Patents by Inventor Donald Ray Disney
Donald Ray Disney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7898060Abstract: A variety of isolation structures for semiconductor substrates include a trench formed in the substrate that is filled with a dielectric material or filled with a conductive material and lined with a dielectric layer along the walls of the trench. The trench may be used in combination with doped sidewall isolation regions. Both the trench and the sidewall isolation regions may be annular and enclose an isolated pocket of the substrate. The isolation structures are formed by modular implant and etch processes that do not include significant thermal processing or diffusion of dopants so that the resulting structures are compact and may be tightly packed in the surface of the substrate.Type: GrantFiled: July 30, 2008Date of Patent: March 1, 2011Assignees: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Richard K. Williams, Donald Ray Disney, Wai Tien Chan
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Publication number: 20110018058Abstract: A high-voltage transistor includes a drain, a source, and one or more drift regions extending from the drain toward the source. A field plate member laterally surrounds the drift regions and is insulated from the drift regions by a dielectric layer. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).Type: ApplicationFiled: August 26, 2010Publication date: January 27, 2011Applicant: Power Integrations, Inc.Inventor: Donald Ray Disney
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Publication number: 20110012196Abstract: A lateral MOSFET formed in a substrate of a first conductivity type includes a gate formed atop a gate dielectric layer over a surface of the substrate, a drain region of a second conductivity type, a source region of a second conductivity type, and a body region of the first conductivity type which extends under the gate. The body region may have a non-monotonic vertical doping profile with a portion located deeper in the substrate having a higher doping concentration than a portion located shallower in the substrate. The lateral MOSFET is drain-centric, with the source region and a dielectric-filled trench surrounding the drain region.Type: ApplicationFiled: September 10, 2010Publication date: January 20, 2011Applicants: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Richard K. Williams, Donald Ray Disney, Wai Tien Chan
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Patent number: 7868414Abstract: A bipolar transistor is formed in an isolation structure comprising a floor isolation region, a dielectric filled trench above the floor isolation region and a sidewall isolation region extending downward from the bottom of the trench to the floor isolation region. This structure provides a relatively deep isolated pocket in a semiconductor substrate while limiting the depth of the trench that must be etched in the substrate.Type: GrantFiled: December 17, 2007Date of Patent: January 11, 2011Assignees: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Richard K. Williams, Donald Ray Disney, Wai Tien Chan
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Patent number: 7829944Abstract: A high-voltage transistor with a low specific on-state resistance and that supports high voltage in the off-state includes one or more source regions disposed adjacent to a multi-layered extended drain structure which comprises extended drift regions separated from field plate members by one or more dielectric layers. With the field plate members at the lowest circuit potential, the transistor supports high voltages applied to the drain in the off-state. The layered structure may be fabricated in a variety of orientations. A MOSFET structure may be incorporated into the device adjacent to the source region, or, alternatively, the MOSFET structure may be omitted to produce a high-voltage transistor structure having a stand-alone drift region.Type: GrantFiled: August 30, 2004Date of Patent: November 9, 2010Assignee: Power Integrations, Inc.Inventor: Donald Ray Disney
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Patent number: 7825488Abstract: A variety of isolation structures for semiconductor substrates include a trench formed in the substrate that is filled with a dielectric material or filled with a conductive material and lined with a dielectric layer along the walls of the trench. The trench may be used in combination with doped sidewall isolation regions. Both the trench and the sidewall isolation regions may be annular and enclose an isolated pocket of the substrate. The isolation structures are formed by modular implant and etch processes that do not include significant thermal processing or diffusion of dopants so that the resulting structures are compact and may be tightly packed in the surface of the substrate.Type: GrantFiled: May 31, 2006Date of Patent: November 2, 2010Assignees: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Richard K. Williams, Donald Ray Disney, Wai Tien Chan
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Patent number: 7812393Abstract: All low-temperature processes are used to fabricate a variety of semiconductor devices in a substrate the does not include an epitaxial layer. The devices include a non-isolated lateral DMOS, a non-isolated extended drain or drifted MOS device, a lateral trench DMOS, an isolated lateral DMOS, JFET and depletion-mode devices, and P-N diode clamps and rectifiers and junction terminations. Since the processes eliminate the need for high temperature processing and employ “as-implanted” dopant profiles, they constitute a modular architecture which allows devices to be added or omitted to the IC without the necessity of altering the processes used to produce the remaining devices.Type: GrantFiled: November 5, 2007Date of Patent: October 12, 2010Assignee: Advanced Analogic Technologies, Inc.Inventors: Richard K. Williams, Donald Ray Disney, Jun-Wei Chen, Wai Tien Chan, HyungSik Ryu
