Patents by Inventor Donald J Milligan
Donald J Milligan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11731426Abstract: In various examples, a fluid ejection device may include a substrate with a fluid feed hole and a corrosion-detecting conductive path or sensor disposed behind a wall of the fluid feed hold. The corrosion-detecting conductive path or sensor may close a circuit in response being exposed to a fluid contained within the fluid feed hole.Type: GrantFiled: June 18, 2019Date of Patent: August 22, 2023Assignee: Hewlett-Packard Development Company L.P.Inventors: Donald J. Milligan, Eric T. Martin, Rogelio Cicili
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Publication number: 20230202167Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.Type: ApplicationFiled: February 24, 2023Publication date: June 29, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Sean P. McClelland, Donald J. Milligan, Eric T. Martin
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Publication number: 20230191779Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.Type: ApplicationFiled: February 23, 2023Publication date: June 22, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Sean P. McClelland, Donald J. Milligan, Eric T. Martin
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Patent number: 11618253Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.Type: GrantFiled: May 14, 2021Date of Patent: April 4, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sean P. McClelland, Donald J. Milligan, Eric T. Martin
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Publication number: 20230056907Abstract: A fluidic die includes a substrate and a thermal sensor arranged on a membrane region of the substrate. The substrate includes a fluid slot formed in a back side of the substrate, while the membrane region is positioned between the fluid slot and a front side of the substrate. The substrate also includes a plurality of fluid feed holes in the membrane region, where each fluid feed hole is in communication with the fluid slot and the front side of the substrate.Type: ApplicationFiled: January 29, 2020Publication date: February 23, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Eric T. Martin, Jeremy Joseph Spencer, Donald J. Milligan
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Publication number: 20220097369Abstract: In various examples, a fluid ejection device may include a substrate with a fluid feed hole and a corrosion-detecting conductive path or sensor disposed behind a wall of the fluid feed hold. The corrosion-detecting conductive path or sensor may close a circuit in response being exposed to a fluid contained within the fluid feed hole.Type: ApplicationFiled: June 18, 2019Publication date: March 31, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Donald J. Milligan, Eric T. Martin, Rogelio Cicili
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Patent number: 11214060Abstract: In some examples, a fluid dispensing die includes a plurality of fluid actuators to cause dispensing of a fluid from respective nozzles of the fluid dispensing die, and an electrically conductive layer including electrically conductive ground structures to connect respective fluid actuators of the plurality of fluid actuators to a ground, wherein the electrically conductive layer includes gaps provided between the electrically conductive ground structures of the electrically conductive layer.Type: GrantFiled: December 8, 2017Date of Patent: January 4, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Donald W. Schulte, Donald J. Milligan, Terry McMahon
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Publication number: 20210260870Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.Type: ApplicationFiled: May 14, 2021Publication date: August 26, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Sean P. McClelland, Donald J. Milligan, Eric T. Martin
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Patent number: 11034147Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.Type: GrantFiled: April 14, 2017Date of Patent: June 15, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sean P McClelland, Donald J Milligan, Eric T Martin
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Publication number: 20210129543Abstract: In some examples, a fluid dispensing die includes a plurality of fluid actuators to cause dispensing of a fluid from respective nozzles of the fluid dispensing die, and an electrically conductive layer including electrically conductive ground structures to connect respective fluid actuators of the plurality of fluid actuators to a ground, wherein the electrically conductive layer includes gaps provided between the electrically conductive ground structures of the electrically conductive layer.Type: ApplicationFiled: December 8, 2017Publication date: May 6, 2021Inventors: Donald W. Schulte, Donald J. Milligan, Terry McMahon
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Publication number: 20200122458Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.Type: ApplicationFiled: April 14, 2017Publication date: April 23, 2020Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Sean P McClelland, Donald J Milligan, Eric T Martin
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Patent number: 10293603Abstract: A multi-directional single pass printing apparatus may include a print head comprising a collection of slots. The collection of slots may include a central slot for delivering a central slot fluid type, a first serial arrangement of first slots on a first side of the central slot to deliver a first series of respective fluid types and a second serial arrangement of second slots on a second side of the central slot opposite the first side. The second series of slots are to deliver a second series of respective fluid types, wherein the second series of respective fluid types mirror the first series of respective fluid types with respect to the central slot fluid type.Type: GrantFiled: February 15, 2018Date of Patent: May 21, 2019Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Vincent C Korthuis, Donald J Milligan, Dennis Schloeman
