Patents by Inventor Do-Young Kim

Do-Young Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220088871
    Abstract: Provided is a binder jetting 3D printer capable of continuous printing, wherein a box assembly is supplied by a horizontal movement guide means, a 3D object is built with binder jetting within a build box, and the box assembly in which the 3D object is built is withdrawn, thereby printing 3D objects continuously. In particular, provided is a binder jetting 3D printer capable of continuous printing, wherein a box assembly including a powder supply box and a build box is simplified by integrating the boxes and a lifting and lowering process of a supply plate and of a build plate is facilitated, thereby reducing the time taken for a 3D printing process and thus improving productivity.
    Type: Application
    Filed: June 22, 2021
    Publication date: March 24, 2022
    Inventors: Won Hyo KIM, Do Young KIM
  • Publication number: 20220058689
    Abstract: A display apparatus displaying content corresponding to an installation location and a server providing content considering the installation location of the display apparatus are provided. The display apparatus includes: a display; a communication interface configured to communicate with an external server; and a processes configured to control the communication interface to receive, from the external server, content including an element with a large number of expected viewers identified based on at least one of a number of viewers or an installation location, and control the display to display the received content.
    Type: Application
    Filed: November 3, 2021
    Publication date: February 24, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Do Young KIM, Yeong Chan BAE
  • Publication number: 20220055714
    Abstract: The present invention relates to a movable magnet type bicycle pedal, and a shoe coupling device equipped with a means for preventing attachment of metal powder. More particularly, the present invention relates to a movable magnet type bicycle pedal and a shoe coupling device equipped with a means for preventing attachment of metal powder, wherein the shoe coupling device and the pedal are respectively provided with a magnet, and are coupled to each other by magnetic force only during pedaling, and, when the pedaling is stopped or the running of a bicycle is stopped, the coupling between the magnets is released through a magnetic separation means and at the same time metal powder attached to a shoe is caused to fall so as to prevent the metal powder from being attached to the shoe.
    Type: Application
    Filed: November 27, 2019
    Publication date: February 24, 2022
    Inventors: Do Young KIM, Kyeong Sook YOON, Ji Heon KIM, Ji Seong KIM
  • Publication number: 20220041903
    Abstract: An adhesive film, an optical member including the same, and an optical display including the same, the adhesive film being formed of an adhesive film composition, the adhesive film composition including a (meth)acrylic polymer having an aromatic group and a hydroxyl group; inorganic particles having an index of refraction of about 1.5 or more; and a crosslinking agent, wherein the adhesive film has a modulus of about 50 kPa to about 500 kPa at 25° C.
    Type: Application
    Filed: August 3, 2021
    Publication date: February 10, 2022
    Inventors: Do Young KIM, Young Jong KIM, Seung Hoon LEE, Seong Heun CHO, Ji Young HAN, IL Jin KIM
  • Patent number: 11233000
    Abstract: A semiconductor package includes a first metal interconnection disposed in a semiconductor chip, a first bump group configured to be connected to the first metal interconnection, a first inner lead pattern group configured to be connected to the first bump group, a second metal interconnection disposed in the semiconductor chip, a second bump group configured to be connected to the second metal interconnection; and a second inner lead pattern group configured to be connected to the second bump group, wherein a density of the first metal interconnection is greater than a density of the second metal interconnection, such that a first pitch of the first lead pattern group is greater than a second pitch of the second lead pattern group.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: January 25, 2022
    Assignee: MagnaChip Semiconductor, Ltd.
    Inventors: Jae Sik Choi, Do Young Kim, Jin Won Jeong, Hye Ji Lee
  • Patent number: 11219125
    Abstract: Provided are a transparent conductor and a display device including the same, the transparent conductor including: a substrate layer; and a transparent conductive pattern layer formed on the substrate layer, and the transparent conductive pattern layer includes a plurality of conductive areas and non-conductive areas, the non-conductive areas are formed every between neighboring conductive areas, the non-conductive area in the transparent conductive pattern layer has a deviation as calculated by Equation 1 herein, which has a value larger than about 1 and equal to or smaller than about 1.25, and the non-conductive areas have a minimum line width of 40 ?m or less.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: January 4, 2022
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Oh Hyeon Hwang, Dong Myeong Shin, Ji Young Han, Do Young Kim, Young Hoon Kim, Tae Ji Kim
  • Publication number: 20210261833
    Abstract: An adhesive film, a scattering prevention film including the same, and an optical display apparatus including the same are provided. An adhesive film is formed of an adhesive composition including: a polymerization product including a hydroxyl group-containing (meth)acrylic copolymer; and an alkylene oxide cross-linking agent. The adhesive film contains a substituted monocyclic cyclyloxy group and has a peel strength of about 950 gf/in or more, as measured with respect to a glass plate at about 25° C.