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Patent number: 7800198Abstract: A variety of isolation structures for semiconductor substrates include a trench formed in the substrate that is filled with a dielectric material or filled with a conductive material and lined with a dielectric layer along the walls of the trench. The trench may be used in combination with doped sidewall isolation regions. Both the trench and the sidewall isolation regions may be annular and enclose an isolated pocket of the substrate. The isolation structures are formed by modular implant and etch processes that do not include significant thermal processing or diffusion of dopants so that the resulting structures are compact and may be tightly packed in the surface of the substrate.Type: GrantFiled: July 30, 2008Date of Patent: September 21, 2010Assignees: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Richard K. Williams, Donald Ray Disney, Wai Tien Chan
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Patent number: 7795681Abstract: A lateral MOSFET formed in a substrate of a first conductivity type includes a gate formed atop a gate dielectric layer over a surface of the substrate, a drain region of a second conductivity type, a source region of a second conductivity type, and a body region of the first conductivity type which extends under the gate. The body region may have a non-monotonic vertical doping profile with a portion located deeper in the substrate having a higher doping concentration than a portion located shallower in the substrate. The lateral MOSFET may be drain-centric, with the source region and an optional dielectric-filled trench surrounding the drain region.Type: GrantFiled: December 17, 2007Date of Patent: September 14, 2010Assignees: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Richard K. Williams, Donald Ray Disney, Wai Tien Chan
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Patent number: 7791132Abstract: A high-voltage transistor includes first and second trenches that define a mesa in a semiconductor substrate. First and second field plate members are respectively disposed in the first and second trenches, with each of the first and second field plate members being separated from the mesa by a dielectric layer. The mesa includes a plurality of sections, each section having a substantially constant doping concentration gradient, the gradient of one section being at least 10% greater than the gradient of another section. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: GrantFiled: January 4, 2010Date of Patent: September 7, 2010Assignee: Power Integrations, Inc.Inventors: Sujit Banerjee, Donald Ray Disney
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Patent number: 7786533Abstract: A high-voltage transistor includes a drain, a source, and one or more drift regions extending from the drain toward the source. A field plate member laterally surrounds the drift regions and is insulated from the drift regions by a dielectric layer. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).Type: GrantFiled: February 3, 2005Date of Patent: August 31, 2010Assignee: Power Integrations, Inc.Inventor: Donald Ray Disney
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Patent number: 7759731Abstract: A lateral trench MOSFET includes a trench containing a device segment and a gate bus segment. The gate bus segment of the trench is contacted by a conductive plug formed in a dielectric layer overlying the substrate, thereby avoiding the need for the conventional surface polysilicon bridge layer. The conductive plug is formed in a substantially vertical hole in the dielectric layer. The gate bus segment may be wider than the device segment of the trench. A method includes forming a shallow trench isolation (STI) while the conductive material in the trench is etched.Type: GrantFiled: August 28, 2006Date of Patent: July 20, 2010Assignees: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Donald Ray Disney, Cho Chiu Ma
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Patent number: 7759200Abstract: A lateral trench MOSFET includes a trench containing a device segment and a gate bus segment. The gate bus segment of the trench is contacted by a conductive plug formed in a dielectric layer overlying the substrate, thereby avoiding the need for the conventional surface polysilicon bridge layer. The conductive plug is formed in a substantially vertical hole in the dielectric layer. The gate bus segment may be wider than the device segment of the trench. A method includes forming a shallow trench isolation (STI) while the conductive material in the trench is etched.Type: GrantFiled: April 29, 2009Date of Patent: July 20, 2010Assignees: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Donald Ray Disney, Cho Chiu Ma
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Patent number: 7745291Abstract: A method for fabricating a high-voltage transistor with an extended drain region includes forming in a semiconductor substrate of a first conductivity type, first and second trenches that define a mesa having respective first and second sidewalls partially filling each of the trenches with a dielectric material that covers the first and second sidewalls. The remaining portions of the trenches are then filled with a conductive material to form first and second field plates. Source and body regions are formed in an upper portion of the mesa, with the body region separating the source from a lower portion of the mesa. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).Type: GrantFiled: May 29, 2007Date of Patent: June 29, 2010Assignee: Power Integrations, Inc.Inventor: Donald Ray Disney
