Patents by Inventor Donald J Milligan

Donald J Milligan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11731426
    Abstract: In various examples, a fluid ejection device may include a substrate with a fluid feed hole and a corrosion-detecting conductive path or sensor disposed behind a wall of the fluid feed hold. The corrosion-detecting conductive path or sensor may close a circuit in response being exposed to a fluid contained within the fluid feed hole.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: August 22, 2023
    Assignee: Hewlett-Packard Development Company L.P.
    Inventors: Donald J. Milligan, Eric T. Martin, Rogelio Cicili
  • Publication number: 20230202167
    Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.
    Type: Application
    Filed: February 24, 2023
    Publication date: June 29, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sean P. McClelland, Donald J. Milligan, Eric T. Martin
  • Publication number: 20230191779
    Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.
    Type: Application
    Filed: February 23, 2023
    Publication date: June 22, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sean P. McClelland, Donald J. Milligan, Eric T. Martin
  • Patent number: 11618253
    Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 4, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sean P. McClelland, Donald J. Milligan, Eric T. Martin
  • Publication number: 20230056907
    Abstract: A fluidic die includes a substrate and a thermal sensor arranged on a membrane region of the substrate. The substrate includes a fluid slot formed in a back side of the substrate, while the membrane region is positioned between the fluid slot and a front side of the substrate. The substrate also includes a plurality of fluid feed holes in the membrane region, where each fluid feed hole is in communication with the fluid slot and the front side of the substrate.
    Type: Application
    Filed: January 29, 2020
    Publication date: February 23, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Eric T. Martin, Jeremy Joseph Spencer, Donald J. Milligan
  • Publication number: 20220097369
    Abstract: In various examples, a fluid ejection device may include a substrate with a fluid feed hole and a corrosion-detecting conductive path or sensor disposed behind a wall of the fluid feed hold. The corrosion-detecting conductive path or sensor may close a circuit in response being exposed to a fluid contained within the fluid feed hole.
    Type: Application
    Filed: June 18, 2019
    Publication date: March 31, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Donald J. Milligan, Eric T. Martin, Rogelio Cicili
  • Patent number: 11214060
    Abstract: In some examples, a fluid dispensing die includes a plurality of fluid actuators to cause dispensing of a fluid from respective nozzles of the fluid dispensing die, and an electrically conductive layer including electrically conductive ground structures to connect respective fluid actuators of the plurality of fluid actuators to a ground, wherein the electrically conductive layer includes gaps provided between the electrically conductive ground structures of the electrically conductive layer.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: January 4, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Donald W. Schulte, Donald J. Milligan, Terry McMahon
  • Publication number: 20210260870
    Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.
    Type: Application
    Filed: May 14, 2021
    Publication date: August 26, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Sean P. McClelland, Donald J. Milligan, Eric T. Martin
  • Patent number: 11034147
    Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: June 15, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sean P McClelland, Donald J Milligan, Eric T Martin
  • Publication number: 20210129543
    Abstract: In some examples, a fluid dispensing die includes a plurality of fluid actuators to cause dispensing of a fluid from respective nozzles of the fluid dispensing die, and an electrically conductive layer including electrically conductive ground structures to connect respective fluid actuators of the plurality of fluid actuators to a ground, wherein the electrically conductive layer includes gaps provided between the electrically conductive ground structures of the electrically conductive layer.
    Type: Application
    Filed: December 8, 2017
    Publication date: May 6, 2021
    Inventors: Donald W. Schulte, Donald J. Milligan, Terry McMahon
  • Publication number: 20200122458
    Abstract: A fluidic die may include a substrate supporting a fluid actuator address line and first and second groups of fluid actuators connected to the fluid actuator address line. The first group of fluid actuators may include first and second types of fluid actuators having different operating characteristics. The second group of fluid actuators may include the first and the second types of fluid actuators. The fluid actuators of the first and second groups have addresses such that a fluid actuator of the first type in the first group and a fluid actuator of the second type in the second group are both enabled in response to a single enabling event on the fluid actuator address line.