    Type: Application
    Filed: February 19, 2021
    Publication date: August 26, 2021
    Inventors: Sung Hyun MUN, Ji Won KANG, Do Young KIM, Il Jin KIM, Ji Yeon KIM, Ji Ho KIM, Kyoung Gon PARK, Dong Myeong SHIN, Gwang Hwan LEE, Jin Young LEE, Jae Hyun HAN, Ji Young HAN, Se Mi HEO
  • Patent number: 11063100
    Abstract: A display device is disclosed, which may prevent an inorganic film formed in an organic film open area from being damaged and prevent a cathode electrode from being shorted. The display device includes a substrate including a display area on which pixels area arranged, and a non-display area surrounding the display area; a first metal layer formed in the non-display area of the substrate; at least one insulating film arranged on the first metal layer; a second metal layer arranged on the at least one insulating film and connected with the first metal layer through a contact hole that passes through the at least one insulating film formed in the non-display area; a cover layer arranged on the contact hole and formed to overlap the contact hole; and an encapsulation film formed to cover the display area and the cover layer.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: July 13, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Jongchan Park, JinHwan Kim, Do-Young Kim, Hyunchul Um, YeongHo Yun
  • Patent number: 11051147
    Abstract: Provided are an electronic apparatus and a method of outputting content. The method includes establishing a wireless communication connection with a second electronic apparatus, receiving apparatus information of the external apparatus from the second electronic apparatus, requesting the second electronic apparatus to establish a wireless communication connection between the first electronic apparatus and the external apparatus, receiving a response to the requesting from the second electronic apparatus, establishing a wireless communication connection between the first electronic apparatus and the external apparatus based on the response; and outputting content by using an executed second application of the first electronic apparatus via the wireless communication connection between the first electronic apparatus and the external apparatus.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: June 29, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-woo Ko, Hang-sik Shin, Se-jun Park, Do-young Kim
  • Publication number: 20210161365
    Abstract: A user terminal of the present invention includes a display including a screen on which an image is displayable, and configured to output light having a specific wavelength from at least a partial region of the screen; an image capturer configured to capture an image of a user's body; and a controller configured to control the display to output first light of a first wavelength range from a first region on the screen, control the image capturer to capture an image, analyze the captured image, and control the display to display analysis information on a second region of the screen.
    Type: Application
    Filed: December 29, 2016
    Publication date: June 3, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Do-young KIM, Hee-jin PARK, June-hyeon AHN, Sun-tae JUNG, Jae-geol CHO, Jin-sung KIM
  • Publication number: 20210083302
    Abstract: The present invention relates to a fuel cell and a fuel cell stack comprising the same, and according to one aspect of the present invention, there is provided a fuel cell comprising a membrane-electrode assembly having a first surface and a second surface opposite to the first surface, wherein an anode electrode and a cathode electrode are each disposed on the first surface; an end plate disposed apart at a predetermined interval on the second surface; a first gas diffusion layer disposed on the anode electrode; a second gas diffusion layer disposed on the cathode electrode; a first separating plate disposed on the first gas diffusion layer and having a plurality of flow channels; and a second separating plate disposed on the second gas diffusion layer and having a plurality of flow channels.
    Type: Application
    Filed: January 31, 2019
    Publication date: March 18, 2021
    Inventors: Sung Hyun YUN, Joo Yong PARK, Do Young KIM, Woon Jo KIM, Kyung Mun KANG, Jae Choon YANG
  • Publication number: 20200347269
    Abstract: Provided are an adhesive film and an optical member comprising same, the adhesive film comprising at least two types of (meth)acrylic monomers for a (meth)acrylic prepolymer, and (meth)acrylate containing silicon, wherein the release force of the adhesive film with respect to a polyimide film is approximately 0.5 gf/in to 5 gf/in.
    Type: Application
    Filed: August 30, 2018
    Publication date: November 5, 2020
    Inventors: Ji Ho KIM, Tae Ji KIM, Jung Hyo LEE, Il Jin KIM, Dong Myeong SHIN, Do Young KIM, Young Hoon KIM, Oh Hyeon HWANG
  • Patent number: 10824563
    Abstract: The exemplary embodiments provide an in-memory database which uses a non-volatile memory as a primary storage, uses a volatile memory for data which exceeds a predetermined capacity of the non-volatile memory, as a secondary storage, and periodically stores a log file for data stored in the volatile memory in a block device, thereby ensuring a data consistency while overcoming a capacity limit of the non-volatile memory.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: November 3, 2020
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Sang Hyun Park, Do Young Kim, Bernd Burgstaller, Won Gi Choi
  • Publication number: 20200286817
    Abstract: A semiconductor package includes a first metal interconnection disposed in a semiconductor chip, a first bump group configured to be connected to the first metal interconnection, a first inner lead pattern group configured to be connected to the first bump group, a second metal interconnection disposed in the semiconductor chip, a second bump group configured to be connected to the second metal interconnection; and a second inner lead pattern group configured to be connected to the second bump group, wherein a density of the first metal interconnection is greater than a density of the second metal interconnection, such that a first pitch of the first lead pattern group is greater than a second pitch of the second lead pattern group.