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Patent number: 7737526Abstract: An isolation structure for a semiconductor device comprises a floor isolation region, a dielectric filled trench above the floor isolation region and a sidewall isolation region extending downward from the bottom of the trench to the floor isolation region. This structure provides a relatively deep isolated pocket in a semiconductor substrate while limiting the depth of the trench that must be etched in the substrate. A MOSFET is formed in the isolated pocket.Type: GrantFiled: December 17, 2007Date of Patent: June 15, 2010Assignees: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Richard K. Williams, Donald Ray Disney, Wai Tien Chan
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Patent number: 7738224Abstract: An Electro-Static Discharge (ESD) protection device is formed in an isolated region of a semiconductor substrate. The ESD protection device may be in the form of a MOS or bipolar transistor or a diode. The isolation structure may include a deep implanted floor layer and one or more implanted wells that laterally surround the isolated region. The isolation structure and ESD protection devices are fabricated using a modular process that includes virtually no thermal processing. Since the ESD device is isolated, two or more ESD devices may be electrically “stacked” on one another such that the trigger voltages of the devices are added together to achieve a higher effective trigger voltage.Type: GrantFiled: September 30, 2008Date of Patent: June 15, 2010Assignees: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Donald Ray Disney, Jun-Wei Chen, Richard K. Williams, HyungSik Ryu, Wai Tien Chan
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Patent number: 7719054Abstract: All low-temperature processes are used to fabricate a variety of semiconductor devices in a substrate the does not include an epitaxial layer. The devices include a non-isolated lateral DMOS, a non-isolated extended drain or drifted MOS device, a lateral trench DMOS, an isolated lateral DMOS, JFET and depletion-mode devices, and P-N diode clamps and rectifiers and junction terminations. Since the processes eliminate the need for high temperature processing and employ “as-implanted” dopant profiles, they constitute a modular architecture which allows devices to be added or omitted to the IC without the necessity of altering the processes used to produce the remaining devices.Type: GrantFiled: May 31, 2006Date of Patent: May 18, 2010Assignees: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Richard K. Williams, Donald Ray Disney, Jun-Wei Chen, Wai Tien Chan, HyungSik Ryu
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Publication number: 20100109077Abstract: A high-voltage transistor includes first and second trenches that define a mesa in a semiconductor substrate. First and second field plate members are respectively disposed in the first and second trenches, with each of the first and second field plate members being separated from the mesa by a dielectric layer. The mesa includes a plurality of sections, each section having a substantially constant doping concentration gradient, the gradient of one section being at least 10% greater than the gradient of another section. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: ApplicationFiled: January 4, 2010Publication date: May 6, 2010Applicant: Power Integrations, Inc.Inventors: Sujit Banerjee, Donald Ray Disney
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Patent number: 7701033Abstract: A variety of isolation structures for semiconductor substrates include a trench formed in the substrate that is filled with a dielectric material or filled with a conductive material and lined with a dielectric layer along the walls of the trench. The trench may be used in combination with doped sidewall isolation regions. Both the trench and the sidewall isolation regions may be annular and enclose an isolated pocket of the substrate. The isolation structures are formed by modular implant and etch processes that do not include significant thermal processing or diffusion of dopants so that the resulting structures are compact and may be tightly packed in the surface of the substrate.Type: GrantFiled: July 30, 2008Date of Patent: April 20, 2010Assignees: Advanced Analogic Technologies, Inc., Advanced Analogic Technologies (Hong Kong) LimitedInventors: Richard K. Williams, Donald Ray Disney, Wai Tien Chan
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Patent number: 7683426Abstract: All low-temperature processes are used to fabricate a variety of semiconductor devices in a substrate the does not include an epitaxial layer. The devices include a non-isolated lateral DMOS, a non-isolated extended drain or drifted MOS device, a lateral trench DMOS, an isolated lateral DMOS, JFET and depletion-mode devices, and P-N diode clamps and rectifiers and junction terminations. Since the processes eliminate the need for high temperature processing and employ “as-implanted” dopant profiles, they constitute a modular architecture which allows devices to be added or omitted to the IC without the necessity of altering the processes used to produce the remaining devices.Type: GrantFiled: November 5, 2007Date of Patent: March 23, 2010Assignee: Advanced Analogic Technologies, Inc.Inventors: Richard K. Williams, Donald Ray Disney