Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

Abstract: Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.

Abstract: Because the touch temperature of a wearable computing device (“WCD”) may be an insignificant factor for user experience when the WCD is not being worn by a user, embodiments of the solution seek to modify thermal management policies based on an inferred user proximity state. Exemplary embodiments monitor one or more signals from readily available sensors in the WCD that have primary purposes other than measuring user proximity. Depending on embodiment, the sensors may be selected from a group consisting of a heart rate monitor, a pulse monitor, an O2 sensor, a bio-impedance sensor, a gyroscope, an accelerometer, a temperature sensor, a pressure sensor, a capacitive sensor, a resistive sensor and a light sensor. Using the signals generated by such sensors, relative physical proximity of the WCD to a user may be inferred and, based on the user proximity state, thermal policies either relaxed or tightened.

Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

Abstract: Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

Abstract: Disclosed herein is an electronic display assembly having a thermally conductive housing and an image assembly. The image assembly is positioned within the thermally conductive housing and behind a transparent plate assembly. An inlet opening and outlet opening are formed by gaps located between opposing edges of the image assembly and the housing. A space between the image assembly and the plate assembly forms a channel. A thermally conductive plate extends from near the image assembly within each of the inlet opening and outlet opening to contact the housing. Heat from the image assembly is conductively transferred to the housing by the thermally conductive plates. A fan may be positioned to circulate cooling air through the channel via the inlet and outlet openings and apertures in the thermally conductive plates.

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

Abstract: Disclosed herein is an electronic display assembly having a thermally conductive housing and an image assembly. The image assembly is positioned within the thermally conductive housing and behind a transparent plate assembly. An inlet opening and outlet opening are formed by gaps located between opposing edges of the image assembly and the housing. A space between the image assembly and the plate assembly forms a channel. Thermally conductive plates extend from near the image assembly within each of the inlet opening and outlet opening to contact the housing. Heat from the image assembly is conductively transferred to the housing by the thermally conductive plates. A fan may be positioned to circulate cooling air through the channel via the inlet and outlet openings and apertures in the thermally conductive plates.

Abstract: Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

Abstract: Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

Abstract: Disclosed herein is an electronic display assembly including a backlight that is positioned to illuminate a liquid crystal display, and a novel cooling mechanism in the form of a thermal plate that is located and configured to transfer heat from the backlight to a thermally conductive housing of the electronic display assembly. The thermal plate is preferably placed in conductive thermal communication with the backlight and with the thermally conductive housing for this purpose. One or more air flow apertures may pass through the thermal plate. A convective cooling loop may also be provided, which cooling loop may include a fan that is located to move cooling air over the thermal plate and/or though one or more apertures in the thermal plate. Both a top and bottom thermal plate may be employed in some exemplary embodiments.

Abstract: Because the touch temperature of a wearable computing device (“WCD”) may be an insignificant factor for user experience when the WCD is not being worn by a user, embodiments of the solution seek to modify thermal management policies based on an inferred user proximity state. Exemplary embodiments monitor one or more signals from readily available sensors in the WCD that have primary purposes other than measuring user proximity. Depending on embodiment, the sensors may be selected from a group consisting of a heart rate monitor, a pulse monitor, an O2 sensor, a bio-impedance sensor, a gyroscope, an accelerometer, a temperature sensor, a pressure sensor, a capacitive sensor, a resistive sensor and a light sensor. Using the signals generated by such sensors, relative physical proximity of the WCD to a user may be inferred and, based on the user proximity state, thermal policies either relaxed or tightened.

Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

Abstract: Disclosed herein is an electronic display assembly having a thermally conductive housing and a liquid crystal display positioned within the thermally conductive housing. An LED backlight may be positioned to illuminate the liquid crystal display and a thermal plate is preferably placed in conductive thermal communication with the LED backlight and with the thermally conductive housing. Heat from the LED backlight may be conductively transferred from the LED backlight to the housing. A fan may be positioned to force cooling air over the thermal plate or though one or more apertures within the thermal plate.

Abstract: An in-field replaceable glass assembly for an electronic display placed within a housing is disclosed. The housing preferably contains a hanger at the top of the housing, where the glass assembly contains a frame surrounding a pane of glass and having a top and bottom. A tab is preferably placed at the top of the frame and adapted to hold the glass assembly in place when slipped over the hanger on the housing. The glass assembly also contains a means for attaching the bottom of the frame to the housing. In some embodiments this means is a threaded post which extends from the frame and passing through a portion of the housing. A nut may be tightened against the post. In other embodiments a threaded fastener may pass through the housing and thread into a female threaded hole within the frame.

Abstract: Disclosed is a thermal plate assembly and method for cooling an electronic display. The thermal plate may contain a first portion which is in thermal communication with the electronic display. A second portion of the thermal plate may be in thermal communication with the housing. Apertures may be placed within the plate and a fan may be positioned to draw air through the apertures. A gap may be located between the electronic display and a transparent plate assembly, where the fan may be further positioned to force air through the gap as well.

Abstract: An in-field replaceable glass assembly for an electronic display placed within a housing is disclosed. The housing preferably contains a hanger at the top of the housing, where the glass assembly contains a frame surrounding a pane of glass and having a top and bottom. A tab is preferably placed at the top of the frame and adapted to hold the glass assembly in place when slipped over the hanger on the housing. The glass assembly also contains a means for attaching the bottom of the frame to the housing. In some embodiments this means is a threaded post which extends from the frame and passing through a portion of the housing. A nut may be tightened against the post. In other embodiments a threaded fastener may pass through the housing and thread into a female threaded hole within the frame.

Abstract: An in-field replaceable glass assembly for an electronic display placed within a housing is disclosed. The housing preferably contains a hanger at the top of the housing, where the glass assembly contains a frame surrounding a pane of glass and having a top and bottom. A tab is preferably placed at the top of the frame and adapted to hold the glass assembly in place when slipped over the hanger on the housing. The glass assembly also contains a means for attaching the bottom of the frame to the housing. In some embodiments this means is a threaded post which extends from the frame and passing through a portion of the housing. A nut may be tightened against the post. In other embodiments a threaded fastener may pass through the housing and thread into a female threaded hole within the frame.

Abstract: Disclosed is a thermal plate assembly and method for cooling an electronic display. The thermal plate may contain a first portion which is in thermal communication with the electronic display. A second portion of the thermal plate may be in thermal communication with the housing. Apertures may be placed within the plate and a fan may be positioned to draw air through the apertures. A gap may be located between the electronic display and a transparent plate assembly, where the fan may be further positioned to force air through the gap as well.