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Patent number: 10267822Abstract: A sensor having a particle barrier is described. In an example, a sensor includes: first and second electrode sets respectively disposed upon a planar support surface and a proof mass that is compliantly displaceable along a first axis substantially parallel to the planar support surface; and a first barrier disposed on the planar support around the first electrode set having a height less than a gap between the planar support and the proof mass to mitigate particle migration into the first or second electrode set.Type: GrantFiled: January 31, 2013Date of Patent: April 23, 2019Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jennifer Wu, Rodney L. Alley, Robert G. Walmsley, Donald J. Milligan
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Publication number: 20180186149Abstract: A multi-directional single pass printing apparatus may include a print head comprising a collection of slots. The collection of slots may include a central slot for delivering a central slot fluid type, a first serial arrangement of first slots on a first side of the central slot to deliver a first series of respective fluid types and a second serial arrangement of second slots on a second side of the central slot opposite the first side. The second series of slots are to deliver a second series of respective fluid types, wherein the second series of respective fluid types mirror the first series of respective fluid types with respect to the central slot fluid type.Type: ApplicationFiled: February 15, 2018Publication date: July 5, 2018Applicant: Hewlett-Packard Development Company, L.P.Inventors: Vincent C Korthuis, Donald J Milligan, Dennis Schloeman
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Patent number: 9937713Abstract: According to an example, multi-directional single pass printing may include utilizing a print head that includes slots that include a first slot for a first ink color, and two or more additional slots. A slot of the additional slots may be disposed on a first side of the first slot, and another slot of the additional slots may be disposed on a second side of the first slot. The additional slots may include a further ink color. Data may be forwarded to a set of slots when a direction bit related to the print head is set to a first value, and to another set of slots when the direction bit is set to a second value. A number of channels for forwarding the data to the slots may be less than the number of slots.Type: GrantFiled: October 29, 2014Date of Patent: April 10, 2018Assignee: Hewlett-Packard Development Company, L.P.Inventors: Vincent C Korthuis, Donald J Milligan, Dennis Schloeman
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Patent number: 9856137Abstract: The present disclosure includes bonded wafer structures and methods of forming bonded wafer structures. One example of a forming a bonded wafer structure includes providing a first wafer (202, 302) and a second wafer (204, 304) to be bonded together via a bonding process that has a predetermined wafer gap (216, 316) associated therewith, and forming a mesa (215, 315, 415) on the first wafer (202, 302) prior to bonding the first wafer (202, 302) and the second wafer (204, 304) together, wherein a height (220, 320, 420) of the mesa (215, 315, 415) is determined based on a target element gap (217, 317) associated with the bonded wafer structure.Type: GrantFiled: May 9, 2011Date of Patent: January 2, 2018Assignee: Hewlett-Packard Development Company, L.P.Inventors: Rodney L. Alley, Donald J. Milligan
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Publication number: 20170232735Abstract: According to an example, multi-directional single pass printing may include utilizing a print head that includes slots that include a first slot for a first ink color, and two or more additional slots. A slot of the additional slots may be disposed on a first side of the first slot, and another slot of the additional slots may be disposed on a second side of the first slot. The additional slots may include a further ink color. Data may be forwarded to a set of slots when a direction bit related to the print head is set to a first value, and to another set of slots when the direction bit is set to a second value. A number of channels for forwarding the data to the slots may be less than the number of slots.Type: ApplicationFiled: October 29, 2014Publication date: August 17, 2017Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Vincent C Korthuis, Donald J Milligan, Dennis Schloeman
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Patent number: 9571008Abstract: The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel.Type: GrantFiled: June 28, 2011Date of Patent: February 14, 2017Assignee: Hewlett-Packard Development Company, L.P.Inventors: Donald J. Milligan, Rodney L. Alley, Peter G. Hartwell, Robert G. Walmsley
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Publication number: 20150355223Abstract: A sensor having a particle barrier is described. In an example, a sensor includes: first and second electrode sets respectively disposed upon a planar support surface and a proof mass that is compliantly displaceable along a first axis substantially parallel to the planar support surface; and a first barrier disposed on the planar support around the first electrode set having a height less than a gap between the planar support and the proof mass to mitigate particle migration into the first or second electrode set.Type: ApplicationFiled: January 31, 2013Publication date: December 10, 2015Inventors: Jennifer Wu, Rodney L. Alley, Robert G. Walmsley, Donald J. Milligan
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Publication number: 20140042869Abstract: The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel.Type: ApplicationFiled: June 28, 2011Publication date: February 13, 2014Inventors: Donald J. Milligan, Rodney L. Alley, Peter G. Hartwell, Robet G. Walmsley