Abstract: Provided is a nanofiber based composite false twist yarn that is obtained by producing a nanofiber tape yarn by precisely slitting a nanofiber membrane produced by electrospinning and then twisting a nanofiber-only twist yarn that is obtained by twisting the nanofiber tape yarn or composite-twisting a nanofiber-only twist yarn and a natural fiber or synthetic fiber. The nanofiber based composite false twist yarn includes: a nanofiber tape yarn including at least one bonding portion or a false twist yarn which is obtained by false twisting the nanofiber tape yarn; and a natural fiber yarn or a synthetic fiber yarn that is composite-false-twisted with the nanofiber tape yarn or the false twist yarn, wherein the nanofiber tape yarn is made of a nanofiber web that is obtained by integrating polymer nanofibers made of a fiber-forming polymer material and having an average diameter of less than 1 ?m thereby having fine pores.

Abstract: An image sensor may include a pixel array where a plurality of unit pixels are arranged in a two dimensional matrix, wherein each of the unit pixels includes: a substrate including a photoelectric conversion element; one or more depletion inducing layers formed in the photoelectric conversion element; an inter-layer dielectric layer formed over the substrate; and one or more floating electrodes formed in the inter-layer dielectric layer to overlap each of the depletion inducing layers.

Abstract: An image sensor may include a substrate having photoelectric conversion regions respectively formed on a plurality of pixels and charge trap regions overlapping with the respective photoelectric conversion regions and having depths or thicknesses that are different, for each of the respective pixel.

Abstract: A lighting device includes a heat sink including a first heat radiation part and a second heat radiation part, a light source module including a substrate disposed on the first heat radiation part of the heat sink, and a light emitting device disposed on the substrate; and a power supply unit which is disposed within the second heat radiation part of the heat sink and supplies power to the light source module.

Abstract: A multimodal sensor includes first conductive electrodes that are arranged in parallel with one another, being spaced from one another by a certain distance, an insulating layer that is formed on the first conductive electrodes, second conductive electrodes that are formed on the insulating layer, crossing the first conductive electrodes, and are arranged in parallel with one another, being spaced from one another, and a controller that applies voltages to the first and second conductive electrodes. The controller detects capacitance formed between the first and second conductive electrodes, and senses an external temperature, intensity of a pressure or a position, to which a pressure is applied, in response to a variation of the capacitance.

Abstract: An image sensor may include a pixel array where a plurality of unit pixels are arranged in a two dimensional matrix, wherein each of the unit pixels includes: a substrate including a photoelectric conversion element; one or more depletion inducing layers formed in the photoelectric conversion element; an inter-layer dielectric layer formed over the substrate; and one or more floating electrodes formed in the inter-layer dielectric layer to overlap each of the depletion inducing layers.

Abstract: Disclosed herein are a protective film having a structure capable of protecting an adherend and an electronic appliance including the same. The protective film includes a protection layer comprising polyolefin, and an adhesive layer laminated on the protection layer and comprising a silicone adhesive.

Abstract: An image sensor is described. The image sensor may include a substrate including a pixel area, a logic area, and a guard area disposed between the pixel area and the logic area. The guard area may substantially prevent transfer of heat generated in the logic area from reaching the pixel area.

Abstract: An image sensor includes a substrate including a pixel array region and a logic region where a surface of the pixel array region is higher than a surface of the logic region, and a light shielding pattern formed over the substrate of the logic region and having a surface on substantially the same plane as a surface of the substrate.

Abstract: Provided is a pixel of a multi-stacked complementary metal-oxide semiconductor (CMOS) image sensor and a method of manufacturing the image sensor including a light-receiving unit that may include first through third photodiode layers that are sequentially stacked, an integrated circuit (IC) that is formed below the light-receiving unit, electrode layers that are formed on and below each of the first through third photodiode layers, and a contact plug that connects the electrode layer formed below each of the first through third photodiode layers with a transistor of the IC.

