Abstract: A method of forming a fluid ejecting device such as an ink jet printing device that includes forming a plurality of fluid drop generators on a first surface of a silicon substrate, forming a partial fluid feed slot in the silicon substrate by deep reactive ion etching, and forming a fluid feed slot by wet etching the partial fluid feed slot.

Abstract: A method of manufacturing a fluidic channel through a substrate includes etching an exposed section on a first surface of the substrate, and coating the etched section of the substrate. The etching and the coating are alternatingly repeated until the fluidic channel is formed.

Abstract: A low temperature process for silicon-based field emitter tip sharpening. A rough silicon-based field emitter tip is exposed to xenon difluoride gas in a process chamber to carry out low-temperature, isotropic etching of the rough silicon-based field emitter tip to produce a final, sharpened field emitter tip.

Abstract: A method for fabricating tiny field emitter tips across the surface of a substrate. A substrate is first exposed to reactive molecular, ionic, or free radical species to produce nanoclusters within a thin surface layer of the substrate. The substrate may then be thermally annealed to produce regularly sized and interspaced nanoclusters. Finally, the substrate is etched to produce the field emitter tips.

Abstract: An inkjet print cartridge comprising a printhead that is formed using a sequence of etch process steps is described. The first etch of the two etch step process is comprised of a wet chemical etch. A dry etch process follows. Both etch steps are consecutively initiated from the back of the wafer. The fabrication process described offers several advantages including precise dimensional control of the ink feed channel, greater packing density of ink ejectors disposed in the printhead and greater printing speed. Additionally, the time required to manufacture the printhead, in contrast to a conventional printhead, is reduced.

Abstract: An inkjet print cartridge comprising a printhead that is formed using a sequence of etch process steps is described. The first etch of the two etch step process is comprised of a wet chemical etch followed by a dry etch process, both etch steps are consecutively initiated from the back of the wafer. The fabrication process described offers several advantages including precise dimensional control of the ink feed channel, greater packing density of ink ejectors disposed in the printhead and greater printing speed. Additionally, the time required to manufacture the printhead, in contrast to a conventional printhead, is reduced.