    Type: Application
    Filed: July 5, 2019
    Publication date: September 10, 2020
    Applicant: MagnaChip Semiconductor, Ltd.
    Inventors: Jae Sik CHOI, Do Young KIM, Jin Won JEONG, Hye Ji LEE
  • Patent number: 10749058
    Abstract: Embodiments described herein generally relate to monodisperse nanoparticles that are capable of absorbing infrared radiation and generating charge carriers. In some cases, at least a portion of the nanoparticles are nanocrystals. In certain embodiments, the monodisperse, IR-absorbing nanocrystals are formed according to a method comprising a nanocrystal formation step comprising adding a first precursor solution comprising a first element of the nanocrystal to a second precursor solution comprising a second element of the nanocrystal to form a first mixed precursor solution, where the molar ratio of the first element to the second element in the first mixed precursor solution is above a nucleation threshold.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: August 18, 2020
    Assignees: University of Florida Research Foundation, Incorporated, Nanoholdings, LLC
    Inventors: Franky So, Do Young Kim, Jae Woong Lee, Bhabendra K. Pradhan
  • Patent number: 10741521
    Abstract: A semiconductor package manufacturing method includes preparing a flexible film including input wire patterns and output wire patterns, preparing a semiconductor chip including metal bumps, attaching the semiconductor chip to one side of the flexible film, such that the metal bumps are connected to either one or both of the input wire patterns and the output wire patterns, and attaching a first absorbing and shielding tape to another side of the flexible film, wherein the first absorbing and shielding tape includes an absorption film and a protective insulating film disposed on the absorption film.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: August 11, 2020
    Assignee: MagnaChip Semiconductor, Ltd.
    Inventors: Jae Sik Choi, Jin Won Jeong, Do Young Kim, Hye Ji Lee, Byeung Soo Song
  • Patent number: 10731250
    Abstract: In some embodiments, deposition processes for ruthenium (Ru) feature fill include deposition of a thin, protective Ru film under reducing conditions, followed by a Ru fill step under oxidizing conditions. The presence of protective Ru films formed under oxygen-free conditions or with an oxygen-removing operation can enable Ru fill without oxidation of an underlying adhesion layer or metal feature.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: August 4, 2020
    Assignee: Lam Research Corporation
    Inventors: Do Young Kim, Jeong-Seok Na, Chiukin Steven Lai, Raashina Humayun, Michal Danek
  • Publication number: 20200162871
    Abstract: Provided are an electronic apparatus and a method of outputting content. The method includes establishing a wireless communication connection with a second electronic apparatus, receiving apparatus information of the external apparatus from the second electronic apparatus, requesting the second electronic apparatus to establish a wireless communication connection between the first electronic apparatus and the external apparatus, receiving a response to the requesting from the second electronic apparatus, establishing a wireless communication connection between the first electronic apparatus and the external apparatus based on the response; and outputting content by using an executed second application of the first electronic apparatus via the wireless communication connection between the first electronic apparatus and the external apparatus.
    Type: Application
    Filed: December 30, 2019
    Publication date: May 21, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-woo Ko, Hang-sik Shin, Se-jun Park, Do-young Kim
  • Patent number: 10651407
    Abstract: A vertical field-effect transistor is provided, comprising a first electrode, a porous conductor layer formed from a layer of conductive material with a plurality of holes extending through the conductive material disposed therein, a dielectric layer between the first electrode and the porous conductor layer, a charge transport layer in contact with the porous conductor layer, and a second electrode electrically connected to the charge transport layer. A photoactive layer may be provided between the dielectric layer and the first electrode. A method of manufacturing a vertical field-effect transistor may also be provided, comprising forming a dielectric layer and depositing a conductor layer in contact with the dielectric layer, wherein one or more regions of the dielectric layer are masked during deposition such that the conductor layer includes a plurality of pores that extend through the conductor layer.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: May 12, 2020
    Assignees: Nanoholdings, LLC, University of Florida Research Foundation, Incorporated
    Inventors: Hyeonggeun Yu, Franky So, Do Young Kim, Bhabendra K. Pradhan
  • Publication number: 20200035644
    Abstract: A semiconductor package manufacturing method includes preparing a flexible film including input wire patterns and output wire patterns, preparing a semiconductor chip including metal bumps, attaching the semiconductor chip to one side of the flexible film, such that the metal bumps are connected to either one or both of the input wire patterns and the output wire patterns, and attaching a first absorbing and shielding tape to another side of the flexible film, wherein the first absorbing and shielding tape includes an absorption film and a protective insulating film disposed on the absorption film.
    Type: Application
    Filed: April 23, 2019
    Publication date: January 30, 2020
    Applicant: Magnachip Semiconductor, Ltd.
    Inventors: Jae Sik CHOI, Jin Won JEONG, Do Young KIM, Hye Ji LEE, Byeung Soo SONG