controlled heating and/or cooling to the electrical device.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.

Abstract: A support device or chair can include an inductive charging systems can be used to charge a battery. The chair or support device can include a climate control system to provide personal comfort to an occupant, such as an office worker, using personal thermal amenity devices.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include a heat spreader positioned near a localized heat general of the electrical device. A fin can be connected to the heat spreader with a thermoelectric device positioned on the fin. Electric power can be directed to the thermoelectric device to provide controlled heating and/or cooling to the electrical device.

Abstract: An atmospheric condensate collector and electrospray source apparatus. The apparatus has a cooler having a surface with a sharp point. The cooler generates a condensate from ambient atmosphere exposed to the cooler. A ground electrode is electrically and mechanically separated from the cooler. A high voltage power supply switchably provides a high voltage between the sharp point of the cooler and the ground electrode. A controller is electrically connected to the cooler power supply and the high voltage power supply. The controller controls the operation of the cooler power supply and the high voltage power supply. The atmospheric condensate collector and electrospray ionizer apparatus generates the condensate and generates particulate spray from the condensate in response to command signals issued from the controller. In some embodiments, an analyzer is provided to analyze particles of the spray to determine the chemical composition of the condensate.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include a heat spreader positioned near a localized heat general of the electrical device. A fin can be connected to the heat spreader with a thermoelectric device positioned on the fin. Electric power can be directed to the thermoelectric device to provide controlled heating and/or cooling to the electrical device.

Abstract: Cartridge-based thermoelectric assemblies and systems are provided which include at least one shunt configured to extend around a conduit, a plurality of thermoelectric elements in thermal communication and in electrical communication with the at least one shunt with at least a portion of the at least one shunt sandwiched between the at least one first thermoelectric element and the at least one second thermoelectric element. The thermoelectric elements are electrically isolated from the conduit. The thermoelectric assemblies and systems further include at least one heat exchanger in thermal communication with the at least one shunt and configured to be in thermal communication with a second fluid.

Abstract: Thermoelectric devices with interface materials and methods of manufacturing the same are provided. A thermoelectric device can include at least one shunt, at least one thermoelectric element in thermal and electrical communication with the at least one shunt, and at least one interface material between the at least one shunt and the at least one thermoelectric element. The at least one interface material can comprise a plurality of regions comprising a core material with each region separated from one another and surrounded by a shell material. The interface material can be configured to undergo deformation under (i) a normal load between the at least one shunt and the at least one thermoelectric element or (ii) a shear load between the at least one shunt and the at least one thermoelectric element. The deformation can reduce interface stress between the at least one shunt and the at least one thermoelectric element.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor. The thermoelectric management system can be integrated with the management system of the electrical device on a printed circuit substrate.

Abstract: Thermoelectric devices with interface materials and methods of manufacturing the same are provided. A thermoelectric device can include at least one shunt, at least one thermoelectric element in thermal and electrical communication with the at least one shunt, and at least one interface material between the at least one shunt and the at least one thermoelectric element. The at least one interface material can comprise a plurality of regions comprising a core material with each region separated from one another and surrounded by a shell material. The interface material can be configured to undergo deformation under (i) a normal load between the at least one shunt and the at least one thermoelectric element or (ii) a shear load between the at least one shunt and the at least one thermoelectric element. The deformation can reduce interface stress between the at least one shunt and the at least one thermoelectric element.

Abstract: In certain embodiments, a thermoelectric assembly and method is provided that can be configured to be in thermal communication with a generally tubular first fluid conduit configured to allow a first fluid to flow through the first fluid conduit along a first direction. The thermoelectric assembly can extend at least partially around a perimeter of the first fluid conduit. The thermoelectric assembly can include a plurality of thermoelectric sub-assemblies aligned with one another along the perimeter of the first fluid conduit. Each thermoelectric sub-assembly can include a plurality of thermoelectric elements in parallel electrical communication with one another. Each thermoelectric sub-assembly can also include at least one shunt comprising a first portion and a second portion. The first portion can be in thermal communication with and mechanically coupled to the plurality of thermoelectric elements and be in thermal communication with at least one second fluid conduit.

Abstract: A thermoelectric assembly and method are provided. The thermoelectric assembly can extend at least partially around a perimeter of a first fluid conduit. The thermoelectric assembly can include a plurality of thermoelectric sub-assemblies aligned with one another along the perimeter of the first fluid conduit. Each thermoelectric sub-assembly can include a plurality of thermoelectric elements in parallel electrical communication with one another, and at least one shunt a plurality of electrically insulating elements to prevent current flow in a plane perpendicular to the first direction between adjacent thermoelectric sub-assemblies.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.

Abstract: A thermoelectric assembly and a method of operating a thermoelectric assembly are provided. The thermoelectric assembly includes at least one thermoelectric subassembly configured to be in thermal communication with a heat source and configured to be in thermal communication with a heat sink. The at least one thermoelectric subassembly includes at least one thermoelectric element including a hot side at a first temperature and a cold side at a second temperature lower than the first temperature. The thermoelectric assembly further includes a controller in operative communication with the at least one thermoelectric subassembly. The controller is configured to adjust the first temperature by adjusting an electrical current of the at least one thermoelectric subassembly.

Abstract: Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor.

Abstract: A thermoelectric system includes at least one thermoelectric generator which includes at least one cold-side heat exchanger, at least one hot-side heat exchanger, and a plurality of thermoelectric elements in thermal communication with the at least one cold-side heat exchanger and in thermal communication with the at least one hot-side heat exchanger. The system further includes a combustible fluid, wherein the at least one cold-side heat exchanger is configured to transfer heat to the combustible fluid.