    Type: Application
    Filed: April 14, 2017
    Publication date: April 23, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Sean P McClelland, Donald J Milligan, Eric T Martin
  • Patent number: 10293603
    Abstract: A multi-directional single pass printing apparatus may include a print head comprising a collection of slots. The collection of slots may include a central slot for delivering a central slot fluid type, a first serial arrangement of first slots on a first side of the central slot to deliver a first series of respective fluid types and a second serial arrangement of second slots on a second side of the central slot opposite the first side. The second series of slots are to deliver a second series of respective fluid types, wherein the second series of respective fluid types mirror the first series of respective fluid types with respect to the central slot fluid type.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: May 21, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Vincent C Korthuis, Donald J Milligan, Dennis Schloeman
  • Patent number: 10267822
    Abstract: A sensor having a particle barrier is described. In an example, a sensor includes: first and second electrode sets respectively disposed upon a planar support surface and a proof mass that is compliantly displaceable along a first axis substantially parallel to the planar support surface; and a first barrier disposed on the planar support around the first electrode set having a height less than a gap between the planar support and the proof mass to mitigate particle migration into the first or second electrode set.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: April 23, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jennifer Wu, Rodney L. Alley, Robert G. Walmsley, Donald J. Milligan
  • Publication number: 20180186149
    Abstract: A multi-directional single pass printing apparatus may include a print head comprising a collection of slots. The collection of slots may include a central slot for delivering a central slot fluid type, a first serial arrangement of first slots on a first side of the central slot to deliver a first series of respective fluid types and a second serial arrangement of second slots on a second side of the central slot opposite the first side. The second series of slots are to deliver a second series of respective fluid types, wherein the second series of respective fluid types mirror the first series of respective fluid types with respect to the central slot fluid type.
    Type: Application
    Filed: February 15, 2018
    Publication date: July 5, 2018
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Vincent C Korthuis, Donald J Milligan, Dennis Schloeman
  • Patent number: 9937713
    Abstract: According to an example, multi-directional single pass printing may include utilizing a print head that includes slots that include a first slot for a first ink color, and two or more additional slots. A slot of the additional slots may be disposed on a first side of the first slot, and another slot of the additional slots may be disposed on a second side of the first slot. The additional slots may include a further ink color. Data may be forwarded to a set of slots when a direction bit related to the print head is set to a first value, and to another set of slots when the direction bit is set to a second value. A number of channels for forwarding the data to the slots may be less than the number of slots.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: April 10, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Vincent C Korthuis, Donald J Milligan, Dennis Schloeman
  • Patent number: 9856137
    Abstract: The present disclosure includes bonded wafer structures and methods of forming bonded wafer structures. One example of a forming a bonded wafer structure includes providing a first wafer (202, 302) and a second wafer (204, 304) to be bonded together via a bonding process that has a predetermined wafer gap (216, 316) associated therewith, and forming a mesa (215, 315, 415) on the first wafer (202, 302) prior to bonding the first wafer (202, 302) and the second wafer (204, 304) together, wherein a height (220, 320, 420) of the mesa (215, 315, 415) is determined based on a target element gap (217, 317) associated with the bonded wafer structure.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: January 2, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Rodney L. Alley, Donald J. Milligan
  • Publication number: 20170232735
    Abstract: According to an example, multi-directional single pass printing may include utilizing a print head that includes slots that include a first slot for a first ink color, and two or more additional slots. A slot of the additional slots may be disposed on a first side of the first slot, and another slot of the additional slots may be disposed on a second side of the first slot. The additional slots may include a further ink color. Data may be forwarded to a set of slots when a direction bit related to the print head is set to a first value, and to another set of slots when the direction bit is set to a second value. A number of channels for forwarding the data to the slots may be less than the number of slots.
    Type: Application
    Filed: October 29, 2014
    Publication date: August 17, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Vincent C Korthuis, Donald J Milligan, Dennis Schloeman
  • Patent number: 9571008
    Abstract: The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: February 14, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Donald J. Milligan, Rodney L. Alley, Peter G. Hartwell, Robert G. Walmsley
  • Publication number: 20150355223
    Abstract: A sensor having a particle barrier is described. In an example, a sensor includes: first and second electrode sets respectively disposed upon a planar support surface and a proof mass that is compliantly displaceable along a first axis substantially parallel to the planar support surface; and a first barrier disposed on the planar support around the first electrode set having a height less than a gap between the planar support and the proof mass to mitigate particle migration into the first or second electrode set.
    Type: Application
    Filed: January 31, 2013
    Publication date: December 10, 2015
    Inventors: Jennifer Wu, Rodney L. Alley, Robert G. Walmsley, Donald J. Milligan
  • Publication number: 20140042869
    Abstract: The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel.
    Type: Application
    Filed: June 28, 2011
    Publication date: February 13, 2014
    Inventors: Donald J. Milligan, Rodney L. Alley, Peter G. Hartwell, Robet G. Walmsley