Abstract: A light source unit disclosed in an embodiment includes a first cover which has an open region; a second cover which is coupled to the first cover; a light source module which is disposed between the first cover and the second cover, and has a light-emitting device disposed on the open region and a circuit board on which the light-emitting device is disposed; a fixing frame which is disposed between the second cover and the circuit board; and a resin member which is filled in an region between the first cover and the second cover and supports the light source module and the fixing frame. The light source module includes a moisture-proof film which covers an upper surface and side surfaces of the light-emitting device and extends to an upper surface of the circuit board.

Abstract: An image sensor includes a photoelectric conversion element suitable for generating photocharges corresponding to incident light, a transfer transistor suitable for transferring the generated photocharges to a floating diffusion node based on a transfer signal, and a reset transistor suitable for resetting the floating diffusion node based on a reset signal and including a memory gate.

Abstract: A light emitting device according to an embodiment includes a body having a recess; a light emitting chip disposed in the recess; and a first dampproof layer sealing the light emitting chip and extended from a surface of the light emitting chip to a bottom of the recess, wherein the light emitting chip includes a wavelength range of 100 nm to 280 nm, and the first dampproof layer includes a fluororesin-based material.

Abstract: A cooling system for a bus may include a heat dissipating plate mounted on a roof panel of a top of a bus and cooling heated fluid with wind, and an actuator connected to an air tank, selectively actuating the heat dissipating plate and adjusting an inclination angle between the heat dissipating plate and the roof panel.

Abstract: A light emitting device may include a first electrode on a substrate, a first emission layer on the first electrode, a buffer layer on the first emission layer, a middle electrode on the buffer layer, a second emission layer on the middle electrode, and a second electrode on the second emission layer. The buffer layer may include a material selected from the group consisting of a metal oxide, a polyelectrolyte, and a combination thereof. The first emission layer, buffer layer, middle electrode, and second emission layer may be fabricated using a wet process.

Abstract: A sensor integrated haptic device, a method for manufacturing the sensor integrated haptic device and an electronic device including the sensor integrated haptic device are provided. To elaborate, the sensor integrated haptic device includes a sensor and an actuator formed to be arranged on the same plane as the sensor, and each of the sensor and the actuator includes a lower electrode formed through a first process, an ionic elastomer layer formed on the lower electrode through a second process, and an upper electrode formed on the ionic elastomer layer through a third process.

Abstract: A lighting device includes a heat sink including a first heat radiation part and a second heat radiation part, a light source module including a substrate disposed on the first heat radiation part of the heat sink, and a light emitting device disposed on the substrate; and a power supply unit which is disposed within the second heat radiation part of the heat sink and supplies power to the light source module.

Abstract: A capacitor type tactile sensor and a method of manufacturing the capacitor type tactile sensor are provided. To elaborate, the device includes a first electrode, an active layer formed on a top surface of the first electrode, and a second electrode formed on a top surface of the active layer. The active layer is made of ionic elastomer, and a concentration of effective ions within the active layer is adjusted by an external pressure.

Abstract: A lighting device may be provided to include a heat sink which includes a receiving recess and a top surface including a hole; a light source module which includes a substrate disposed on the heat sink, a light emitting device disposed on the substrate and a pad disposed on the substrate; a power supplier which is disposed in the receiving recess of the heat sink and includes a projection outputting a power signal for driving the light source module; and a connector which is coupled to the hole of the heat sink, includes a contacting part electrically connected to the pad of the light source module, and is electrically connected to the projection of the power supplier.

Abstract: A lighting device may be provided that includes: a heat sink; a light source module which is disposed on the heat sink, includes a substrate having at least one hole, and includes a plurality of light emitting devices disposed on a top surface of the substrate; a power supply unit which is disposed within the heat sink and includes a support plate and a plurality of parts disposed on the support plate; and a soldering portion which connects the substrate and the support plate. The support plate includes an extended substrate which is disposed in the hole of the substrate. The extended substrate includes a through-portion which has passed through the hole of the substrate. The soldering portion electrically connects the through-portion of the extended substrate and the top surface of the substrate.